Patents by Inventor Kento KOGA

Kento KOGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METAL COMPONENT
    Publication number: 20240079298
    Abstract: Provided is a metal component used for manufacturing a semiconductor device, the metal component including: a substrate having a conductivity; a nickel layer formed on a portion of a surface of the substrate and containing nickel as a main component; and a noble metal layer formed on a surface of the nickel layer.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Kento KOGA, Shintaro SUGYO, Tomokatsu KUNITAKE
  • METAL COMPONENT
    Publication number: 20220285252
    Abstract: There is provided a metal component used for manufacturing a semiconductor device, including: a base material having an electrical conductivity; a nickel layer formed on a surface of the base material and containing nickel as a main component; and a noble metal layer formed on a surface of the nickel layer. The nickel layer includes a first nickel layer not containing phosphorus, and a second nickel layer containing 0.01 to 1 in percent by weight of phosphorus. According to the metal component of the present disclosure, a thickness of the nickel layer can be reduced while good characteristics can be maintained.
    Type: Application
    Filed: February 23, 2022
    Publication date: September 8, 2022
    Applicant: MITSUI HIGH-TEC, INC.
    Inventors: Kento KOGA, Yoshihito MIYAUCHI, Kazunori WATANABE, Kimihiko KUBO