Abstract: An optical semiconductor apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a sealing structure that seals a space between the package substrate and the window member. The sealing structure includes a first metal layer provided in a shape of a frame on the top surface of the package substrate, a second metal layer provided in a shape of a frame on an inner surface of the window member, and a metal bonding part provided between the first metal layer and the second metal layer. An entirety of one of the first and second metal layers is positioned in a region where the other of the first and second metal layers is provided.

Abstract: A fluid sterilization device includes: a processing flow passage in which a fluid subject to sterilization flows; a window member provided between a light source for irradiating the fluid in the processing flow passage with ultraviolet light and the processing flow passage, the window member including an incidence surface on which the ultraviolet light from the light source is incident and an exit surface from which the ultraviolet light exits toward the processing flow passage; and a heating body provided to be in contact with the incidence surface and adapted to heat the window member.

Abstract: A fluid sterilization device includes: a processing flow passage in which a fluid subject to sterilization flows; a window member provided between a light source for irradiating the fluid in the processing flow passage with ultraviolet light and the processing flow passage, the window member including an incidence surface on which the ultraviolet light from the light source is incident and an exit surface from which the ultraviolet light exits toward the processing flow passage; and a heating body provided to be in contact with the incidence surface and adapted to heat the window member.

Abstract: An optical semiconductor apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a sealing structure that seals a space between the package substrate and the window member. The sealing structure includes a first metal layer provided in a shape of a frame on the top surface of the package substrate, a second metal layer provided in a shape of a frame on an inner surface of the window member, and a metal bonding part provided between the first metal layer and the second metal layer. An entirety of one of the first and second metal layers is positioned in a region where the other of the first and second metal layers is provided.