Abstract: The present invention provides a thermosensitive recording medium having a high degree of water resistance and excellent surface qualities. The thermosensitive recording medium has a thermosensitive recording layer comprising a colorless or pale colored basic leuco dye and an electron accepting developing agent on a substrate, but does not have a protective layer on the thermosensitive recording layer, and the thermosensitive recording layer further comprises (i) a carboxy-modified polyvinyl alcohol as a binder, (ii) an epichlorohydrin resin and a modified polyamine/amide resin (excluding those contained in the category of epichlorohydrin resin) as crosslinking agents, and (iii) an acrylic resin with a glass transition temperature (Tg) of lower than or equal to 50 degree C. and a minimum film forming temperature (MFT) of higher than or equal to 40 degree C.

Abstract: Provided is a thermosensitive recording medium having excellent oil resistance among various performances required for the thermosensitive recording medium. The thermosensitive recording medium has a thermosensitive recording layer comprising a colorless or pale colored electron donating leuco dye and an electron accepting color developing agent on a substrate, wherein the thermosensitive recording layer contains N-[2-(3-phenylureido)phenyl] benzenesulfonamide and an urea-based compound represented by the general formula 1 as the electron accepting color developing agents, wherein R1 represents a substituted or unsubstituted alkyl group, aralkyl group or aryl group, and R2 represents a hydrogen atom or an alkyl group.

Abstract: A connector includes a first housing, a second housing connectable to the first housing, and a lever rotatably supported on the first housing. The lever includes a lever lock portion for holding the first and second housings in a connected state. The first housing includes a first locking portion and the second housing has a second locking portion. The first and second locking portions, are arranged side by side with each other to constitute an integrated locking portion and arranged to be lockable to the lever lock portion with the first and second housings connected.

Abstract: A press-fit terminal inserted into through hole of a circuit board along insertion direction includes a base portion extending in insertion direction, distal end portion, and two deformable portions. The distal end portion is on a front side to base portion in insertion direction and includes distal end portion side corner portions. The two deformable portions connect base portion and distal end portion and are contacted with an inner wall of through hole and elastically deformed. The two deformable portions include deformable portion side corner portions and deformable portion side corner portions include outer deformable portion side corner portions on outer side in direction crossing insertion direction. The two deformable portions include easy deformable portions, in portions having outer deformable portion side corner portions with curved surfaces whose radius of curvature RL is greater than a radius of curvature RS of curved surfaces of distal end portion side corner portions.

Abstract: A male terminal fitting (10) is provided with a solid tab (11) extending in an axial direction. The tab (11) has one surface (15) to be contacted by a contact point portion (63) of a female terminal fitting (60) and a pair of side surfaces (17) intersecting and connected to both ends in a width direction of the one surface (15). The one surface (15) of the tab (11) includes a pair of recesses (18) located on both end sides in the width direction and open in the pair of side surfaces (17) in a sliding range of the contact point portion (63) in the axial direction. A width between the pair of recesses (18) on the one surface (15) of the tab (11) is smaller than a maximum width of the contact point portion (63).

Abstract: A connector is provided with a housing made of synthetic resin, a plurality of slit-like through holes formed in the housing, and a plurality of terminal fittings mounted in the housing while being passed through the through holes. The plurality of through holes are so disposed in parallel that long sides of the through holes are parallel. Projection-like supporting portions configured to come into contact with an outer surface of the terminal fitting to sandwich the terminal fitting are formed on an inner surface of the through hole. The supporting portions are disposed only on two long-side inner wall surfaces, out of the inner surface of the through hole, and project only from parts of the long-side inner wall surfaces in a penetration direction of the through hole.

Abstract: A connector includes a first housing, a second housing connectable to the first housing, and a lever rotatably supported on the first housing. The lever includes a lever lock portion for holding the first and second housings in a connected state. The first housing includes a first locking portion and the second housing has a second locking portion. The first and second locking portions, are arranged side by side with each other to constitute an integrated locking portion and arranged to be lockable to the lever lock portion with the first and second housings connected.

Abstract: A press-fit terminal inserted into through hole of a circuit board along insertion direction includes a base portion extending in insertion direction, distal end portion, and two deformable portions. The distal end portion is on a front side to base portion in insertion direction and includes distal end portion side corner portions. The two deformable portions connect base portion and distal end portion and are contacted with an inner wall of through hole and elastically deformed. The two deformable portions include deformable portion side corner portions and deformable portion side corner portions include outer deformable portion side corner portions on outer side in direction crossing insertion direction. The two deformable portions include easy deformable portions, in portions having outer deformable portion side corner portions with curved surfaces whose radius of curvature RL is greater than a radius of curvature RS of curved surfaces of distal end portion side corner portions.

Abstract: A shorting terminal includes a base portion, a contact portion, a folded portion, an opposing portion and a protruding portion. The base portion is in the form of a flat plate. The contact portion can short a pair of terminal fittings by contacting the pair of terminal fittings. The folded portion extends in such a manner as to be folded from the base portion. The opposing portion extends from the folded portion toward the contact portion and is formed such that an interval between the base portion and the opposing portion is smaller than an interval between opposing inner surfaces of a shorting terminal holding chamber. The protruding portion extends from the opposing portion to the contact portion and is formed such that an interval between the base portion and the protruding portion is larger than the interval between the opposing inner surfaces of the shorting terminal holding chamber.

Abstract: The present invention suppresses variation of the position of a contact part in an installed state of a short-circuit terminal. This short-circuit terminal (4) comprises a base (40); a contact part (44); a folded part (41); an opposing part (42); and an overhang part (43). The base (40) has a flat plate shape. The contact part (44) contacts a pair of terminal fittings (2), and is able to short circuit the pair of terminal metal fittings (2). The folded part (41) is extended out so as to be folded back from the base (40). The opposing part (42) is extended facing from the folded part (41) toward the contact part (44), and the gap with the base (40) is formed so as to be smaller than the gap between the opposing inner surfaces of a short-circuit terminal holding chamber (13).

Abstract: A housing (12) of a board connector (10) to be connected to a circuit board (P) is disposed such that a connection surface to a mating connector (50) is exposed to outside through an opening (41) of a case (40) capable of accommodating the circuit board (P) inside. The housing (12) includes outer locking protrusions (31) for locking a peripheral edge part of the opening (41) of the case (40) from outside of the case (40) so that the board connector (10) will not displace into the case (40) due to forces exerted by a mating connector (50) during a connection operation.

Abstract: A housing (12) of a board connector (10) to be connected to a circuit board (P) is disposed such that a connection surface to a mating connector (50) is exposed to outside through an opening (41) of a case (40) capable of accommodating the circuit board (P) inside. The housing (12) includes outer locking protrusions (31) for locking a peripheral edge part of the opening (41) of the case (40) from outside of the case (40) so that the board connector (10) will not displace into the case (40) due to forces exerted by a mating connector (50) during a connection operation.

Abstract: This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 &mgr;m or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.

Abstract: This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 &mgr;m or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.

Abstract: A method of producing a semiconductor wafer, which can prevent the breakage of a wafer, and also can reduce the working time in a series of operations attended by back surface grinding of the semiconductor wafer. The method involves producing a semiconductor wafer wherein an adhesive tape is applied on the surface of the semiconductor wafer and, after grinding the back surface of the semiconductor wafer using a grinding machine, the adhesive tape is peeled off, said process comprises using an adhesive tape having heat shrinkability as the adhesive tape, grinding the back surface of the semiconductor wafer and heating the adhesive tape in the grinding machine, thereby peeling off the adhesive tape from the surface of the semiconductor wafer.

Abstract: An object of the invention is to provide a preparation process of a semiconductor wafer, in which breakage of the wafer on grinding the back surface of the wafer and on peeling the adhesive tape is prevented, and the operation time can be reduced. The preparation process of a semiconductor wafer comprises the steps of: adhering an adhesive tape on a front surface of a semiconductor wafer; grinding a back surface of the semiconductor wafer by a grinding machine; peeling the adhesive tape; and cleaning the front surface of the semiconductor wafer, wherein an adhesive tape having heat shrinkability is used as the adhesive tape, and after grinding the back surface of the semiconductor wafer, warm water at a temperature of from 50 to 99.degree. C. is poured to peel the adhesive tape in a wafer cleaning machine, and the front surface of the semiconductor wafer is cleaned in the wafer cleaning machine.

Abstract: The compounds of the present invention inhibit the HMG-CoA reductase, and subsequently suppress the biosynthesis of cholesterol. And they are useful in the treatment of hypercholesterolemia, hyperlipoproteinemia, and atherosclerosis.

Abstract: The compounds of the present invention inhibit HMG-CoA reductase, and subsequently suppress the synthesis of cholesterol. And they are useful in the treatment of hypercholesterolemia, hyperlipoproteinemia, and atherosclerosis. The compounds have the formula ##STR1## wherein R.sup.1, R.sup.2, and R.sup.3 each is independently hydrogen, optionally substituted lower alkyl, or optionally substituted aryl; R.sup.4 is lower alkyl, aralkyl, aryl, or heteroaryl, each of which is optionally substituted; X is vinylene or ethylene; Y is ##STR2## where R.sup.5 is hydrogen, lower alkyl, aryl, aralkyl, or a cation capable of forming a non-toxic pharmaceutically acceptable salt.

Abstract: Novel isoprenoidamine compounds (I) which show antiulcer activity are provided.

Abstract: The compounds of the present invention inhibit the HMG-CoA reductase, and subsequently suppress the biosynthesis of cholesterol. And they are useful in the treatment of hypercholesterolemia, hyperlipoproteinemia, and atherosclerosis.