Abstract: Techniques regarding manufacturing one or more digital product designs are provided. For example, one or more embodiments described herein can include a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a user interface component that generates a manufacturability report regarding a product design in relation to a manufacturing process. The manufacturability report can indicate whether a product feature included in the product design is permissible based on a plurality of manufacturing considerations associated with the manufacturing process.

Abstract: Techniques regarding manufacturing one or more digital product designs are provided. For example, one or more embodiments described herein can include a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a user interface component that generates a manufacturability report regarding a product design in relation to a manufacturing process. The manufacturability report can indicate whether a product feature included in the product design is permissible based on a plurality of manufacturing considerations associated with the manufacturing process.

Abstract: Techniques regarding manufacturing one or more digital product designs are provided. For example, one or more embodiments described herein can include a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a user interface component that generates a manufacturability report regarding a product design in relation to a manufacturing process. The manufacturability report can indicate whether a product feature included in the product design is permissible based on a plurality of manufacturing considerations associated with the manufacturing process.

Abstract: In a particular embodiment, a method of forming integrated circuit components is provided. A first photomask is formed, the first photomask including a first mask component having a first geometry corresponding to a first type of integrated circuit component. A first lithography process is performed to transfer the first geometry of the first mask component of the first photomask to a first location on a first die on a semiconductor wafer to form a first integrated circuit component of the first type of integrated circuit component on the first die. A second lithography process is performed to transfer the first geometry of the first mask component of the first photomask to a second location on the first die on the semiconductor wafer to form a second integrated circuit component of the first type of integrated circuit component on the first die.