Abstract: A semiconductor device includes a semiconductor part, first to third and control electrodes. The first electrode is provided on a back surface of the semiconductor part; and the second electrode is provided on a front surface thereof. The third electrode is provided between the first and second electrodes. The third electrode extends into the semiconductor part from the front surface side thereof. The third electrode is electrically insulated from the semiconductor part via an insulating space between the semiconductor part and the third electrode. The control electrode includes first and second portions. The first portion is linked to the second portion and extends between the semiconductor part and the third electrode. The second portion is provided between the second electrode and the third electrode. The first portion faces the insulating space via the third electrode; and the second portion extends between the insulating space and the second electrode.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, a first semiconductor region of a first conductivity type, a second electrode, a gate electrode, second semiconductor regions of a second conductivity type, third semiconductor regions of the first conductivity type, and a third electrode. The second electrode is provided in a plurality in second and third directions. Each second electrode opposes a portion of the first semiconductor region in the second and third directions with an insulating layer interposed. The gate electrode is provided around each second electrode. The first semiconductor region includes first regions provided respectively around the second electrodes and the second region provided around the first regions in the second and third directions. Impurity concentration of the first conductivity type in each of the first regions is higher than impurity concentration of the first conductivity type in the second region.

Abstract: A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.

Abstract: A method of manufacturing a light-emitting device which includes a light-emitting source is provided by applying, onto the light-emitting source, a fluorescent resin which includes fluorescent particles and is stored in and discharged from an applicator. The method includes measuring a first concentration which is a concentration of the fluorescent particles included in the fluorescent resin discharged from the applicator; and applying, onto the light-emitting source, the fluorescent resin in an application amount determined based on the first concentration which has been measured and reference data which indicates a relationship between a concentration of the fluorescent particles and an application amount of the fluorescent resin that enables the light-emitting device to have constant chromaticity.

Abstract: A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

Abstract: A method of manufacturing a light-emitting device which includes a light-emitting source by applying, onto the light-emitting source, a fluorescent resin which includes fluorescent particles and is stored in and discharged from an applicator, the method includes: measuring a first concentration which is a concentration of the fluorescent particles included in the fluorescent resin discharged from the applicator; and applying, onto the light-emitting source, the fluorescent resin in an application amount determined based on the first concentration which has been measured and reference data which indicates a relationship between a concentration of the fluorescent particles and an application amount of the fluorescent resin that enables the light-emitting device to have constant chromaticity.

Abstract: A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

Abstract: A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.

Abstract: In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL of 4L as a length with which each of two boards corresponding to a plurality of head units can be positioned at each component placement position and a board retreat position corresponding to each placement position can be secured and SL as a space for positioning a board stop mechanism at each placement position and each board retreat position, which is not less than 450 mm and not more than 1000 mm.

Abstract: A seeding machine comprises: an air compressor for generating a positive air pressure; a soil hardness sensor for measuring soil hardness so as to produce a control signal to adjust the positive air pressure generated by the compressor; an air pressure adjuster for adjusting the positive air pressure generated by the air compressor in accordance with the control signal produced by the soil hardness sensor; a negative air pressure generator for generating a negative air pressure by making use of air under the positive air pressure; a change-over valve for effecting a change-over operation between the positive air pressure and the negative air pressure, so as to selectively supply the positive air pressure or the negative air pressure; a seed adsorber for catching a seed by virtue of the negative air pressure; a first air cylinder adapted to extend or contract by the positive air pressure, to cause a certain reciprocating movement of the seed adsorber; a second air cylinder adapted to extend or contract by the