Abstract: Systems and methods to improve photo taking using an image capture device having a wide field of view (FOV) camera. In some embodiments, when the device is held in landscape orientation, a wide diagonal FOV may be displayed to the user on a preview screen of the device, and the landscape image may be captured in a wide, 16:9 aspect ratio. However, when the device is held in portrait orientation, the effective diagonal FOV of the device may be decreased via software and/or hardware, and a 4:3 aspect ratio image may be displayed and captured. In other embodiments, the captured portrait orientation image may be scaled, shifted, and/or cropped before being displayed to the user on the device's preview display screen, in such a manner that the user will naturally be inclined to hold the device in a position that will produce a more optimal self-portrait image.

Abstract: Systems and methods to improve photo taking using an image capture device having a wide field of view (FOV) camera are described herein. In some embodiments, when the device is held in landscape orientation, a wide diagonal FOV may be displayed to the user on a preview screen of the device, and the landscape image may be captured in a wide, 16:9 aspect ratio. However, when the device is held in portrait orientation, the effective diagonal FOV of the device may be decreased via software and/or hardware, and a 4:3 aspect ratio image may be displayed and captured. In other embodiments, the captured portrait orientation image may be scaled, shifted, and/or cropped before being displayed to the user on the device's preview display screen, in such a manner that the user will naturally be inclined to hold the device in a position that will produce a more optimal self-portrait image.

Abstract: An enclosure assembly and systems and methods for using the same are disclosed. The enclosure assembly may include a base plate, a plurality of sidewalls, and one or more insulator layers disposed on the sidewalls. When coupled to a module, the enclosure assembly may least partially enclose the module to prevent the spread of EMI, to assist in heat dissipation, to protect the structural integrity of the module, and the like.

Abstract: A compact electronic device may include a camera module having an image sensor. The image sensor may be controlled by storage and processing circuitry to capture image data from received light. The camera module may include a substrate having front and rear surfaces. The image sensor may be mounted to the rear surface of the substrate. The substrate may include optical focusing structures on the front surface of the substrate that focus light through an opening in the substrate to the image sensor. A flex circuit may be used to convey signals between the camera module and other electronic device components. The flex circuit may be mounted to the front surface of the camera module substrate to help reduce total height of the camera module. The flex circuit may be mounted to an extended portion of the substrate or may be mounted to surround the periphery of the image sensor.

Abstract: An electronic device may include a camera module. Control circuitry within the electronic device may use an image sensor within the camera module to acquire digital images. The camera module may have lens structures that are supported by lens support structures such as a lens barrel and lens carrier. An actuator such as a voice coil motor may control the position of the lens support structures relative to internal support structures such as upper and lower spacer members. Springs may be used to couple the lens support structures to the internal support structures. Outer wall structures in the camera module such as a ferromagnetic shield structures may surround and enclose at least some of the internal support structures. The outer wall structures may have openings. The internal support structures may have pins or other alignment structures that protrude through the openings.

Abstract: A compact electronic device may include a camera module having an image sensor. The image sensor may be controlled by storage and processing circuitry to capture image data from received light. The camera module may include a substrate having front and rear surfaces. The image sensor may be mounted to the rear surface of the substrate. The substrate may include optical focusing structures on the front surface of the substrate that focus light through an opening in the substrate to the image sensor. A flex circuit may be used to convey signals between the camera module and other electronic device components. The flex circuit may be mounted to the front surface of the camera module substrate to help reduce total height of the camera module. The flex circuit may be mounted to an extended portion of the substrate or may be mounted to surround the periphery of the image sensor.

Abstract: An enclosure assembly and systems and methods for using the same are disclosed. The enclosure assembly may include a base plate, a plurality of sidewalls, and one or more insulator layers disposed on the sidewalls. When coupled to a module, the enclosure assembly may least partially enclose the module to prevent the spread of EMI, to assist in heat dissipation, to protect the structural integrity of the module, and the like.

Abstract: An electronic device may include a camera module. Control circuitry within the electronic device may use an image sensor within the camera module to acquire digital images. The camera module may have lens structures that are supported by lens support structures such as a lens barrel and lens carrier. An actuator such as a voice coil motor may control the position of the lens support structures relative to internal support structures such as upper and lower spacer members. Springs may be used to couple the lens support structures to the internal support structures. Outer wall structures in the camera module such as a ferromagnetic shield structures may surround and enclose at least some of the internal support structures. The outer wall structures may have openings. The internal support structures may have pins or other alignment structures that protrude through the openings.