Abstract: An apparatus for removing tiebars of a lead frame after one or more semiconductor components have been molded to form a package body includes first and second removing stations. The second removing station is provided for removing scraps that may be left in between the leads after the tiebars have been removed in the first removing station. In the second removing station, the lead frame is positioned in place on a die. A scrap-cutting punch is moved relative to the die so that the projections of the punch are fitted into the corresponding holes of the die, thereby pushing the possible scraps out of the leads to the holes.