Abstract: In a coil device of a power conversion device, a laminated coil includes planar coils laminated on a surface of a support. A plurality of cores are spaced apart from each other and aligned in a longitudinal direction of the planar coils, and each core includes a portion around which the laminated coil is wound on the surface of the support. A first protruding member (is arranged between a pair of cores adjacent to each other with respect to a longitudinal direction and is fixed to the support. A first fixing member is arranged above the first protruding member. The laminated coil is sandwiched and fixed between the first fixing member and the first protruding member such that a first surface is in contact with the first protruding member and a second surface is in contact with the first fixing member.

Abstract: An isolated converter reduced in size compared with a conventional isolated converter and having a high heat dissipation characteristic is provided. The isolated converter includes a multilayer substrate having a first through hole and a magnetic core partially passing through the first through hole. The multilayer substrate includes a first conductor pattern formed at a position overlapping the magnetic core on a second surface when viewed from a direction orthogonal to a first surface, a second conductor pattern formed between the first surface and the second surface at a position overlapping the magnetic core and the first conductor pattern when viewed from the direction orthogonal to the first surface, at least one thermal conductive member formed on the first conductor pattern and having a portion disposed between the multilayer substrate and the magnetic core, and an electric insulating layer electrically insulating the first conductor pattern from the second conductor pattern.

Abstract: A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.

Abstract: There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting can be suppressed even when a fuse portion is melted by an excessive current and in which it is made possible that heat generated in the fuse portion is less likely to be transferred to the electric power semiconductor device. The electric-power conversion apparatus includes a fuse portion formed in an electrode wiring member, a fuse resin member that covers the fuse portion, and a sealing resin member that seals an electric power semiconductor device and the fuse portion in a case.

Abstract: A circuit device includes a core, a first circuit board, a second circuit board, a heat dissipation member, a first heat transfer member, and a second heat transfer member. The first circuit board includes a first coil pattern surrounding at least a part of the core. The second circuit board includes a second coil pattern surrounding at least a part of the core. The first heat transfer member is in surface contact with the first circuit board and the heat dissipation member. The second heat transfer member is in surface contact with the first circuit board and the second circuit board.

Abstract: A laser processing apparatus includes a laser oscillator; a processing head; a driver that controls a relative positional relationship between a workpiece and the processing head; control circuitry that controls the laser oscillator and the driver in order for the laser beam to scan a processing path on the workpiece; detection circuitry that observes a state of the workpiece being processed and outputs a result of observation as a time series signal; processed state observation circuitry that obtains evaluation information including a determination result that indicates whether a processed state of the workpiece is satisfactory or defective by evaluating the processed state of the workpiece on the basis of the time series signal for each of a plurality of sections obtained by dividing the processing path; and estimation circuitry that estimates a cause of a defect on the basis of the evaluation information of two or more of the sections.

Abstract: Obtained is a power conversion device including a small-sized and low-cost fuse portion which allows overcurrent to be assuredly interrupted when being applied and allows a semiconductor element to be protected from a short-circuit fault or the like. The power conversion device includes: a circuit board; a semiconductor element mounted on the circuit board; a snubber capacitor; a snubber circuit wire which connects the snubber capacitor in parallel to the semiconductor element; and a fuse portion formed at a part of the snubber circuit wire.

Abstract: A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.

Abstract: A printed board includes an insulating layer, and radiation vias penetrating printed board are formed in both a first region overlapping electronic component and a second region outside the first region. A plurality of conductor layers included in printed board are cross-connected to a plurality of radiation vias. Diffusion radiator includes a thermal diffusion plate, a radiation member, and a cooling body. Radiation member is in close contact with one of main surfaces of cooling body, and thermal diffusion plate is in close contact with one of main surfaces of radiation member on the opposite side to cooling body. One of main surfaces of thermal diffusion plate on the opposite side to radiation member is bonded to a conductor layer on the other main surface of printed board so as to close the plurality of radiation vias.

Abstract: In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.

Abstract: The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.

Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Abstract: A power conversion device that provides high heat dissipation and is easy to assemble. A power conversion device includes: a first heat dissipator; a second heat dissipator; a printed board having a first circuit pattern formed thereon; a first insulating member provided between first heat dissipator and printed board; a switching element including an electrode portion electrically bonded to first circuit pattern with a first bonding member interposed therebetween; a first fixing member bonded to an exposed surface of electrode portion; a heat dissipating member having one end bonded to first fixing member, and the other end provided between the switching element and second heat dissipator; a second insulating member sandwiched between second heat dissipator and switching element; and an installation portion.

Abstract: A power converting device such that an overcurrent is interrupted and damage to a power semiconductor element can be prevented is obtained. The power converting device includes a power semiconductor element, a wiring member connected to an electrode of the power semiconductor element, a bus bar that supplies power to the power semiconductor element, and a frame that houses the power semiconductor element, wherein the bus bar has a connection terminal connected to the wiring member, and a fuse portion is provided in the connection terminal.

Abstract: There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting can be suppressed even when a fuse portion is melted by an excessive current and in which it is made possible that heat generated in the fuse portion is less likely to be transferred to the electric power semiconductor device. The electric-power conversion apparatus includes a fuse portion formed in an electrode wiring member, a fuse resin member that covers the fuse portion, and a sealing resin member that seals an electric power semiconductor device and the fuse portion in a case.

Abstract: There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting between a melted material and a peripheral member can be suppressed even when a fuse portion is melted by an excessive current. An electric-power conversion apparatus (1) includes an electric power semiconductor device (14), an electrode wiring member (13), a case (30), a fuse portion (16) formed in the electrode wiring member (13), a fuse resin member (26) disposed between the fuse portion (16) and the case (30), and a sealing resin member (25) that seals the electric power semiconductor device (14), the electrode wiring member (13), the fuse portion (16), and the fuse resin member (26) in the case (30).

Abstract: A servo control device controls a combined position of a first servo system and a second servo system having higher response than response of the first servo system. The servo control device includes a first axis target value creation unit and a correction unit. The first axis target value creation unit creates a first axis target value based on a combined command value which is a position command value of the combined position. The correction unit converts the first axis target value into a first axis command value by using a first transfer function. In addition, the correction unit converts the first axis target value by using a second transfer function, and calculates a second axis command value by subtracting the converted first axis target value from the combined command value.

Abstract: A semiconductor device includes a printed board, an electronic component, and a thermal diffuser. The electronic component and the thermal diffuser are bonded onto one main surface of the printed board. The electronic component and the thermal diffuser are electrically and thermally bonded to each other by a bonding material. The printed board includes an insulating layer and a plurality of radiation vias penetrating from the main surface to the other main surface of the printed board. At least a part of the plurality of radiation vias overlaps the electronic component, and at least another part of the plurality of radiation vias overlaps the thermal diffuser. At least a part of the plurality of radiation vias is disposed so as to overlap a heat radiator at a transmission viewpoint from the main surface of the printed board.

Abstract: In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.

Abstract: A power converting device such that an overcurrent is interrupted and damage to a power semiconductor element can be prevented is obtained. The power converting device includes a power semiconductor element, a wiring member connected to an electrode of the power semiconductor element, a bus bar that supplies power to the power semiconductor element, and a frame that houses the power semiconductor element, wherein the bus bar has a connection terminal connected to the wiring member, and a fuse portion is provided in the connection terminal.