Abstract: According to the present disclosure, a map matching apparatus includes a map information acquisition unit configured to acquire map information expressed by a plurality of links, a movement information acquisition unit configured to acquire movement information of a moving body on a predetermined route, and a matching unit configured to specify a link string, which is a string of the links corresponding to the route, based on the map information and the movement information, in which the matching unit is configured to generate a physical network, which is a road network, based on the connection relationship and the map information, generate a hierarchical logical network in which the physical network is duplicated in a plurality of layers and configured in a hierarchical manner, and specify the link string indicating a minimized cost in the hierarchical logical network.

Abstract: A process for producing a semiconductor package and a structure thereof are provided in that yield per unit wafer is increased, yield and reliability are improved, and the number of production steps are decreased. The process includes the steps of a step of forming a bump on a semiconductor wafer for respective semiconductor chip constituting a semiconductor package; a step of dicing a substrate, which has been prepared, into a substrate piece corresponding to the respective semiconductor chip; a step of die-boding the substrate piece, which has been diced, on the semiconductor wafer with making the bump to correspond to the respective semiconductor chip; a step of sealing a gap between the semiconductor wafer and the substrate piece, which have been die-bonded, with a resin; and a step of dicing the semiconductor wafer and the substrate piece, which have been sealed with the resin, into the respective semiconductor package.

Abstract: To provide a semiconductor device and its manufacturing method capable of enhancing the mounting strength.

Abstract: A process for producing a semiconductor package and a structure thereof are provided in that yield per unit wafer is increased, yield and reliability are improved, and the number of production steps are decreased. The process includes the steps of a step of forming a bump on a semiconductor wafer for respective semiconductor chip constituting a semiconductor package; a step of dicing a substrate, which has been prepared, into a substrate piece corresponding to the respective semiconductor chip; a step of die-boding the substrate piece, which has been diced, on the semiconductor wafer with making the bump to correspond to the respective semiconductor chip; a step of sealing a gap between the semiconductor wafer and the substrate piece, which have been die-bonded, with a resin; and a step of dicing the semiconductor wafer and the substrate piece, which have been sealed with the resin, into the respective semiconductor package.