Abstract: A process for producing a semiconductor package and a structure thereof are provided in that yield per unit wafer is increased, yield and reliability are improved, and the number of production steps are decreased. The process includes the steps of a step of forming a bump on a semiconductor wafer for respective semiconductor chip constituting a semiconductor package; a step of dicing a substrate, which has been prepared, into a substrate piece corresponding to the respective semiconductor chip; a step of die-boding the substrate piece, which has been diced, on the semiconductor wafer with making the bump to correspond to the respective semiconductor chip; a step of sealing a gap between the semiconductor wafer and the substrate piece, which have been die-bonded, with a resin; and a step of dicing the semiconductor wafer and the substrate piece, which have been sealed with the resin, into the respective semiconductor package.

Abstract: To provide a semiconductor device and its manufacturing method capable of enhancing the mounting strength.

Abstract: A process for producing a semiconductor package and a structure thereof are provided in that yield per unit wafer is increased, yield and reliability are improved, and the number of production steps are decreased. The process includes the steps of a step of forming a bump on a semiconductor wafer for respective semiconductor chip constituting a semiconductor package; a step of dicing a substrate, which has been prepared, into a substrate piece corresponding to the respective semiconductor chip; a step of die-boding the substrate piece, which has been diced, on the semiconductor wafer with making the bump to correspond to the respective semiconductor chip; a step of sealing a gap between the semiconductor wafer and the substrate piece, which have been die-bonded, with a resin; and a step of dicing the semiconductor wafer and the substrate piece, which have been sealed with the resin, into the respective semiconductor package.