Abstract: A shroud assembly for a gas turbine engine includes a plurality of shroud segments that are attached to a shroud support with an inter-segment joint defined between shroud segments. The shroud assembly also includes a cooling flow path cooperatively defined by the shroud support and the first shroud segment. The cooling flow path includes an internal cooling passage within the shroud segments. The cooling flow path includes an outlet chamber configured to receive flow from the internal cooling passage. The shroud assembly additionally includes a seal arrangement that extends across the inter-segment joint. The seal arrangement, the first shroud segment, and the second shroud segment cooperatively define a seal chamber that is enclosed.

Abstract: A shroud assembly for a gas turbine engine includes a shroud support and a plurality of shroud segments that are attached to the shroud support. The shroud segment includes an internal cooling passage.

Abstract: A turbine shroud assembly includes a shroud support and a shroud segment. The shroud support structure includes a forward support rail and an aft support rail. The forward support rail includes forward first engagement structures and the aft support rail includes aft first engagement structures. The shroud segment includes a forward segment rail and an aft segment rail. The forward segment rail includes forward second engagement structures positioned on a forward segment rail periphery and the aft segment rail includes second engagement structures positioned on an aft segment rail periphery. The forward first engagement structures radially and circumferentially engage with the forward second engagement structures and the aft first engagement structures radially and circumferentially engage with the aft second engagement structures to radially and circumferentially interlock the shroud segment to the shroud support structure.

Abstract: A shroud assembly for a gas turbine engine includes a shroud support and a plurality of shroud segments that are attached to the shroud support. The shroud segment includes an internal cooling passage.

Abstract: A shroud assembly for a gas turbine engine includes a plurality of shroud segments that are attached to a shroud support with an inter-segment joint defined between shroud segments. The shroud assembly also includes a cooling flow path cooperatively defined by the shroud support and the first shroud segment. The cooling flow path includes an internal cooling passage within the shroud segments. The cooling flow path includes an outlet chamber configured to receive flow from the internal cooling passage. The shroud assembly additionally includes a seal arrangement that extends across the inter-segment joint. The seal arrangement, the first shroud segment, and the second shroud segment cooperatively define a seal chamber that is enclosed.

Abstract: A shroud assembly for a gas turbine engine includes a plurality of shroud segments that are attached to a shroud support with an inter-segment joint defined between shroud segments. The shroud assembly also includes a cooling flow path cooperatively defined by the shroud support and the first shroud segment. The cooling flow path includes an internal cooling passage within the shroud segments. The cooling flow path includes an outlet chamber configured to receive flow from the internal cooling passage. The shroud assembly additionally includes a seal arrangement that extends across the inter-segment joint. The seal arrangement, the first shroud segment, and the second shroud segment cooperatively define a seal chamber that is enclosed.

Abstract: A turbine shroud assembly includes a shroud support and a shroud segment. The shroud support structure includes a forward support rail and an aft support rail. The forward support rail includes forward first engagement structures and the aft support rail includes aft first engagement structures. The shroud segment includes a forward segment rail and an aft segment rail. The forward segment rail includes forward second engagement structures positioned on a forward segment rail periphery and the aft segment rail includes second engagement structures positioned on an aft segment rail periphery. The forward first engagement structures radially and circumferentially engage with the forward second engagement structures and the aft first engagement structures radially and circumferentially engage with the aft second engagement structures to radially and circumferentially interlock the shroud segment to the shroud support structure.

Abstract: Embodiments of an impeller shroud support for disposition around an impeller are provided, as are embodiments of gas turbine engine including impeller shroud supports. In one embodiment, the impeller shroud support includes a shroud body, a support arm joined to and extending around the shroud body, and a plurality of Mid-Impeller Bleed (MIB) flow passages. Each MIB flow passage includes, in turn, an inlet formed in the shroud body and configured to receive bleed air extracted from the impeller, a throat portion, an outlet formed in the support arm and through which the bleed air is discharged, and a curved intermediate section between the inlet and the outlet. During usage of the impeller shroud support, the curved intermediate section turns the bleed air flowing through the MIB passage in a radially outward direction prior to discharge from the outlet of the MIB flow passage.

Abstract: A shroud assembly for a gas turbine engine includes a shroud support and a plurality of shroud segments that are attached to the shroud support. The shroud segment includes an internal cooling passage.

Abstract: A shroud assembly for a gas turbine engine includes a plurality of shroud segments that are attached to a shroud support with an inter-segment joint defined between shroud segments. The shroud assembly also includes a cooling flow path cooperatively defined by the shroud support and the first shroud segment. The cooling flow path includes an internal cooling passage within the shroud segments. The cooling flow path includes an outlet chamber configured to receive flow from the internal cooling passage. The shroud assembly additionally includes a seal arrangement that extends across the inter-segment joint. The seal arrangement, the first shroud segment, and the second shroud segment cooperatively define a seal chamber that is enclosed.

Abstract: Embodiments of an impeller shroud support for disposition around an impeller are provided, as are embodiments of gas turbine engine including impeller shroud supports. In one embodiment, the impeller shroud support includes a shroud body, a support arm joined to and extending around the shroud body, and a plurality of Mid-Impeller Bleed (MIB) flow passages. Each MIB flow passage includes, in turn, an inlet formed in the shroud body and configured to receive bleed air extracted from the impeller, a throat portion, an outlet formed in the support arm and through which the bleed air is discharged, and a curved intermediate section between the inlet and the outlet. During usage of the impeller shroud support, the curved intermediate section turns the bleed air flowing through the MIB passage in a radially outward direction prior to discharge from the outlet of the MIB flow passage.

Abstract: In one embodiment, a method for forming a molded flat pack style package includes attaching electronic chips to an array lead frame, which includes a plurality of elongated flag portions with tab portions and a plurality of leads. The method further includes connecting the electronic chips to specific leads, and then molding the array lead frame while leaving portions of the leads exposed to form a molded array structure. The molded array structure is then separated to provide molded flat pack style packages having exposed leads for insertion mount and exposed tab portions. In an alternative embodiment, the separation step produces a no-lead configuration with exposed tab portions.

Abstract: In an exemplary embodiment, a packaged device having enhanced thermal dissipation characteristics includes a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged device further includes a conductive clip for coupling the major current carrying electrode to a next level of assembly, and a heat spreader device formed on or integral with the conductive clip. A portion of the heat spreader device may be optionally exposed.

Abstract: In one embodiment, a method for forming a molded flat pack style package includes attaching electronic chips to an array lead frame, which includes a plurality of elongated flag portions with tab portions and a plurality of leads. The method further includes connecting the electronic chips to specific leads, and then molding the array lead frame while leaving portions of the leads exposed to form a molded array structure. The molded array structure is then separated to provide molded flat pack style packages having exposed leads for insertion mount and exposed tab portions. In an alternative embodiment, the separation step produces a no-lead configuration with exposed tab portions.

Abstract: In one embodiment, a method for forming a molded flat pack style package includes attaching electronic chips to an array lead frame, which includes a plurality of elongated flag portions with tab portions and a plurality of leads. The method further includes connecting the electronic chips to specific leads, and then molding the array lead frame while leaving portions of the leads exposed to form a molded array structure. The molded array structure is then separated to provide molded flat pack style packages having exposed leads for insertion mount and exposed tab portions. In an alternative embodiment, the separation step produces a no-lead configuration with exposed tab portions.

Abstract: In an exemplary embodiment, a packaged device having enhanced thermal dissipation characteristics includes a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged device further includes a conductive clip for coupling the major current carrying electrode to a next level of assembly, and a heat spreader device formed on or integral with the conductive clip. A portion of the heat spreader device may be optionally exposed.