Patents by Inventor Kentaro ISHIMOTO

Kentaro ISHIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating method and plating apparatus
    Patent number: 11447885
    Abstract: A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: September 20, 2022
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Ryu Miyamoto, Kentaro Ishimoto
  • PLATING METHOD AND PLATING APPARATUS
    Publication number: 20210062354
    Abstract: A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.
    Type: Application
    Filed: November 11, 2020
    Publication date: March 4, 2021
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Ryu Miyamoto, Kentaro Ishimoto
  • Plating method and plating apparatus
    Patent number: 10865492
    Abstract: A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: December 15, 2020
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Ryu Miyamoto, Kentaro Ishimoto
  • PLATING METHOD AND PLATING APPARATUS
    Publication number: 20180282892
    Abstract: A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 4, 2018
    Inventors: Jumpei FUJIKATA, Masashi SHIMOYAMA, Ryu MIYAMOTO, Kentaro ISHIMOTO