Abstract: A silver powder containing dendrite silver particles is provided. The dendrite silver particles are in a dendrite shape having one trunk and a plurality of branches branching from the trunk. The thickness of the trunk of the dendrite silver particles is from 10 to 280 nm. The number of the branches per length of the trunk is from 6 to 30 branches/µm. The percentage by number of the dendrite silver particles in the whole of silver particles is 50 N% or more. This silver powder is produced by reducing silver ions through electrolysis of an electrolyte solution containing silver ions and hydantoin or a derivative thereof.

Abstract: A novel silver-coated copper powder, particularly a silver-coated copper powder particle having a dendritic shape, having increased electrical conductivity with no need to increase the silver content is provided. The silver-coated copper powder is composed of a silver-coated copper particle coated with a silver layer containing silver or a silver alloy, including a silver-coated copper particle having a dendritic shape, containing nitrogen (N) in the silver layer, and having a nitrogen (N) content of 0.2 to 10.0 parts by mass with respect to 100 parts by mass of the silver content.

Abstract: A new dendritic silver powder can be mixed with a synthetic resin to give electroconductive films having sufficient electroconductivity. Even when the films vary in thickness, the electroconductivity of the films can be maintained. The volume-cumulative particle diameter D50 (referred to as “D50D”) determined by adding the silver powder to water containing a dispersant, applying 300-watt ultrasonic waves to the resultant mixture for 3 minutes, and examining the dispersion with a laser diffraction/scattering type particle size analyzer is 1.0-15.0 ?m and that the ratio of the volume-cumulative particle diameter D50 (referred to as “D50N”) determined by adding the silver powder to the water containing a dispersant and examining the mixture under the same conditions as for the D50D except that no ultrasonic waves are applied, to the D50D, D50N/D50D, is 1.0-10.0.

Abstract: A novel silver-coated copper powder, particularly a silver-coated copper powder particle having a dendritic shape, having increased electrical conductivity with no need to increase the silver content is provided. The silver-coated copper powder is composed of a silver-coated copper particle coated with a silver layer containing silver or a silver alloy, including a silver-coated copper particle having a dendritic shape, containing nitrogen (N) in the silver layer, and having a nitrogen (N) content of 0.2 to 10.0 parts by mass with respect to 100 parts by mass of the silver content.

Abstract: Disclosed is a new dendritic silver powder which, when mixed with a synthetic resin, gives electroconductive films having sufficient electroconductivity. Even when the films produced from a mixture of the dendritic silver powder and a synthetic resin vary in thickness, the electroconductivity of the films can be maintained. The volume-cumulative particle diameter D50 (referred to as “D50D”) determined by adding the silver powder to water containing a dispersant, applying 300-watt ultrasonic waves to the resultant mixture for 3 minutes, and examining the dispersion with a laser diffraction/scattering type particle size analyzer is 1.0-15.0 ?m and that the ratio of the volume-cumulative particle diameter D50 (referred to as “D50”) determined by adding the silver powder to the water containing a dispersant and examining the mixture under the same conditions as for the D50D except that no ultrasonic waves are applied, to the D50D, D50N/D50D, is 1.0-10.0.

Abstract: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. The third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

Abstract: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

Abstract: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

Abstract: Downsizing, cost reduction, and a low inductance of an input/output circuit are to be achieved with a power converter in which a multilayer board having a power semiconductor module 500 and busbars 11, 12 is modularized. The positive busbar 11 and the negative busbar 12 for feeding main circuit current are provided on a surface of the multilayer board 100 on which a control device 10a is mounted. The positive busbar 11 and the negative busbar 12 are formed to be thicker that the metal layer wiring in each layer of the multilayer board 100. The positive busbar 11 is electrically connected to the 2nth layer wiring (n represents a positive integer) from the positive surface wiring of the multilayer board 100, and the negative busbar 12 to the 2n+1th layer wiring opposite to the 2nth layer wiring of the multilayer board 100, through via holes. As a result, current flows into the power semiconductor module 500 in opposite directions through the 2nth layer wiring and the 2n+1th layer wiring.

Abstract: A control device for an electrically operated power steering system includes: a power substrate comprising a plurality of switching elements, that converts DC electrical current to AC electrical current by switching operation of the plurality of switching elements; an output terminal for transmitting the AC electrical current to an electric motor that generates steering torque; a conductor for electrically connecting the power substrate to the output terminal; a metallic chassis that holds the power substrate and the conductor, and supports the output terminal; and a metallic cover that faces the output terminal, and that is connected to the metallic chassis.

Abstract: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

Abstract: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

Abstract: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

Abstract: A control device for an electrically operated power steering system includes: a power substrate comprising a plurality of switching elements, that converts DC electrical current to AC electrical current by switching operation of the plurality of switching elements; an output terminal for transmitting the AC electrical current to an electric motor that generates steering torque; a conductor for electrically connecting the power substrate to the output terminal; a metallic chassis that holds the power substrate and the conductor, and supports the output terminal; and a metallic cover that faces the output terminal, and that is connected to the metallic chassis.

Abstract: This invention improves electric characteristics of electronic devices and semiconductor devices. An electronic device comprising an inductive conductor section 4 forming a coil pattern 3 on each of three primary dielectric substrates 1a which are laminated into a multi-layer part, a capacitive conductor section 6 forming a capacitance pattern 5 on each of two secondary dielectric substrates 1b which are laminated into another multi-layer part, and external connection terminals 9 which are connected to both ends of the inductive conductor section 4 and the capacitive conductor section 6 by means of through-hole wiring 8; wherein the conductor sections 4 and 6 are laminated, each of the capacitive conductor sections 6 forming a capacitance pattern 5 has a slit 10 to shut off a flow of an eddy current from the coil pattern 3 to the conductor section 6, and this configuration can suppress a loss of eddy current and reduction in the Q factor and inductance (L) of the inductive conductor section 4.