Abstract: To provide a high-performance semiconductor sensor device and a method for manufacturing the semiconductor sensor device. This semiconductor sensor device has a sensor chip, and a first thin film formed on the sensor chip, said sensor chip being mechanically connected, via the first thin film, to a second thin film formed on a base formed of a polycrystalline material.

Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Abstract: A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Abstract: Provided are a mechanical quantity measurement device having a higher signal-to-noise ratio and resolution than the prior art and a pressure sensor using the same. A mechanical quantity measurement device that is provided with a plurality of Wheatstone bridges on the main surface of a single semiconductor substrate that are composed from impurity-diffused resistors and detect the difference between the strain amount occurring in the x-axis direction and the strain amount occurring in the y-axis direction, which intersect at right angles on the main surface of the semiconductor substrate, said mechanical quantity measurement device being characterized in that the impurity-diffused resistors composing the plurality of Wheatstone bridges are disposed evenly in an area to be measured.

Abstract: Provided are a dynamic quantity measuring device having higher accuracy and longer-term reliability than in the prior art, and a pressure sensor using the same. A dynamic quantity measuring device is provided with a first Wheatstone bridge configured by an impurity diffused resistor on a principal surface of one semiconductor substrate, and detects a difference between strain quantities respectively generated in an x-axis direction and a y-axis direction that are orthogonal to each other on the principal surface of the semiconductor substrate by the first Wheatstone bridge, the dynamic quantity measuring device being provided with, on the principal surface of the semiconductor substrate, a second Wheatstone bridge for detecting the strain quantity in the x-axis direction, and a third Wheatstone bridge for detecting the strain quantity in the y-axis direction.

Abstract: To provide a high-performance semiconductor sensor device and a method for manufacturing the semiconductor sensor device. This semiconductor sensor device has a sensor chip, and a first thin film formed on the sensor chip, said sensor chip being mechanically connected, via the first thin film, to a second thin film formed on a base formed of a polycrystalline material.

Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Abstract: Provided are a mechanical quantity measurement device having a higher signal-to-noise ratio and resolution than the prior art and a pressure sensor using the same. A mechanical quantity measurement device that is provided with a plurality of Wheatstone bridges on the main surface of a single semiconductor substrate that are composed from impurity-diffused resistors and detect the difference between the strain amount occurring in the x-axis direction and the strain amount occurring in the y-axis direction, which intersect at right angles on the main surface of the semiconductor substrate, said mechanical quantity measurement device being characterized in that the impurity-diffused resistors composing the plurality of Wheatstone bridges are disposed evenly in an area to be measured.

Abstract: A non-contact power-feeding device comprises: a power transmitting unit that includes a first antenna coil, an oscillator and a driver that enables generation of an AC magnetic field via the first antenna coil based upon a signal provided by the oscillator; and a power receiving unit that includes a second antenna coil that is magnetically coupled with the first antenna coil, wherein the first antenna coil comprises: a flat-plane spiral resonance coil wound with a plurality of turns; and a flat-plane spiral power-feeding coil that is wound with a plurality of turns outward relative to the resonance coil so as to surround the resonance coil, and is magnetically coupled with the resonance coil.

Abstract: A rotating body non-contact power-feeding device comprises: a power receiving-side substrate with a power receiving-side circuit component mounted thereat, which is fixed to a rotating shaft supported via a bearing and rotates as one with the rotating shaft; and a power transmitting-side substrate with a power transmitting-side circuit component mounted thereat, which is fixed to a holding unit holding the bearing so that a substrate surface thereof faces opposite a substrate surface of the power receiving-side substrate and is connected with a power source, wherein: a power transmitting-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with a plurality of turns at a substrate surface facing opposite the power receiving-side substrate and the power transmitting-side circuit component is mounted at another substrate surface, at the power transmitting-side substrate that includes a substrate front surface and a substrate back surface, a power receiving-side coil is forme

Abstract: Provided are a dynamic quantity measuring device having higher accuracy and longer-term reliability than in the prior art, and a pressure sensor using the same. A dynamic quantity measuring device is provided with a first Wheatstone bridge configured by an impurity diffused resistor on a principal surface of one semiconductor substrate, and detects a difference between strain quantities respectively generated in an x-axis direction and a y-axis direction that are orthogonal to each other on the principal surface of the semiconductor substrate by the first Wheatstone bridge, the dynamic quantity measuring device being provided with, on the principal surface of the semiconductor substrate, a second Wheatstone bridge for detecting the strain quantity in the x-axis direction, and a third Wheatstone bridge for detecting the strain quantity in the y-axis direction.

Abstract: A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Abstract: A non-contact power-feeding device comprises: a power transmitting unit that includes a first antenna coil, an oscillator and a driver that enables generation of an AC magnetic field via the first antenna coil based upon a signal provided by the oscillator; and a power receiving unit that includes a second antenna coil that is magnetically coupled with the first antenna coil, wherein the first antenna coil comprises: a flat-plane spiral resonance coil wound with a plurality of turns; and a flat-plane spiral power-feeding coil that is wound with a plurality of turns outward relative to the resonance coil so as to surround the resonance coil, and is magnetically coupled with the resonance coil.

Abstract: A rotating body non-contact power-feeding device comprises: a power receiving-side substrate with a power receiving-side circuit component mounted thereat, which is fixed to a rotating shaft supported via a bearing and rotates as one with the rotating shaft; and a power transmitting-side substrate with a power transmitting-side circuit component mounted thereat, which is fixed to a holding unit holding the bearing so that a substrate surface thereof faces opposite a substrate surface of the power receiving-side substrate and is connected with a power source, wherein: a power transmitting-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with a plurality of turns at a substrate surface facing opposite the power receiving-side substrate and the power transmitting-side circuit component is mounted at another substrate surface, at the power transmitting-side substrate that includes a substrate front surface and a substrate hack surface, a power receiving-side coil is forme