Patents by Inventor Kenta Fukuda

Kenta Fukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111951
    Abstract: In an approach for generating a user-specific personal corpus, a processor creates a basic corpus for a first user using a first set of data sources, wherein the basic corpus includes one or more basic words and one or more vectors of the one or more basic words. A processor extracts a set of text from a second set of data sources associated with the first user. Responsive to finding an unknown word included in the set of text extracted, a processor updates the basic corpus, wherein the basic corpus is updated by replacing a vector of the unknown word with an average vector of the one or more basic words in the basic corpus created and registering the unknown word in a first personal corpus.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: KENTA WATANABE, Takahito Tashiro, Takashi Fukuda, TAIHEI MIYAMOTO
  • Publication number: 20240107938
    Abstract: An electric working machine includes: a machine body; a motor mounted on the machine body and driven by electric power supplied from a battery; a working part driven by motive power of the motor to perform work; an operation part operated by a user to control the operation of the motor; and a display device disposed on the machine body and including a display. The display device is disposed to be separated forward from the operation part.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Kenta Sugitate, Kenji Fukuda, Hiroyuki Sato
  • Patent number: 10449638
    Abstract: A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: October 22, 2019
    Assignee: TAMURA CORPORATION
    Inventors: Daigo Ichikawa, Ryo Izumi, Mitsuru Iwabuchi, Nobuhiro Yamashita, Kenta Fukuda, Satoshi Okumura, Nobuo Tajima
  • Publication number: 20170282304
    Abstract: A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.
    Type: Application
    Filed: March 28, 2017
    Publication date: October 5, 2017
    Inventors: Daigo Ichikawa, Ryo Izumi, Mitsuru Iwabuchi, Nobuhiro Yamashita, Kenta Fukuda, Satoshi Okumura, Nobuo Tajima