Abstract: A device for providing electrostatic discharge (ESD) protection includes circuitry configured to detect an occurrence of an ESD event at one or more voltage rails. An ESD clamp is activated via a clamp triggering path to provide a discharge path for an ESD current. A gate voltage of the ESD clamp is maintained greater than a predetermined threshold via a holding path in parallel with the clamp triggering path.

Abstract: Aspects of a method and system for mitigating risk of electrostatic discharge in a system on chip are provided. In this regard, for an IC comprising a plurality of portions electrically isolated from one another within the IC, ESD current may be routed via one or more paths within and/or on a package to which the IC is bonded. The one or more paths may electrically couple two or more of the portions of the IC. The one or more paths may have low impedance at DC and high impedance at one or more frequencies utilized in the integrated circuit. One of the portions of the IC may be a ground plane for RF circuitry. One of the portions of the IC may be a ground plane for digital circuitry. The one or more paths may be fabricated in one or more metal layers of said package.

Abstract: Aspects of a method and system for mitigating risk of electrostatic discharge in a system on chip are provided. In this regard, for an IC comprising a plurality of portions electrically isolated from one another within the IC, ESD current may be routed via one or more paths within and/or on a package to which the IC is bonded. The one or more paths may electrically couple two or more of the portions of the IC. The one or more paths may have low impedance at DC and high impedance at one or more frequencies utilized in the integrated circuit. One of the portions of the IC may be a ground plane for RF circuitry. One of the portions of the IC may be a ground plane for digital circuitry. The one or more paths may be fabricated in one or more metal layers of said package.

Abstract: Systems and methods are disclosed for operating a core circuitry of an integrated circuit at a lower voltage than the coupled IO circuitry using a tolerant circuit. In one embodiment includes a voltage tolerant circuit comprising a voltage detect module adapted to detect when a voltage is sufficient to switch bias conditions without violating maximum transistor operating conditions and a comparator adapted to detect when a PAD voltage is greater than an IO power supply voltage.

Abstract: Systems and methods are disclosed for reducing or eliminating hot carrier injection stress in circuits. In one embodiment, the present invention relates to an integrated circuit comprising an IO PAD, an output circuit coupled to at least the IO PAD and a stress circuit. The stress circuit is coupled to at least the output circuit and is adapted to limit a high voltage across the output circuit when the output circuit is enabled, thereby reducing stress on the output circuit. In one embodiment, the stress circuit comprises at least one transistor device (a p-channel device or two stacked p-channel devices, for example) and the output circuit comprises a transistor device (an n-channel device or two stacked n-channel devices).

Abstract: Systems and methods are disclosed for operating a core circuitry of an integrated circuit at a lower voltage than the coupled IO circuitry using a tolerant circuit. In one embodiment includes a voltage tolerant circuit comprising a voltage detect module adapted to detect when a voltage is sufficient to switch bias conditions without violating maximum transistor operating conditions and a comparator adapted to detect when a PAD voltage is greater than an IO power supply voltage.

Abstract: Systems and methods are disclosed for operating a core circuitry of an integrated circuit at a lower voltage than the coupled IO circuitry using a tolerant circuit. In one embodiment includes a voltage tolerant circuit comprising a voltage detect module adapted to detect when a voltage is sufficient to switch bias conditions without violating maximum transistor operating conditions and a comparator adapted to detect when a PAD voltage is greater than an IO power supply voltage.

Abstract: Systems and methods are disclosed for reducing or eliminating hot carrier injection stress in circuits. In one embodiment, the present invention relates to an integrated circuit comprising an IO PAD, an output circuit coupled to at least the IO PAD and a stress circuit. The stress circuit is coupled to at least the output circuit and is adapted to limit a high voltage across the output circuit when the output circuit is enabled, thereby reducing stress on the output circuit. In one embodiment, the stress circuit comprises at least one transistor device (a p-channel device or two stacked p-channel devices, for example) and the output circuit comprises a transistor device (an n-channel device or two stacked n-channel devices).

Abstract: Systems and methods are disclosed for operating a core circuitry of an integrated circuit at a lower voltage than the coupled IO circuitry using a tolerant circuit. In one embodiment includes a voltage tolerant circuit comprising a voltage detect module adapted to detect when a voltage is sufficient to switch bias conditions without violating maximum transistor operating conditions and a comparator adapted to detect when a PAD voltage is greater than an IO power supply voltage.