Patents by Inventor Kentaro Murakami
Kentaro Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12179489Abstract: A liquid ejecting head includes: a nozzle row configured by arranging nozzles ejecting a liquid in a first-direction in a second-direction orthogonal to the first-direction; a drive element; and stacked components defining a common liquid chamber communicating with the nozzle row, in which the stacked components include a filter partitioning the common liquid chamber into an upstream common liquid chamber and a downstream common liquid chamber, a first-case defining a first-common-liquid-chamber-portion as a part of the upstream common liquid chamber and stacked on the filter, and a second-case defining a second-common-liquid-chamber-portion as a part of the upstream common liquid chamber and stacked on the first-case, the second-common liquid-chamber-portion is positioned in a direction opposite to the first-direction from the drive element, and a width of the second-common-liquid-chamber-portion in a third-direction orthogonal to the first-direction and the second-direction is longer than a width of the firType: GrantFiled: December 27, 2022Date of Patent: December 31, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Kentaro Murakami, Katsuhiro Okubo, Takahiro Kanegae, Haruhisa Uezawa, Hiroki Kobayashi
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Publication number: 20240316010Abstract: An FGF21 production promoting agent containing, as an active ingredient, a compound represented by the following formula (1): wherein each of R1 and R2, which may be identical to or different from each other, represents, for example, a hydrogen atom; each of R3a, R3b, R4a, and R4b, which may be identical to or different from one another, represents, for example, a hydrogen atom or a halogen atom, or R3a and R3b or R4a and R4b may bond together to form an alkylenedioxy group; X represents an oxygen atom, a sulfur atom, or N—R5 (R5 represents, for example, a hydrogen atom or a C1-4 alkyl group); Y represents, for example, an oxygen atom, an S(O)l group (l is a number of from 0 to 2), or a carbonyl group; Z represents CH or N; n is a number of from 1 to 6; and m is a number from 2 to 6, a salt of the compound, or a solvate of the compound or the salt.Type: ApplicationFiled: May 10, 2024Publication date: September 26, 2024Applicant: Kowa Co., Ltd.Inventors: Toshiaki TAKIZAWA, Kentaro MURAKAMI
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Patent number: 11981136Abstract: A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.Type: GrantFiled: March 23, 2022Date of Patent: May 14, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Takahiro Kanegae, Katsuhiro Okubo, Kentaro Murakami, Shingo Tomimatsu, Hiroki Kobayashi, Haruhisa Uezawa
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Patent number: 11938728Abstract: A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.Type: GrantFiled: March 23, 2022Date of Patent: March 26, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Takahiro Kanegae, Katsuhiro Okubo, Kentaro Murakami, Shingo Tomimatsu, Hiroki Kobayashi, Haruhisa Uezawa
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Patent number: 11938732Abstract: A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.Type: GrantFiled: March 23, 2022Date of Patent: March 26, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Katsuhiro Okubo, Takahiro Kanegae, Kentaro Murakami, Shingo Tomimatsu, Hiroki Kobayashi, Haruhisa Uezawa
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Patent number: 11865836Abstract: A liquid ejecting head includes: a nozzle; a flow path member in which a flow path communicating with the nozzle is formed and which has an inner wall surface defining the flow path and an outer wall surface that faces away from the flow path with respect to the inner wall surface; and a temperature sensor disposed on a part of the outer wall surface and configured to detect a temperature of the liquid in the flow path. The flow path includes a narrowed region having a narrow width in a second direction orthogonal to a first direction in a direction in which the flow path extends, and the temperature sensor is disposed on a portion of the outer wall surface that forms the narrowed region.Type: GrantFiled: January 24, 2022Date of Patent: January 9, 2024Inventors: Kentaro Murakami, Hiroaki Okui
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Patent number: 11840963Abstract: An acoustic attenuator comprises a first attenuation unit, a second attenuation unit, a welded section, and a communication part. A first acoustic damper is provided on an outer surface of a first acoustic liner, which faces toward a side opposite from an object, to form a first damper space that communicates with an internal space of the object. The second attenuation unit is attached to an outer surface of the object. The welded section is provided at least between the first acoustic damper and a second acoustic damper. The welded section secures the second attenuation unit to the first acoustic liner. The communication part is disposed in a position farther from an outer surface of the object than the welded section, allowing communication between the first damper space and a second damper space.Type: GrantFiled: July 28, 2020Date of Patent: December 12, 2023Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Hirokazu Shiraishi, Tatsuya Nadayoshi, Kentaro Murakami
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Publication number: 20230321051Abstract: An FGF21 production promoting agent containing, as an active ingredient, a compound represented by the following formula (1): wherein each of R1 and R2, which may be identical to or different from each other, represents, for example, a hydrogen atom; each of R3a, R3b, R4a, and R4b, which may be identical to or different from one another, represents, for example, a hydrogen atom or a halogen atom, or R3a and R3b or R4a and R4b may bond together to form an alkylenedioxy group; X represents an oxygen atom, a sulfur atom, or N-R5 (R5 represents, for example, a hydrogen atom or a C1-4 alkyl group); Y represents, for example, an oxygen atom, an S(O)1 group (1 is a number of from 0 to 2), or a carbonyl group; Z represents CH or N; n is a number of from 1 to 6; and m is a number from 2 to 6, a salt of the compound, or a solvate of the compound or the salt.Type: ApplicationFiled: May 24, 2023Publication date: October 12, 2023Applicant: Kowa Co., Ltd.Inventors: Toshiaki TAKIZAWA, Kentaro MURAKAMI
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Patent number: 11780243Abstract: A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.Type: GrantFiled: May 17, 2022Date of Patent: October 10, 2023Assignee: Seiko Epson CorporationInventors: Haruhisa Uezawa, Hiroki Kobayashi, Katsuhiro Okubo, Kentaro Murakami, Takahiro Kanegae, Shingo Tomimatsu
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Publication number: 20230202185Abstract: A liquid ejecting head includes: a nozzle row configured by arranging nozzles ejecting a liquid in a first-direction in a second-direction orthogonal to the first-direction; a drive element; and stacked components defining a common liquid chamber communicating with the nozzle row, in which the stacked components include a filter partitioning the common liquid chamber into an upstream common liquid chamber and a downstream common liquid chamber, a first-case defining a first-common-liquid-chamber-portion as a part of the upstream common liquid chamber and stacked on the filter, and a second-case defining a second-common-liquid-chamber-portion as a part of the upstream common liquid chamber and stacked on the first-case, the second-common liquid-chamber-portion is positioned in a direction opposite to the first-direction from the drive element, and a width of the second-common-liquid-chamber-portion in a third-direction orthogonal to the first-direction and the second-direction is longer than a width of the firType: ApplicationFiled: December 27, 2022Publication date: June 29, 2023Inventors: Kentaro MURAKAMI, Katsuhiro OKUBO, Takahiro KANEGAE, Haruhisa UEZAWA, Hiroki KOBAYASHI
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Publication number: 20230019803Abstract: An FGF21 production promoting agent containing, as an active ingredient, a compound represented by the following formula (1): wherein each of R1 and R2, which may be identical to or different from each other, represents, for example, a hydrogen atom; each of R3a, R3b, R4a, and R4b, which may be identical to or different from one another, represents, for example, a hydrogen atom or a halogen atom, or R3a and R3b or R4a and R4b may bond together to form an alkylenedioxy group; X represents an oxygen atom, a sulfur atom, or N—R5 (R5 represents, for example, a hydrogen atom or a C1-4 alkyl group); Y represents, for example, an oxygen atom, an S(O)l group (l is a number of from 0 to 2), or a carbonyl group; Z represents CH or N; n is a number of from 1 to 6; and m is a number from 2 to 6, a salt of the compound, or a solvate of the compound or the salt.Type: ApplicationFiled: September 2, 2022Publication date: January 19, 2023Applicant: Kowa Co., Ltd.Inventors: Toshiaki TAKIZAWA, Kentaro MURAKAMI
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Publication number: 20220371338Abstract: A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.Type: ApplicationFiled: May 17, 2022Publication date: November 24, 2022Inventors: Haruhisa UEZAWA, Hiroki KOBAYASHI, Katsuhiro OKUBO, Kentaro MURAKAMI, Takahiro KANEGAE, Shingo TOMIMATSU
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Publication number: 20220349346Abstract: An acoustic attenuator comprises a first attenuation unit, a second attenuation unit, a welded section, and a communication part. A first acoustic damper is provided on an outer surface of a first acoustic liner, which faces toward a side opposite from an object, to form a first damper space that communicates with an internal space of the object. The second attenuation unit is attached to an outer surface of the object. The welded section is provided at least between the first acoustic damper and a second acoustic damper. The welded section secures the second attenuation unit to the first acoustic liner. The communication part is disposed in a position farther from an outer surface of the object than the welded section, allowing communication between the first damper space and a second damper space.Type: ApplicationFiled: July 28, 2020Publication date: November 3, 2022Applicant: Mitsubishi Power, Ltd.Inventors: Hirokazu Shiraishi, Tatsuya Nadayoshi, Kentaro Murakami
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Publication number: 20220305787Abstract: A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.Type: ApplicationFiled: March 23, 2022Publication date: September 29, 2022Inventors: Katsuhiro Okubo, Takahiro Kanegae, Kentaro Murakami, Shingo Tomimatsu, Hiroki Kobayashi, Haruhisa Uezawa
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Publication number: 20220305785Abstract: A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.Type: ApplicationFiled: March 23, 2022Publication date: September 29, 2022Inventors: Takahiro KANEGAE, Katsuhiro OKUBO, Kentaro MURAKAMI, Shingo TOMIMATSU, Hiroki KOBAYASHI, Haruhisa UEZAWA
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Publication number: 20220305788Abstract: A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.Type: ApplicationFiled: March 23, 2022Publication date: September 29, 2022Inventors: Takahiro KANEGAE, Katsuhiro OKUBO, Kentaro MURAKAMI, Shingo TOMIMATSU, Hiroki KOBAYASHI, Haruhisa UEZAWA
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Publication number: 20220234350Abstract: A liquid ejecting head includes: a nozzle; a flow path member in which a flow path communicating with the nozzle is formed and which has an inner wall surface defining the flow path and an outer wall surface that faces away from the flow path with respect to the inner wall surface; and a temperature sensor disposed on a part of the outer wall surface and configured to detect a temperature of the liquid in the flow path. The flow path includes a narrowed region having a narrow width in a second direction orthogonal to a first direction in a direction in which the flow path extends, and the temperature sensor is disposed on a portion of the outer wall surface that forms the narrowed region.Type: ApplicationFiled: January 24, 2022Publication date: July 28, 2022Inventors: Kentaro MURAKAMI, Hiroaki OKUI
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Patent number: 11292256Abstract: A liquid ejecting head including a nozzle configured to eject a liquid, a liquid flow path communicating with the nozzle, a communication chamber including a communication port configured to communicate with atmospheric air, a partitioning wall portion provided between the liquid flow path and the communication chamber, the partitioning wall portion including an opening portion that communicates the liquid flow path and the communication chamber to each other, and an elastic member closing the opening portion.Type: GrantFiled: June 22, 2020Date of Patent: April 5, 2022Assignee: Seiko Epson CorporationInventors: Yoshinori Nakajima, Kentaro Murakami, Yoshiki Sugawara, Hiroshige Owaki
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Patent number: 11110717Abstract: A channel member includes a liquid emission port coupled to a liquid introduction section to emit liquid to the liquid introduction section, and a liquid feeding port that receives liquid from outside to feed the liquid to the liquid emission port. The liquid emission port and the liquid feeding port have the same opening direction.Type: GrantFiled: September 26, 2019Date of Patent: September 7, 2021Assignee: Seiko Epson CorporationInventors: Hiroyuki Hagiwara, Katsuhiro Okubo, Kentaro Murakami
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Publication number: 20210205274Abstract: An FGF21 production promoting agent containing, as an active ingredient, a compound represented by the following formula (1): wherein each of R1 and R2, which may be identical to or different from each other, represents, for example, a hydrogen atom; each of R3a, R3b, R4a, and R4b, which may be identical to or different from one another, represents, for example, a hydrogen atom or a halogen atom, or R3a and R3b or R4a and R4b may bond together to form an alkylenedioxy group; X represents an oxygen atom, a sulfur atom, or N—R5 (R5 represents, for example, a hydrogen atom or a C1-4 alkyl group); Y represents, for example, an oxygen atom, an S(O)l group (l is a number of from 0 to 2), or a carbonyl group; Z represents CH or N; n is a number of from 1 to 6; and m is a number from 2 to 6, a salt of the compound, or a solvate of the compound or the salt.Type: ApplicationFiled: February 26, 2021Publication date: July 8, 2021Applicant: Kowa Co., Ltd.Inventors: Toshiaki TAKIZAWA, Kentaro MURAKAMI