Abstract: An electronic apparatus comprising a housing, a display panel provided in the housing and having a back wall, and a heat-radiating portion provided in the housing to radiate the heat generated by a heat-generating component. The heat-radiating portion opposes the back wall of the display panel. The display panel and the heat-radiating portion are coupled to each other by support members. The support members hold the display panel and the heat-radiating portion at specific positions in the housing.

Abstract: An electronic apparatus is provided with a main body having a heat generating component, a heat receiving portion thermally connected to the heat generating component, a display unit supported by the main body and having a display panel, a heat radiating portion contained in the display unit, and a circulation path which circulates a liquid refrigerant between the heat receiving portion and the heat radiating portion. The display unit contains a fan. The fan supplies cooling air to the heat radiating portion to cool the heat radiating portion by force.

Abstract: An electronic apparatus includes a housing which accommodates a heat generating component. A heat receiving portion thermally connected to the heat generating component is connected to a heat radiating portion via a circulating path through which a liquid coolant is circulated. The housing accommodates a heat sink which is separate from the heat radiating portion, and a fan. Part of heat from the heat generating component conducted to the heat receiving portion is conducted to the heat sink via a heat transferring member. The fan blows a cooling air against the heat sink.

Abstract: An electronic apparatus includes a main unit having a heat receiving portion which receives heat from a heat generating component, and a display unit supported by the main unit. The display unit accommodates a heat radiating portion. The heat radiating portion is connected to the heat receiving portion via a circulating path. The circulating path allows a liquid coolant to circulate between the heat receiving portion and the heat radiating portion to transfer the heat from the heat generating component to the heat radiating portion. A control device increases the amount of heat transferred from the heat receiving portion to the heat radiating portion when the display unit is moved to a closed position.

Abstract: An electronic apparatus includes a heat-generating component, a heat receiving portion thermally connected to the heat-generating component, a heat radiating portion to radiate heat generated y the heat-generating component, and a circulation path to circulate a liquid coolant between the heat receiving and radiating portions. The heat radiating portion has a circulation passage defined therein, a first region including a coolant inlet port, and a second region including a coolant outlet port. The circulation passage has first and second circulation passages. The first circulation passage extends from the coolant inlet port in the first region to a position distant from the coolant inlet port, and reaches the second region after passing beside the coolant inlet port again. The second circulation passage extends between the first circulation passage and the coolant outlet port in the second region.

Abstract: A heat receiving portion is thermally connected to a semiconductor package provided in a main unit. A display unit has a display panel and a display housing and is supported on the main unit. A heat radiating portion having a circulation channel is provided inside the display housing. A circulating path is arranged to extend between the main unit and the display unit in order to circulate a refrigerant between the heat receiving portion and the circulation channel in the heat radiating portion. The display housing is provided with a light transmitting portion formed of a transparent member in association with the heat radiating portion. A color changing layer is provided inside the display housing and changes its own color or color tone upon receiving heat radiated by the heat radiating portion.

Abstract: An electronic apparatus is provided with a housing containing a heat generating component, and a blower unit contained in the housing and used to cool the heat generating component. The blower unit includes an impeller, and a casing containing the impeller. The casing has suction ports, a chamber located around the impeller and a discharge port located at the downstream end of the chamber. The chamber has a depth gradually increased radially away from the impeller.

Abstract: An electronic apparatus comprises a housing containing a heat-generating component, and a cooling unit. The cooling unit includes a heat sink thermally connected to the heat-generating component, a first air passage for guiding air outside the housing to the heat sink and guiding air heated by heat exchange with the heat sink to the outside of the housing, and a second air passage for guiding air within the housing to the outside of the housing.

Abstract: A circuit module mounting structure and a method for mounting an IC chip in the circuit module applicable to electronic equipment with a slim body. To increase radiation efficiency of the heat emitted from the IC chip, a heat conducting element including a plurality of thin plates is provided between a radiation plate of a heat sink unit and a surface of the IC chip. Further, the plurality of thin plates of the heat conducting element have sufficient flexibility to absorb stresses appearing at coupling portions of the elements due to dimensional tolerances of the elements.

Abstract: A circuit module mounting structure and a method for mounting an IC chip in the circuit module applicable to electronic equipment with a slim body. To increase radiation efficiency of the heat emitted from the IC chip, a heat conducting element including a plurality of thin plates is provided between a radiation plate of a heat sink unit and a surface of the IC chip. Further, the plurality of thin plates of the heat conducting element have sufficient flexibility to absorb stresses appearing at coupling portions of the elements due to dimensional tolerances of the elements.

Abstract: A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located adjacent to the heat receiving portion and separate from the semiconductor package. The heat sink is movable toward and away from the semiconductor package, and always urged by a plate spring toward the semiconductor package. The electric fan device sends cooling air at least to the heat exchange portion of the heat sink.

Abstract: A cooling unit having a heat-receiving portion and a heat-exchanging portion. The heat-receiving portion is thermally connected to a heat-generating component. The heat-exchanging portion receives heat from the heat-receiving portion, at a position different from the position where the heat-generating component is provided. A part of the heat generated by the heat-generating component and transmitted to the heat-receiving portion is transferred to the heat-exchanging portion through a heat pipe. A fan device is provided between the heat-receiving portion and the heat-exchanging portion.

Abstract: The present invention is intended to improve the heat radiating performance of an electronic apparatus provided with semiconductor devices which generate heat at a high rate. An air passage (20) is formed in a case 10, and a fan (6) produces air currents in the air passage (20). Heat generated by a heat-generative part (1) mounted on a circuit board (2) is transferred to a wall (21) included in walls defining the air passage (20) by a heat transfer member (3), such as a heat pipe, and is carried outside the case 10 by cooling air flowing through the air passage (20).

Abstract: A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located adjacent to the heat receiving portion and separate from the semiconductor package. The heat sink is movable toward and away from the semiconductor package, and always urged by a plate spring toward the semiconductor package. The electric fan device sends cooling air at least to the heat exchange portion of the heat sink.

Abstract: An electronic apparatus having a housing that can be removably mounted on a base having an exhaust port. The housing has an inlet port and an outlet port communicating with the inlet port. The inlet port communicates with the exhaust port of the base while the housing remains mounted on the base. The housing contains a heat-generating component and a fan unit. The fan unit draws cooling air into the housing via the inlet port and applies the cooling air toward the outlet port, thereby cooling the heat-generating component.

Abstract: A portable electronic apparatus comprising a housing having a bottom, a metal frame provided in the housing, a circuit board supported by the frame, and an IC chip secured to the circuit board. The circuit board has a first surface extending substantially parallel to the bottom of the housing and a second surface opposing the first surface. The IC chip is adhered to the first surface of the circuit board and generating heat while operating. The apparatus further comprises a metal cover arranged on the first surface of the circuit board and covering the IC chip, and a metal shield plate covering the first surface of the circuit board and the metal cover. The frame has a heat-receiving part which contacts the second surface of the circuit board and which is located near the IC chip. A first thermally conductive elastic sheet is interposed between the cover and the IC chip, and a second thermally conductive elastic sheet is interposed between the cover and the shield plate.

Abstract: A dental glass ionomer cement composition comprises:(a) 5 to 100 parts by weight of a polymer of an .alpha.-.beta. unsaturated carboxylic acid having a weight average molecular weight of 5,000 to 40,000,(b) 5 to 100 parts by weight of a fluoroaluminosilicate glass powder having an average particle size of 0.02 to 10 .mu.m and a specific gravity of 2.4 to 4.0 and capable of reacting with said "polymer of an .alpha.-.beta. unsaturated carboxylic acid having a weight average molecular weight of 5,000 to 40,000",(c) 5 to 100 parts by weight of a polymerizable unsaturated organic compound having at least one CH.sub.2 .dbd.C(R1)--COO--group wherein R1=H or CH.sub.3,(d) 0.01 to 5 parts by weight of a polymerization catalyst,(e) 2 to 50 parts by weight of water,(f) 0.01 to 20 parts by weight of a surface active agent, and(g) 0.01 to 5 parts by weight of a reducing agent, and optionally h. 0 to 50 parts by weight of an inorganic filler having an average particle size of 0.02 to 10 .mu.

Abstract: A fluoroaluminosilicate glass powder for dental glass ionomer cements has a specific gravity of 2.4 to 3.5 and a mean particle size of 0.02 to 10 .mu.m, contains in its components 20 to 50% by weight of SiO.sub.2, 20 to 40% by weight of Al.sub.2 O.sub.3, 15 to 40% by weight of SrO, 1 to 20% by weight of F.sub.2 and 0 to 15% by weight of P.sub.2 O.sub.5 on the converted oxide basis, and is substantially free from alkali metal ions such as Li, Na, K, Rb and Cs ions, and Be, Mg (and Ca) and Ba ions of alkali earth metal ions. For further improvements in physical properties, 100 parts by weight of the glass powder are surface-treated with 0.01 to 5 parts by weight of an acid and/or a fluoride.

Abstract: A fluoroaluminosilicate glass powder for dental glass ionomer cement, a surface of which is treated with a fluoride in an amount of from 0.01 to 5 parts by weight based on 100 parts by weight of the glass powder, is disclosed. The fluoroaluminosilicate glass powder of the invention is improved in not only physical properties such as crushing strength but also mixing workability without impairing the inherent characteristics thereof for the dental use.

Abstract: A dental composite resin composition is disclosed, which comprises as main components a polymerizable monomer, an inorganic and/or organic filler, a gold powder and/or a gold-color alloy powder, and a polymerization catalyst. The dental composite resin composition of the present invention is useful as a filling material for repairing a tooth cavity, which has a gold-color luster and exhibits an excellent abrasion resistance as well as an excellent x-ray contrast.