Patents by Inventor Kentaro Fujiura

Kentaro Fujiura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards
    Patent number: 7576288
    Abstract: A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: August 18, 2009
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Masayoshi Kondo, Masaaki Kato, Toshiaki Chuma, Satoru Nakao, Kentaro Fujiura