Patents by Inventor Kentaro FURUKI

Kentaro FURUKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing wire harness
    Patent number: 10343626
    Abstract: An objective is to provide a hitherto not-existing retention component that is for a wiring bundle and can be manufactured without tying the wiring bundle, a wire harness including the retention component, and a manufacturing method and a manufacturing device for the wire harness. A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: July 9, 2019
    Assignee: DAIWA KASEI INDUSTRY CO., LTD.
    Inventors: Kouji Kamiya, Yuusuke Ito, Makoto Suzuki, Hiroaki Suzuki, Kentaro Furuki, Masanari Ichihara
  • Method for manufacturing a wire harness
    Patent number: 9908486
    Abstract: An objective is to provide a manufacturing method and a manufacturing device for a wire harness, and the wire harness and a retention component manufactured thereby, the wire harness including a wiring bundle, a retention portion configured to retain the wiring bundle, and an engagement portion to be attached to a vehicle body, the manufacturing method and the manufacturing device being capable of efficiently manufacturing the wire harness and being applicable to engagement portions having different shapes.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: March 6, 2018
    Assignees: DAIWA KASEI INDUSTRY CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Makoto Suzuki, Yuusuke Ito, Yousuke Ogino, Kentaro Furuki
  • METHOD FOR MANUFACTURING WIRE HARNESS, WIRE HARNESS MANUFACTURING DEVICE, WIRE HARNESS, AND RETENTION COMPONENT
    Publication number: 20170246997
    Abstract: An objective is to provide a manufacturing method and a manufacturing device for a wire harness, and the wire harness and a retention component manufactured thereby, the wire harness including a wiring bundle, a retention portion configured to retain the wiring bundle, and an engagement portion to be attached to a vehicle body, the manufacturing method and the manufacturing device being capable of efficiently manufacturing the wire harness and being applicable to engagement portions having different shapes.
    Type: Application
    Filed: September 6, 2016
    Publication date: August 31, 2017
    Inventors: Makoto Suzuki, Yuusuke ITO, Yousuke Ogino, Kentaro FURUKI
  • METHOD FOR MANUFACTURING WIRE HARNESS, WIRE HARNESS MANUFACTURING DEVICE, WIRE HARNESS, AND RETENTION COMPONENT
    Publication number: 20160279670
    Abstract: An objective is to provide a hitherto not-existing retention component that is for a wiring bundle and can be manufactured without tying the wiring bundle, a wire harness including the retention component, and a manufacturing method and a manufacturing device for the wire harness. A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.
    Type: Application
    Filed: March 22, 2016
    Publication date: September 29, 2016
    Inventors: Kouji KAMIYA, Yuusuke ITO, Makoto SUZUKI, Hiroaki SUZUKI, Kentaro FURUKI, Masanari ICHIHARA