Abstract: A catheter device includes a first catheter. The first catheter includes a first catheter shaft and an operating part that is attached to a proximal end portion of the first catheter shaft and operates the first catheter shaft. The operating part includes a rotary operation section that rotates the first catheter shaft about a central axis of the first catheter shaft, and a bending operation section that bends a distal end portion of the first catheter shaft.

Abstract: A catheter includes a hollow shaft; a distal end electrode provided on a distal end portion of the hollow shaft; a proximal end electrode provided on a proximal end portion of the hollow shaft, and which is electrically connected to the distal end electrode via the hollow shaft; and a connection portion which is capable of being attached to and detached from the proximal end electrode and which, by being attached to the proximal end electrode, electrically connects an external voltage output device and the proximal end electrode via a lead wire.

Abstract: To provide a sintered body with improved impact resistance due to impact absorption through plastic deformation before brittle fracture for an impact exceeding the fracture resistance of the sintered body, and/or a method for producing the sintered body. A sintered body including: zirconia containing a stabilizer; and a region in which an impact mark is formed when an impact force is applied.

Abstract: According to one embodiment, a processing information management system includes: an abnormality analyzer configured to generate abnormality occurrence data of a target wafer based on processing location information, the processing location information collected based on a first sensor outputting a first sensor signal according to a detected processing state, the first sensor provided in a wafer processing apparatus; and an integration system configured to integrate the abnormality occurrence data into wafer map data corresponding to the target wafer.

Abstract: A sintered body that includes zirconia containing a stabilizing element; and a plastic deformation region, wherein the stabilizing element includes at least one rare-earth element other than yttrium, and the stabilizing element content is 1.5% or more by mole and less than 3.0% by mole.

Abstract: According to one embodiment, a processing information management system includes: an abnormality analyzer configured to generate abnormality occurrence data of a target wafer based on processing location information, the processing location information collected based on a first sensor outputting a first sensor signal according to a detected processing state, the first sensor provided in a wafer processing apparatus; and an integration system configured to integrate the abnormality occurrence data into wafer map data corresponding to the target wafer.