Patents by Inventor Kentaro Hirai

Kentaro Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210298416
    Abstract: A sole of a shoe includes a sole body and a plurality of lower protrusions and a plurality of upper protrusions arranged at least in positions each corresponding to a forefoot in the sole body. The sole body is configured such that hardness of a portion corresponding to a midfoot is higher than hardness of a portion corresponding to the forefoot.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 30, 2021
    Inventors: Shin HIRAI, Kentaro YAHATA, Yu TAKEMURA
  • Publication number: 20210282498
    Abstract: A sole of a shoe has a plurality of lower protrusions and a plurality of upper protrusions arranged at least at a portion of the sole corresponding to a forefoot of a wearer of the shoe. A support includes a planta rest that is arranged in an internal space surrounded by a shoe upper and bridges between a position of the shoe upper corresponding to a medial side of the foot of the wearer of the shoe to a position of the shoe upper corresponding to a lateral side of the foot of the wearer of the shoe in a foot width direction. The planta rest is configured to receive a portion of the planta of the foot of the wearer of the shoe near a base of metatarsal bone and lift the base of metatarsal bone above the sole.
    Type: Application
    Filed: March 10, 2021
    Publication date: September 16, 2021
    Inventors: Kentaro Yahata, Shin HIRAI, Kohei YAMADA, Yu TAKEMURA, Maria FUJII
  • Publication number: 20210036474
    Abstract: The present invention suppresses variation of the position of a contact part in an installed state of a short-circuit terminal. This short-circuit terminal (4) comprises a base (40); a contact part (44); a folded part (41); an opposing part (42); and an overhang part (43). The base (40) has a flat plate shape. The contact part (44) contacts a pair of terminal fittings (2), and is able to short circuit the pair of terminal metal fittings (2). The folded part (41) is extended out so as to be folded back from the base (40). The opposing part (42) is extended facing from the folded part (41) toward the contact part (44), and the gap with the base (40) is formed so as to be smaller than the gap between the opposing inner surfaces of a short-circuit terminal holding chamber (13).
    Type: Application
    Filed: March 4, 2019
    Publication date: February 4, 2021
    Inventor: Kentaro HIRAI
  • Patent number: 10355404
    Abstract: A housing (12) of a board connector (10) to be connected to a circuit board (P) is disposed such that a connection surface to a mating connector (50) is exposed to outside through an opening (41) of a case (40) capable of accommodating the circuit board (P) inside. The housing (12) includes outer locking protrusions (31) for locking a peripheral edge part of the opening (41) of the case (40) from outside of the case (40) so that the board connector (10) will not displace into the case (40) due to forces exerted by a mating connector (50) during a connection operation.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 16, 2019
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kentaro Hirai, Mitsunori Kitajima
  • Publication number: 20180166824
    Abstract: A housing (12) of a board connector (10) to be connected to a circuit board (P) is disposed such that a connection surface to a mating connector (50) is exposed to outside through an opening (41) of a case (40) capable of accommodating the circuit board (P) inside. The housing (12) includes outer locking protrusions (31) for locking a peripheral edge part of the opening (41) of the case (40) from outside of the case (40) so that the board connector (10) will not displace into the case (40) due to forces exerted by a mating connector (50) during a connection operation.
    Type: Application
    Filed: November 21, 2017
    Publication date: June 14, 2018
    Inventors: Kentaro Hirai, Mitsunori Kitajima
  • Patent number: 6730595
    Abstract: This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 &mgr;m or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: May 4, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yoshihisa Saimoto, Yasuhisa Fujii, Makoto Kataoka, Kentaro Hirai, Hideki Fukumoto, Takanobu Koshimizu
  • Publication number: 20020106868
    Abstract: This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 &mgr;m or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.
    Type: Application
    Filed: December 6, 2001
    Publication date: August 8, 2002
    Inventors: Yoshihisa Saimoto, Yasuhisa Fujii, Makoto Kataoka, Kentaro Hirai, Hideki Fukumoto, Takanobu Koshimizu
  • Patent number: 6273791
    Abstract: A method of producing a semiconductor wafer, which can prevent the breakage of a wafer, and also can reduce the working time in a series of operations attended by back surface grinding of the semiconductor wafer. The method involves producing a semiconductor wafer wherein an adhesive tape is applied on the surface of the semiconductor wafer and, after grinding the back surface of the semiconductor wafer using a grinding machine, the adhesive tape is peeled off, said process comprises using an adhesive tape having heat shrinkability as the adhesive tape, grinding the back surface of the semiconductor wafer and heating the adhesive tape in the grinding machine, thereby peeling off the adhesive tape from the surface of the semiconductor wafer.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: August 14, 2001
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Makoto Kataoka, Yasuhisa Fujii, Kentaro Hirai, Hideki Fukumoto
  • Patent number: 6159827
    Abstract: An object of the invention is to provide a preparation process of a semiconductor wafer, in which breakage of the wafer on grinding the back surface of the wafer and on peeling the adhesive tape is prevented, and the operation time can be reduced. The preparation process of a semiconductor wafer comprises the steps of: adhering an adhesive tape on a front surface of a semiconductor wafer; grinding a back surface of the semiconductor wafer by a grinding machine; peeling the adhesive tape; and cleaning the front surface of the semiconductor wafer, wherein an adhesive tape having heat shrinkability is used as the adhesive tape, and after grinding the back surface of the semiconductor wafer, warm water at a temperature of from 50 to 99.degree. C. is poured to peel the adhesive tape in a wafer cleaning machine, and the front surface of the semiconductor wafer is cleaned in the wafer cleaning machine.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: December 12, 2000
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Makoto Kataoka, Yasuhisa Fujii, Kentaro Hirai, Hideki Fukumoto, Masatoshi Kumagai
  • Patent number: 5260440
    Abstract: The compounds of the present invention inhibit the HMG-CoA reductase, and subsequently suppress the biosynthesis of cholesterol. And they are useful in the treatment of hypercholesterolemia, hyperlipoproteinemia, and atherosclerosis.
    Type: Grant
    Filed: June 12, 1992
    Date of Patent: November 9, 1993
    Assignee: Shionogi Seiyaku Kabushiki Kaisha
    Inventors: Kentaro Hirai, Teruyuki Ishiba, Haruo Koike, Masamichi Watanabe
  • Patent number: 5128366
    Abstract: The compounds of the present invention inhibit HMG-CoA reductase, and subsequently suppress the synthesis of cholesterol. And they are useful in the treatment of hypercholesterolemia, hyperlipoproteinemia, and atherosclerosis. The compounds have the formula ##STR1## wherein R.sup.1, R.sup.2, and R.sup.3 each is independently hydrogen, optionally substituted lower alkyl, or optionally substituted aryl; R.sup.4 is lower alkyl, aralkyl, aryl, or heteroaryl, each of which is optionally substituted; X is vinylene or ethylene; Y is ##STR2## where R.sup.5 is hydrogen, lower alkyl, aryl, aralkyl, or a cation capable of forming a non-toxic pharmaceutically acceptable salt.
    Type: Grant
    Filed: May 30, 1991
    Date of Patent: July 7, 1992
    Assignee: Shinogi & Co., Ltd.
    Inventors: Kentaro Hirai, Teruyuki Ishiba, Haruo Koike, Masamichi Watanabe
  • Patent number: 4977170
    Abstract: Novel isoprenoidamine compounds (I) which show antiulcer activity are provided.
    Type: Grant
    Filed: May 3, 1989
    Date of Patent: December 11, 1990
    Assignee: Shionogi & Co., Ltd.
    Inventors: Saichi Matsumoto, Masami Doteuchi, Takuji Mizui, Kentaro Hirai
  • Patent number: 4900749
    Abstract: Novel isoprenoidamine compounds (I) which show antiulcer activity are provided.
    Type: Grant
    Filed: March 10, 1986
    Date of Patent: February 13, 1990
    Assignee: Shionogi & Co., Ltd.
    Inventors: Saichi Matsumoto, Masami Doteuchi, Takuji Mizui, Kentaro Hirai
  • Patent number: 4882338
    Abstract: A compound of the formula: ##STR1## (wherein R is hydrogen, hydroxy, methoxy, acetoxy, acetoxymethyl or trifluoromethyl;R.sup.1, R.sup.2, R.sup.3 and R.sup.4 each is hydrogen, hydroxy, optionally substituted C.sub.1 -C.sub.5 alkoxy, acetoxy, propynyloxy, allyloxy or benzyloxy; or R.sup.2 and R.sup.3 taken together form methylenedioxy;R.sup.5 is hydrogen, hydroxymethyl, C.sub.2 -C.sub.4 alkoxycarbonyl, C.sub.2 -C.sub.5 acyloxymethyl or phthalidyl; and n is 0 or 1 except for the case in which R is methoxy and R.sup.1, R.sup.2, R.sup.3, R.sup.4 and R.sup.5 each is hydrogen) or its pharmaceutically acceptable acid addition salt, being useful as anti-ulcer agents is provided through several routes.
    Type: Grant
    Filed: July 1, 1987
    Date of Patent: November 21, 1989
    Assignee: Shionogi & Co., Ltd.
    Inventors: Kentaro Hirai, Yukio Mizushima
  • Patent number: 4839365
    Abstract: A compound of the formula: ##STR1## (wherein R.sup.1 is hydrogen, C.sub.1 -C.sub.5 alkyl, C.sub.1 -C.sub.5 alkoxy, C.sub.1 -C.sub.5 alkoxycarbonyl, or trifluoromethyl; R.sup.2 is hydrogen, C.sub.1 -C.sub.5 alkoxycarbonyl, C.sub.6 -C.sub.12 aryloxycarbonyl, C.sub.1 -C.sub.5 alkanoyloxy-C.sub.1 -C.sub.5 alkyl, C.sub.1 -C.sub.5 alkoxycarbonyloxy-C.sub.1 -C.sub.5 alkyl, C.sub.1 -C.sub.5 acylamino-C.sub.1 -C.sub.5 alkyl, 2-hydroxy-1-C.sub.2 -C.sub.5 alkenyl, phthalimido-C.sub.1 -C.sub.5 alkyl, halogeno-C.sub.1 -C.sub.5 alkoxycarbonyl-C.sub.1 -C.sub.5 alkyl, hydroxy-C.sub.1 -C.sub.5 alkyl, C.sub.1 -C.sub.5 alkylthio-C.sub.1 -C.sub.5 alkyl, or C.sub.1 -C.sub.5 alkylsulfinyl-C.sub.1 -C.sub.5 alkyl; ##STR2## m is an integer of 0 or 1; R.sup.3 and R.sup.4 each is hydrogen, halogen, cyano, C.sub.1 -C.sub.5 alkyl, amino, C.sub.1 -C.sub.5 alkoxy, C.sub.6 -C.sub.12 aryl-C.sub.1 -C.sub.5 alkoxy, C.sub.1 -C.sub.5 alkoxycarbonyl, fluoro-C.sub.1 -C.sub.5 alkoxy, C.sub.1 -C.sub.
    Type: Grant
    Filed: May 6, 1988
    Date of Patent: June 13, 1989
    Assignee: Shinogi & Co., Ltd.
    Inventors: Kentaro Hirai, Yukio Mizushima, Masami Doteuchi
  • Patent number: 4564623
    Abstract: An aminoalkylbenzene derivative of the formula: ##STR1## [wherein A is oxygen or sulfur;Y is oxo, thioxo, or cyanoimino;a is an integer of 1 to 3;b is an integer of 0 to 3;c is an integer of 1 to 4;R.sup.1 is alkyl;R.sup.2 is hydrogen or alkyl; orR.sup.1 and R.sup.2 taken together represent pyrrolidinyl;R is hydrogen, cycloaklkyl, trihaloalkyl, alkoxy, dialkylamino, aryl, aroyl, heterocyclic group, or a group of the formula: ##STR2## (wherein R.sup.3 is hydrogen, halogen, amino, alkyl, alkylamino, dialkylamino, alkylthio, or aryloxy;R.sup.4 is hydrogen, alkyl, alkenyl, aryl, or heterocyclic group; orR.sup.3 and R.sup.4 taken together represent alkylidene or aralkylidene);with the proviso that the above aryl, aroyl, and heterocyclic group can be substituted by 1 to 3 substituents] and its pharmaceutically acceptable acid addition salts being useful as histamine H.sub.2 blockers, especially peptic ulcer remedies, are provided via several routes.
    Type: Grant
    Filed: January 25, 1984
    Date of Patent: January 14, 1986
    Assignee: Shionogi & Co., Ltd.
    Inventors: Kentaro Hirai, Teruyuki Ishiba, Shigeru Matsutani, Itsuo Makino, Toshio Fujishita, Masami Doteuchi, Koichi Otani
  • Patent number: 4492794
    Abstract: A compound of the formula: ##STR1## wherein R is hydrogen, C.sub.1 -C.sub.5 alkanoyl or substituted sulfonyl, which is useful as a synthetic intermediate to 2-guanidino-4-[2-(formamido)ethylthiomethyl]thiazole, histamine H.sub.2 receptor antagonist.
    Type: Grant
    Filed: April 26, 1983
    Date of Patent: January 8, 1985
    Assignee: Shionogi & Co., Ltd.
    Inventor: Kentaro Hirai
  • Patent number: 4482566
    Abstract: An aminoalkylbenzene derivative of the formula: ##STR1## [wherein A is oxygen or sulfur;Y is oxo, thioxo, or cyanoimino;a is an integer of 1 to 3;b is an integer of 0 to 3;c is an integer of 1 to 4;R.sup.1 is alkyl;R.sup.2 is hydrogen or alkyl; orR.sup.1 and R.sup.2 taken together represent pyrrolidinyl;R is hydrogen, cycloalkyl, trihaloalkyl, alkoxy, dialkylamino, aryl, aroyl, heterocyclic group, or a group of the formula: ##STR2## (wherein R.sup.3 is hydrogen, halogen, amino, alkyl, alkylamino, dialkylamino, alkylthio, or aryloxy;R.sup.4 is hydrogen, alkyl, alkenyl, aryl, or heterocyclic group; orR.sup.3 and R.sup.4 taken together represent alkylidene or aralkylidene);with the proviso that the above aryl, aroyl, and heterocyclic group can be substituted by 1 to 3 substituents] and its pharmaceutically acceptable acid addition salts being useful as histamine H.sub.2 blockers, especially peptic ulcer remedies, are provided via several routes.
    Type: Grant
    Filed: June 25, 1981
    Date of Patent: November 13, 1984
    Assignee: Teikoku Hormone Mfg. Co., Ltd.
    Inventors: Kentaro Hirai, Teruyuki Ishiba, Shigeru Matsutani, Itsuo Makino, Toshio Fujishita, Masami Doeteuchi, Koichi Otani
  • Patent number: 4476133
    Abstract: 4,1-Benzoxazepines of the following formula are novel central nervous system: ##STR1## wherein R is hydrogen or C.sub.1 to C.sub.5 alkyl;X is hydrogen, halogen, or nitro;Y is phenyl, 2-halophenyl, 4-halophenyl, 2-trifluoromethylphenyl, or pyridyl;and ##STR2## is a group of the formula: ##STR3## (wherein Q is oxygen, sulfur, or hydrazono, with a proviso that, when Y is phenyl or 2-halophenyl and R is hydrogen, Q is neither oxygen nor sulfur;R.sup.1 is hydrogen, halogen, C.sub.1 to C.sub.5 alkyl, C.sub.1 to C.sub.5 alkylthio, 5- or 6-membered heterocycle or C.sub.1 to C.sub.5 alkyl substituted by a substituent selected from the group consisting of halogen, hydroxy, mercapto, C.sub.1 to C.sub.5 alkoxy, C.sub.1 to C.sub.5 alkanoyloxy, C.sub.1 to C.sub.5 alkylthio, C.sub.7 to C.sub.9 aralkyldithio, C.sub.2 to C.sub.10 dialkylamino, C.sub.3 to C.sub.15 dialkylaminoalkoxy, C.sub.3 to C.sub.15 dialkylaminoalkylthio, and 5- or 6-membered heterocycle;R.sup.2 is C.sub.1 to C.sub.5 alkyl;and R.sup.3 is C.sub.1 to C.sub.
    Type: Grant
    Filed: July 13, 1982
    Date of Patent: October 9, 1984
    Assignee: Shionogi & Co., Ltd.
    Inventors: Kentaro Hirai, Shigeru Matsutani, Itsuo Makino, Teruyuki Ishiba
  • Patent number: RE37314
    Abstract: The compounds of the present invention inhibit the HMG-CoA reductase, and subsequently suppress the biosynthesis of cholesterol. And they are useful in the treatment of hypercholesterolemia, hyperlipoproteinemia, and atherosclerosis.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: August 7, 2001
    Assignee: Shionogi Seiyaku Kabushiki Kaisha
    Inventors: Kentaro Hirai, Teruyuki Ishiba, Haruo Koike, Masamichi Watanabe