Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.

Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.

Abstract: A circuit board comprises at least a first wiring layer, a second wiring layer and a via. The first wiring layer is formed with a pair of first ends, a pair of second ends, a coupling portion, a pair of first trace portions and a pair of second trace portions. The coupling portion has a pair of first coupling points, a pair of second coupling points, an inner trace portion, an outer trace portion and a ground conductor portion. The inner trace portion has a length equal to a length of the outer trace portion. The ground conductor portion is arranged between the inner trace portion and the outer trace portion. The second wiring layer is formed with a ground pattern. The ground conductor portion is connected with the ground pattern through the via.

Abstract: A circuit board comprises at least a first wiring layer, a second wiring layer and a via. The first wiring layer is formed with a pair of first ends, a pair of second ends, a coupling portion, a pair of first trace portions and a pair of second trace portions. The coupling portion has a pair of first coupling points, a pair of second coupling points, an inner trace portion, an outer trace portion and a ground conductor portion. The inner trace portion has a length equal to a length of the outer trace portion. The ground conductor portion is arranged between the inner trace portion and the outer trace portion. The second wiring layer is formed with a ground pattern. The ground conductor portion is connected with the ground pattern through the via.

Abstract: A connector comprises a plurality of contacts which include signal contacts and predetermined contacts maintained at predetermined voltage levels. Each contact has a horizontal portion, an intersecting portion extending along a direction intersecting with the horizontal portion and a coupling portion coupling the horizontal portion and the intersecting portion to each other. The contacts include a first contact group consisting of the two predetermined contacts and one differential pair of the two signal contacts. In the first contact group, a size of the coupling portion of each of the predetermined contacts in the pitch direction is larger than another size of the coupling portion of each of the signal contacts in the pitch direction, and a size of the intersecting portion of each of the predetermined contacts in the pitch direction is larger than another size of the intersecting portion of each of the signal contacts in the pitch direction.

Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.

Abstract: A semiconductor device including an abnormality detection section that detects an abnormality occurring in a moving body that moves along a specific path on a surface of a specific object; a position detection section that detects a position of the moving body as an abnormality occurrence position, in a case in which the abnormality detection section has detected an abnormality, and that stores abnormality occurrence position information expressing the abnormality occurrence position in a storage section; and a moving body controller that controls an adjusting section to adjust at least one of a force with which the moving body presses against the specific object, or a position of the moving body in a direction intersecting the surface of the specific object, based on a detection result detected by the abnormality detection section and the abnormality occurrence position information.

Abstract: A semiconductor device including an abnormality detection section that detects an abnormality occurring in a moving body that moves along a specific path on a surface of a specific object; a position detection section that detects a position of the moving body as an abnormality occurrence position, in a case in which the abnormality detection section has detected an abnormality, and that stores abnormality occurrence position information expressing the abnormality occurrence position in a storage section; and a moving body controller that controls an adjusting section to adjust at least one of a force with which the moving body presses against the specific object, or a position of the moving body in a direction intersecting the surface of the specific object, based on a detection result detected by the abnormality detection section and the abnormality occurrence position information.

Abstract: A semiconductor device including an abnormality detection section that detects an abnormality occurring in a moving body that moves along a specific path on a surface of a specific object; a position detection section that detects a position of the moving body as an abnormality occurrence position, in a case in which the abnormality detection section has detected an abnormality, and that stores abnormality occurrence position information expressing the abnormality occurrence position in a storage section; and a moving body controller that controls an adjusting section to adjust at least one of a force with which the moving body presses against the specific object, or a position of the moving body in a direction intersecting the surface of the specific object, based on a detection result detected by the abnormality detection section and the abnormality occurrence position information.

Abstract: Provided is a connector, including a plurality of contacts including both of ground contacts and signal contacts forming a differential signal pair. The impedance between the signal contacts and the ground contacts is matched.

Abstract: A connector includes a plurality of signal contacts and a plurality of non-signal contacts arranged on at least one contact array plane, a ground plate disposed on a ground plane parallel to the contact array plane so as to face the plurality of signal contacts and the plurality of non-signal contacts, and an insulator which holds the plurality of signal contacts, the plurality of non-signal contacts and the ground plate, at least one of the non-signal contacts being disposed between each of the signal contacts and other of the signal contacts, the ground plate having at least one opening at a location facing the at least one of the non-signal contacts disposed between each of the signal contacts and other of the signal contacts, none of the signal contacts being disposed on the ground plane.

Abstract: Provided is a connector, including a plurality of contacts including both of ground contacts and signal contacts forming a differential signal pair. The impedance between the signal contacts and the ground contacts is matched.

Abstract: The present disclosure provides a semiconductor device including: an abnormality detection section that detects an abnormality occurring in a moving body that moves along a specific path on a surface of a specific object; a position detection section that detects a position of the moving body as an abnormality occurrence position, in a case in which the abnormality detection section has detected an abnormality, and that stores abnormality occurrence position information expressing the abnormality occurrence position in a storage section; and a moving body controller that controls an adjusting section to adjust at least one of a force with which the moving body presses against the specific object, or a position of the moving body in a direction intersecting the surface of the specific object, based on a detection result detected by the abnormality detection section and the abnormality occurrence position information.

Abstract: A connector includes a plurality of signal contacts and a plurality of non-signal contacts arranged on at least one contact array plane, a ground plate disposed on a ground plane parallel to the contact array plane so as to face the plurality of signal contacts and the plurality of non-signal contacts, and an insulator which holds the plurality of signal contacts, the plurality of non-signal contacts and the ground plate, at least one of the non-signal contacts being disposed between each of the signal contacts and other of the signal contacts, the ground plate having at least one opening at a location facing the at least one of the non-signal contacts disposed between each of the signal contacts and other of the signal contacts, none of the signal contacts being disposed on the ground plane.

Abstract: A connector includes a plurality of contacts, which are held by a holder member and are arranged in a pitch direction perpendicular to a front-rear direction. Each contact has a terminal portion to be connected and fixed to an object and a connection portion which is, at least in part, held by a plate-like portion of the holder member and is positioned forwards of the terminal portion in the front-rear direction. The connection portion has a first contact portion, a second contact portion and a rear connection portion. The first contact portion is, at least in part, exposed on the first surface. The second contact portion is, at least in part, exposed on the second surface. The rear connection portion connects a rear of the first contact portion with a rear of the second contact portion and is connected to the terminal portion.

Abstract: One lane is formed by a combination of two signal pins S and adjacent one or two ground pins G of a connector that handles differential signals. When allocating differential signals to pins staggered in two rows, for pin allocation on the board soldering side, (SGS) is allocated to a left end of a first row to form a first lane and then (SGS) is allocated to odd-numbered lanes and (GSSG) to even-numbered lanes while (GSSG) is allocated to a left end of a second row to form a first lane and then (GSSG) is allocated to odd-numbered lanes and (SGS) to even-numbered lanes.

Abstract: A connecting component includes a housing, housing connection terminals secured to the housing, an abutment located beneath the housing connection terminals, a first guide portion located beneath the housing connection terminals for regulating a position of a bottom surface of the subsidiary board, second guide portions located in front of the first guide portion as seen in a subsidiary board insertion direction for regulating the top surface of the subsidiary board, and third guide portions located in front of the first guide portion as seen in the subsidiary board insertion direction on a straight line passing through the first guide portion and the second guide portions and disposed in a position away from the abutment by a distance longer than an overall length of the subsidiary board, the third guide portions regulating the position of the bottom surface of the subsidiary board.

Abstract: A connector includes a plurality of contacts, which are held by a holder member and are arranged in a pitch direction perpendicular to a front-rear direction. Each contact has a terminal portion to be connected and fixed to an object and a connection portion which is, at least in part, held by a plate-like portion of the holder member and is positioned forwards of the terminal portion in the front-rear direction. The connection portion has a first contact portion, a second contact portion and a rear connection portion. The first contact portion is, at least in part, exposed on the first surface. The second contact portion is, at least in part, exposed on the second surface. The rear connection portion connects a rear of the first contact portion with a rear of the second contact portion and is connected to the terminal portion.

Abstract: One lane is formed by a combination of two signal pins S and adjacent one or two ground pins G of a connector that handles differential signals. When allocating differential signals to pins staggered in two rows, for pin allocation on the board soldering side, (SGS) is allocated to a left end of a first row to form a first lane and then (SGS) is allocated to odd-numbered lanes and (GSSG) to even-numbered lanes while (GSSG) is allocated to a left end of a second row to form a first lane and then (GSSG) is allocated to odd-numbered lanes and (SGS) to even-numbered lanes.

Abstract: A connecting component includes a housing, housing connection terminals secured to the housing, an abutment located beneath the housing connection terminals, a first guide portion located beneath the housing connection terminals for regulating a position of a bottom surface of the subsidiary board, second guide portions located in front of the first guide portion as seen in a subsidiary board insertion direction for regulating the top surface of the subsidiary board, and third guide portions located in front of the first guide portion as seen in the subsidiary board insertion direction on a straight line passing through the first guide portion and the second guide portions and disposed in a position away from the abutment by a distance longer than an overall length of the subsidiary board, the third guide portions regulating the position of the bottom surface of the subsidiary board.