Abstract: In a brake-by-wire vehicle brake system that uses a solenoid shut-off valve (24a, 24b), the electric power supplied to the solenoid (33) of the solenoid shut-off valve is controlled so as to decelerate a movement of a plunger (31, 32) of the valve as the plunger reaches a point immediately adjacent to a terminal point thereof. Thereby, a highly responsive property can be achieved while the noises that are generated by the plunger striking a stopper (36) or a valve seat (34) can be minimized. When actuating the plunger in the valve closing direction, the solenoid may receive electric power at a first level, a second level lower than the first level and a third level intermediate between the first and second levels in that order.

Abstract: In a brake-by-wire vehicle brake system that uses a solenoid shut-off valve (24a, 24b), the electric power supplied to the solenoid (33) of the solenoid shut-off valve is controlled so as to decelerate a movement of a plunger (31, 32) of the valve as the plunger reaches a point immediately adjacent to a terminal point thereof. Thereby, a highly responsive property can be achieved while the noises that are generated by the plunger striking a stopper (36) or a valve seat (34) can be minimized. When actuating the plunger in the valve closing direction, the solenoid may receive electric power at a first level, a second level lower than the first level and a third level intermediate between the first and second levels in that order.

Abstract: A semiconductor chip includes a plurality of pads, input circuits or output circuits that are electrically connected to the pads, a main control unit that outputs a read access signal, the read access signal controlling reading of signals from an external circuit or an internal circuit, and activation control units that control activation of the input circuits or the output circuits that are electrically connected to the pads based on the read access signal, the pads receiving the signals from the external circuit or the internal circuit.

Abstract: A semiconductor chip includes a plurality of pads, input circuits or output circuits that are electrically connected to the pads, a main control unit that outputs a read access signal, the read access signal controlling reading of signals from an external circuit or an internal circuit, and activation control units that control activation of the input circuits or the output circuits that are electrically connected to the pads based on the read access signal, the pads receiving the signals from the external circuit or the internal circuit.

Abstract: A semiconductor laser device includes a semiconductor laser element, a lead having an element disposing section where elements are disposed and a resin bonded to the lead. The lead has a thick portion and a thin portion with the thick portion being formed to extend at least in the direction of the width of the resin to cover a region having a length equal to or greater then the width of the resin. A semiconductor laser device has a semiconductor laser element, a lead having an element mount portion on which the semiconductor laser element is mounted and a resin maintained in intimate contact with the lead. The lead has a thicker portion and a thinner portion. The thicker portion is formed to extend in the direction of the width of the resin over a width equal to or greater than the width of the resin.

Abstract: A semiconductor laser device comprising a semiconductor laser element, a lead frame having an element disposing section where elements are disposed, and a resin bonded to the lead frame, wherein the lead frame has a thick portion and a thin portion, the thick portion being formed to extend at least in the direction of the width of the resin to cover a region having a length equal to or greater than this width. Thereby, the thick-walled construction of the lead frame improves heat dissipation and strength. Also, it stabilizes the positioning reference plane and improves the accuracy of attachment.