Patents by Inventor Kentaro Okuno

Kentaro Okuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10202140
    Abstract: A pin assembly includes: a resin pin; and a collar fitted to a round shaft portion of the resin pin and having higher hardness than the resin pin. The round shaft portion is sheared to cancel connection between a first plate and a second plate upon secondary collision of a vehicle. The collar includes an end face received by a reception surface of the second plate, and shears the round shaft portion in a shear plane along the end face upon the secondary collision. The round shaft portion includes a hollow hole. An inner circumference of the hollow hole includes a straight portion which has a generating line parallel to an axial direction of the round shaft portion and which is traversed by a plane including the end face of the collar.
    Type: Grant
    Filed: December 25, 2014
    Date of Patent: February 12, 2019
    Assignees: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, DAIWA PLASTICS CO., LTD.
    Inventors: Eiji Tanaka, Susumu Imagaki, Hiroyuki Yao, Kenji Imamura, Kentaro Okuno, Eiji Hayashi
  • Publication number: 20160332657
    Abstract: A pin assembly includes: a resin pin; and a collar fitted to a round shaft portion of the resin pin and having higher hardness than the resin pin. The round shaft portion is sheared to cancel connection between a first plate and a second plate upon secondary collision of a vehicle. The collar includes an end face received by a reception surface of the second plate, and shears the round shaft portion in a shear plane along the end face upon the secondary collision. The round shaft portion includes a hollow hole. An inner circumference of the hollow hole includes a straight portion which has a generating line parallel to an axial direction of the round shaft portion and which is traversed by a plane including the end face of the collar.
    Type: Application
    Filed: December 25, 2014
    Publication date: November 17, 2016
    Applicants: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, DAIWA PLASTICS CO., LTD.
    Inventors: Eiji TANAKA, Susumu IMAGAKI, Hiroyuki YAO, Kenji IMAMURA, Kentaro OKUNO, Eiji HAYASHI
  • Patent number: 7993737
    Abstract: The invention provides a natural fiber-reinforced thermoplastic resin injection molding having an excellent ability to discharge static electricity. The natural fiber-reinforced thermoplastic resin injection molding is obtained by injection-molding with using natural fiber-reinforced thermoplastic resin pellets as a molding feedstock containing natural fibers as reinforcing fibers, has a natural fiber content of from 20 to 60 wt %. The natural fibers have an average length of from 1.5 to 4.0 mm. The natural fiber-reinforced thermoplastic resin injection molding has an electrostatic voltage half-life, as determined by the half-life measurement method specified in JIS L 1094, of less than 40 seconds.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: August 9, 2011
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Tatsuya Tanaka, Takayasu Fujiura, Naoki Kikuchi, Naoyuki Tashiro, Atsushi Yamamoto, Tsutomu Nagaoka, Kentaro Okuno
  • Publication number: 20110001268
    Abstract: The invention provides a natural fiber-reinforced thermoplastic resin injection molding having an excellent ability to discharge static electricity. The natural fiber-reinforced thermoplastic resin injection molding is obtained by injection-molding with using natural fiber-reinforced thermoplastic resin pellets as a molding feedstock containing natural fibers as reinforcing fibers, has a natural fiber content of from 20 to 60 wt %. The natural fibers have an average length of from 1.5 to 4.0 mm. The natural fiber-reinforced thermoplastic resin injection molding has an electrostatic voltage half-life, as determined by the half-life measurement method specified in JIS L 1094, of less than 40 seconds.
    Type: Application
    Filed: November 26, 2008
    Publication date: January 6, 2011
    Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO
    Inventors: Tatsuya Tanaka, Takayasu Fujiura, Naoki Kikuchi, Naoyuki Tashiro, Atsushi Yamamoto, Tsutomu Nagaoka, Kentaro Okuno