Patents by Inventor Kentaro Hayakawa

Kentaro Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRIC CONTACT AND SOCKET FOR ELECTRICAL PART
    Publication number: 20110291686
    Abstract: A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat.
    Type: Application
    Filed: August 11, 2011
    Publication date: December 1, 2011
    Applicant: Enplas Corporation
    Inventors: Takahiro Oda, Kentaro Hayakawa, Takashi Morinari
  • Electric contact and socket for electrical part
    Patent number: 8016624
    Abstract: A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: September 13, 2011
    Assignee: Enplas Corporation
    Inventors: Takahiro Oda, Kentaro Hayakawa, Takashi Morinari
  • Electric Contact and Socket for Electrical Part
    Publication number: 20080139058
    Abstract: A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat.
    Type: Application
    Filed: September 22, 2006
    Publication date: June 12, 2008
    Inventors: Takahiro Oda, Kentaro Hayakawa, Takashi Morinari
  • Electric contact and socket for electrical part
    Patent number: RE45924
    Abstract: A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: March 15, 2016
    Assignee: ENPLAS CORPORATION
    Inventors: Takahiro Oda, Kentaro Hayakawa, Takashi Morinari