Abstract: A method of detecting a foreign object on a stage according to one aspect of the present disclosure includes acquiring first position information of a first pattern included in a first image in a reference state of a surface of the stage capable of attracting an object to be inspected; acquiring second position information of a second pattern included in a second image of the surface, the second image being obtained after obtaining the first image; and detecting one or more foreign objects on the surface by comparing the first position information and the second position information.

Abstract: A method of detecting a foreign object on a stage according to one aspect of the present disclosure includes acquiring first position information of a first pattern included in a first image in a reference state of a surface of the stage capable of attracting an object to be inspected; acquiring second position information of a second pattern included in a second image of the surface, the second image being obtained after obtaining the first image; and detecting one or more foreign objects on the surface by comparing the first position information and the second position information.

Abstract: A probe apparatus includes a stage, a first and a second imaging device, a first and a second imaging optical unit, and a projection optical unit. The stage is movable in horizontal and vertical directions. The first imaging device picks up an image of a probe needle which is made to contact with an electrode of a device formed on a surface of the substrate. The first and second imaging optical units include optical systems for performing an image pickup by using the first and second imaging devices, respectively. The second imaging device picks up an image of the electrode held on the stage. The projection optical unit includes an optical system that projects an optical target mark, used in a position alignment of the first and the second imaging device, onto each of image forming units of the first and second imaging devices at the same time.

Abstract: A method of controlling a substrate inspection apparatus, which includes a stage configured to mount a substrate thereon and move in first and second moving directions and a camera configured to photograph the stage. The method includes: calculating in each quadrant divided by X and Y axis defining a coordinate system of an image photographed by the camera, a deviation of the X axis in a rotational direction with respect to the first moving direction or a deviation of the Y axis in the rotational direction with respect to the second moving direction; correcting a position of a photographed target in the coordinate system of the image photographed by the camera based on the calculated deviation in the rotational direction; and performing an alignment of the stage based on the corrected position of the target.

Abstract: A contact position of a probe needle with respect to electrode pads 71 to 75 of a semiconductor device is inspected in advance when performing an inspection by a prober on the semiconductor device formed on a wafer W placed on a stage 11. A reticle 31 on which shapes 61 to 65 indicating positions of the probe needles are formed is placed instead of the probe needles at a position where the probe needles are arranged. The semiconductor device formed on the wafer W is imaged by the imaging unit 33 through the reticle 31. A positional relationship between the shapes formed on the reticle 31 and the electrode pads 71 to 75 is analyzed from the image. When necessary, a position of the stage 11 is adjusted such that centers of the shapes 61 to 65 and centers of the electrode pad 71 to 75 are coincident.

Abstract: A contact position of a probe needle with respect to electrode pads 71 to 75 of a semiconductor device is inspected in advance when performing an inspection by a prober on the semiconductor device formed on a wafer W placed on a stage 11. A reticle 31 on which shapes 61 to 65 indicating positions of the probe needles are formed is placed instead of the probe needles at a position where the probe needles are arranged. The semiconductor device formed on the wafer W is imaged by the imaging unit 33 through the reticle 31. A positional relationship between the shapes formed on the reticle 31 and the electrode pads 71 to 75 is analyzed from the image. When necessary, a position of the stage 11 is adjusted such that centers of the shapes 61 to 65 and centers of the electrode pad 71 to 75 are coincident.

Abstract: A probe apparatus includes a stage, a first and a second imaging device, a first and a second imaging optical unit, and a projection optical unit. The stage is movable in horizontal and vertical directions. The first imaging device picks up an image of a probe needle which is made to contact with an electrode of a device formed on a surface of the substrate. The first and second imaging optical units include optical systems for performing an image pickup by using the first and second imaging devices, respectively. The second imaging device picks up an image of the electrode held on the stage. The projection optical unit includes an optical system that projects an optical target mark, used in a position alignment of the first and the second imaging device, onto each of image forming units of the first and second imaging devices at the same time.

Abstract: A method of controlling a substrate inspection apparatus, which includes a stage configured to mount a substrate thereon and move in first and second moving directions and a camera configured to photograph the stage. The method includes: calculating in each quadrant divided by X and Y axis defining a coordinate system of an image photographed by the camera, a deviation of the X axis in a rotational direction with respect to the first moving direction or a deviation of the Y axis in the rotational direction with respect to the second moving direction; correcting a position of a photographed target in the coordinate system of the image photographed by the camera based on the calculated deviation in the rotational direction; and performing an alignment of the stage based on the corrected position of the target.