Abstract: A curable composition that maintains good handleability in the liquid form and that can be photo- or heat-cured to form a cured product having physical properties including both high transparency and high flexural strength. A curable composition includes, an epoxy compound of (1): [where each of E1, E2, and E3 is independently an organic group of Formula (2) or Formula (3); and each of R1, R2, and R3 is independently an optionally branched alkylene group or oxyalkylene group: (where R4 is a hydrogen atom or a methyl group)]; and an acid generator.

Abstract: [Problem] To provide a polymerizable composition having an excellent transparency in near-infrared wavelength and excellent heat resistance, and a method for producing the same.

Abstract: A curable composition that maintains good handleability in the liquid form and that can be photo- or heat-cured to form a cured product having physical properties including both high transparency and high flexural strength. A curable composition includes, an epoxy compound of (1): [where each of E1, E2, and E3 is independently an organic group of Formula (2) or Formula (3); and each of R1, R2, and R3 is independently an optionally branched alkylene group or oxyalkylene group: (where R4 is a hydrogen atom or a methyl group)]; and an acid generator.

Abstract: Disclosed are a polyamic acid containing not less than 10 mol % of a repeating unit represented by the formula [1] below, and a polyimide represented by the formula [2] below which is obtained from such a polyamic acid. The polyamic acid and polyimide have high heat resistance as shown by a thermal decomposition temperature of not less than 300° C. In addition, the polyamic acid and polyimide have good workability because of their high solubility in solvents, while exhibiting good light transmission. (In the formula, R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 and R4 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms or a phenyl group, or alternatively R3 and R4 on adjacent carbon atoms may combine together to form a cycloalkyl group having 3 to 8 carbon atoms or a phenyl group; R5 represents a divalent organic group; and n represents an integer of not less than 2.

Abstract: [Problems] The present invention provides a photosensitive composition capable of permanently forming a hologram having a low light scattering loss and high diffraction efficiency, and a forming method of a pattern. [Means for solving problems] A photosensitive composition used for forming a pattern by a pattern exposure containing (a) a polymerizable compound, (b) a photopolymerization initiator, and (c) organic-zirconia composite fine particles having a zirconia volume concentration of 20% by volume to 80% by volume; and a forming method of a pattern using the composition.

Abstract: Disclosed are a polyamic acid containing not less than 10 mol % of a repeating unit represented by the formula [1] below, and a polyimide represented by the formula [2] below which is obtained from such a polyamic acid. The polyamic acid and polyimide have high heat resistance as shown by a thermal decomposition temperature of not less than 300° C. In addition, the polyamic acid and polyimide have good workability because of their high solubility in solvents, while exhibiting good light transmission. (In the formulae, R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 and R4 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms or a phenyl group, or alternatively R3 and R4 on adjacent carbon atoms may combine together to form a cycloalkyl group having 3 to 8 carbon atoms or a phenyl group; R5 represents a divalent organic group; and n represents an integer of not less than 2.