Patents by Inventor Kentaro KAMIYAMA

Kentaro KAMIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive member, adhesion method, and method for manufacturing electronic device casing
    Patent number: 11919251
    Abstract: An adhesive member includes: a first pin portion to be inserted into a first hole formed in a first adherend member; a second pin portion which is to be inserted into a second hole formed in a second adherend member to be adhered to the first adherend member, and is formed coaxially with the first pin portion; and a flange portion which is formed using an adhesive, and is mounted to a side surface of the first pin portion or a side surface of the second pin portion in a flange shape.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: March 5, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Nobuo Yokomura, Koji Kamiyama, Atsuki Watai, Kentaro Nagata
  • COIL COMPONENT AND WIRELESS POWER TRANSMISSION DEVICE HAVING THE SAME
    Publication number: 20230253830
    Abstract: Disclosed herein is a coil component that includes a substrate, and a planar spiral coil pattern provided on the surface of the substrate. The coil pattern has a circularity higher in its inner shape than in its outer shape.
    Type: Application
    Filed: February 6, 2023
    Publication date: August 10, 2023
    Inventors: Takuya YOSHIDA, Noritaka CHIYO, Michihisa TOKUI, Kentaro KAMIYAMA, Daiki YAMANE
  • Magnetron having a cooling structure
    Patent number: 10170269
    Abstract: A magnetron includes an anode cylinder extending in a cylindrical shape along a central axis and a plurality of plate-like vanes at least each one end of which is fixed to the anode cylinder, extending from an inner face of the anode cylinder toward the central axis, in which the anode cylinder includes refrigerant flow paths for directly applying a refrigerant to the plate-like vanes. The refrigerant flow paths 111 are openings formed so that end surfaces (joint end faces of the plate-like vanes) of the plate-like vanes are exposed, which allow the refrigerant to directly contact the plate-like vanes.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: January 1, 2019
    Assignee: Hitachi Power Solutions Co., Ltd.
    Inventors: Kentaro Kamiyama, Reiji Torai
  • Magnetron Having a Cooling Structure
    Publication number: 20180096815
    Abstract: A magnetron includes an anode cylinder extending in a cylindrical shape along a central axis and a plurality of plate-like vanes at least each one end of which is fixed to the anode cylinder, extending from an inner face of the anode cylinder toward the central axis, in which the anode cylinder includes refrigerant flow paths for directly applying a refrigerant to the plate-like vanes. The refrigerant flow paths 111 are openings formed so that end surfaces (joint end faces of the plate-like vanes) of the plate-like vanes are exposed, which allow the refrigerant to directly contact the plate-like vanes.
    Type: Application
    Filed: September 28, 2017
    Publication date: April 5, 2018
    Inventors: Kentaro KAMIYAMA, Reiji TORAI