Patents by Inventor Kent Liao

Kent Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of eliminating a shallow trench isolation divot
    Patent number: 6391739
    Abstract: A process of fabricating a shallow trench isolation structure includes the steps of: providing a substrate; forming a first insulating layer over the substrate; forming a nitride masking layer over the first insulating layer; patterning and etching the nitride masking layer, the first insulating layer and the substrate to remove portions of the nitride masking layer, the first insulating layer and the substrate thereby forming an exposed trench in the substrate, the trench substantially defining boundaries of the isolation structure; depositing a second insulating layer into the trench and over the nitride masking layer; planarizing the second insulating layer to expose the nitride masking layer; removing the nitride masking layer to expose the first insulating layer, and forming a divot proximate an edge of the trench; depositing a silicon layer into the divot, and over the first insulating later and the second insulating layer; etching the silicon layer to expose the first insulating layer, a central portio
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: May 21, 2002
    Assignee: Mosel Vitelic, Inc.
    Inventor: Kent Liao
  • Method for using oxygen plasma treatment on a dielectric layer
    Patent number: 5883015
    Abstract: The method for depositing a dielectric layer can be used to evenly deposit the dielectric layer to be applied to a semiconductor device.
    Type: Grant
    Filed: July 3, 1997
    Date of Patent: March 16, 1999
    Assignee: Mosel Vitelic Inc.
    Inventors: Kent Liao, Dinos Huang, Tuby Tu, Kuang-Chao Chen, Wen-Doe Su