Patents by Inventor Kentaro TAKAO

Kentaro TAKAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module that have multiple paths for heat dissipation
    Patent number: 10217690
    Abstract: A semiconductor module includes a substrate, first and second wirings on the substrate, a semiconductor package disposed on the first wiring and having a pair of main electrodes on top and bottom surfaces of the semiconductor package, and a third wiring extending between the top surface of the semiconductor package and the second wiring.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: February 26, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tatsuo Tonedachi, Eitaro Miyake, Kentaro Takao
  • SEMICONDUCTOR MODULE THAT HAVE MULTIPLE PATHS FOR HEAT DISSIPATION
    Publication number: 20170154834
    Abstract: A semiconductor module includes a substrate, first and second wirings on the substrate, a semiconductor package disposed on the first wiring and having a pair of main electrodes on top and bottom surfaces of the semiconductor package, and a third wiring extending between the top surface of the semiconductor package and the second wiring.
    Type: Application
    Filed: August 4, 2016
    Publication date: June 1, 2017
    Inventors: Tatsuo TONEDACHI, Eitaro MIYAKE, Kentaro TAKAO