Patents by Inventor Kent T. McDaniel

Kent T. McDaniel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9185828
    Abstract: A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 10, 2015
    Assignee: Cray Inc.
    Inventors: Corey Knudsen, Kent T. McDaniel, Bradley J. Smith, Gregory W. Pautsch, Eric D. Lakin
  • Publication number: 20130301219
    Abstract: A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.
    Type: Application
    Filed: March 15, 2013
    Publication date: November 14, 2013
    Inventors: Corey Knudsen, Kent T. McDaniel, Bradley J. Smith, Gregory W. Pautsch, Eric D. Lakin
  • Patent number: 6366461
    Abstract: A system and method for cooling individual electronic components utilizes individual manifolds to create individual flows of a negatively pressurized cooling fluid. This permits components with significantly different cooling loads to be located immediately adjacent each other on a circuit board, but without loss of space and computation time efficiencies, because cooling the components individually avoids heat generated by each component from adversely affecting the performance of the cooling system for adjacent components. A heat sink can be coupled to the components for increased heat transfer, and a preferred design of heat sink both dissipates heat and directs the flow of the fluid in an optimum manner.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: April 2, 2002
    Assignee: Silicon Graphics, Inc.
    Inventors: Gregory W. Pautsch, Kent T. McDaniel, Eric Dwayne Lakin, James Joseph Jirak
  • Patent number: 6116915
    Abstract: An information handling system includes stacks of printed circuit boards interconnected using an interconnection system. The printed circuit boards include network boards, system interface boards, memory boards, and central processing unit boards. The interconnection system for electrically connecting the various printed circuit boards includes a set of interconnection modules placed adjacent one another to form a substantially aligned row. The interconnection modules can be used to connect one stack to an orthogonally oriented stack or to a parallel oriented stack. The printed circuit board used in the interconnection system includes an inner rail positioned near the edge of the printed circuit board, an outer rail positioned near the edge of the printed circuit board, and an alignment stop attached to or positioned near one of the inner or outer rail. The most distant interconnection module of a row of aligned modules includes a spring attached thereto.
    Type: Grant
    Filed: September 9, 1997
    Date of Patent: September 12, 2000
    Assignee: Cray Research, Inc.
    Inventors: Kent T. McDaniel, Bradley J. Smith, Gregory David Spanier
  • Patent number: 5211565
    Abstract: The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.
    Type: Grant
    Filed: March 19, 1992
    Date of Patent: May 18, 1993
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, Carl D. Breske, David J. Johnson, David R. Kiefer, Kent T. McDaniel, William T. Moore, Jr., Michael R. Edwards, Bricky A. Stephenson, Anthony A. Vacca
  • Patent number: 5194710
    Abstract: An apparatus and method of making a beam of directed energy used to bond leads to bonding areas is disclosed. The masking tool preferably includes a groove adapted to allow the beam to strike the lead while masking the surrounding substrate to prevent damage to it. The tool preferably reflects the energy striking it away from the substrate. The method can include the use of an external heat source to provide heat to the bonding process or, in the alternative, provide heat sinking to protect the electrical components from heat damage. Alternate embodiments of the tool can include a plurality of grooves or slots to allow scanning of the beam in the bonding process.
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: March 16, 1993
    Assignee: Cray Research, Inc.
    Inventors: Kent T. McDaniel, David J. Johnson, Nicholas J. Krajewski, David W. LeMay
  • Patent number: 5167511
    Abstract: The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.
    Type: Grant
    Filed: November 27, 1990
    Date of Patent: December 1, 1992
    Assignee: Cray Research, Inc.
    Inventors: Nicholas J. Krajewski, Carl D. Breske, David J. Johnson, David R. Kiefer, Kent T. McDaniel, William T. Moore, Jr., Michael R. Edwards, Bricky A. Stephenson, Anthony A. Vacca