Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

Abstract: A rubber composition is prepared by mixing a specific hydrazide compound at a ratio of 0.5 to 3.0 parts by mass, zinc oxide at a ratio of 1 to 5 parts by mass, and carbon black having N2SA of 60 to 150 m2/g at a ratio of 30 to 60 parts by mass per 100 parts by mass of diene rubber containing 80 parts by mass or more of natural rubber. The rubber composition is prepared through (a) mixing the hydrazide compound and the carbon black to obtain a mixture, and (b) mixing the zinc oxide with the mixture obtained in step (a) to obtain a mixture. A maximum ultimate temperature during the mixture in step (a) is from 140 to 170° C. A storage modulus and elongation at break have a specific relationship.

Abstract: Disclosed are an element comprising a substrate and at least two different optoelectronic devices, wherein the at least two different optoelectronic devices are monolithically fabricated on the substrate; and a method for producing the same. Also disclosed is an organic semiconductor laser diode comprising a substrate, an insulating grating, a first electrode, an organic layer and a second electrode in this order.

Abstract: An optical module includes an optical semiconductor chip including a first electrode pad, a second electrode pad, and a third electrode pad arranged between the first electrode pad and the second electrode pad, a wiring substrate on which the optical semiconductor chip is flip-chip mounted, including a fourth electrode pad, a fifth electrode pad, and a sixth electrode pad arranged between the fourth electrode pad and the fifth electrode pad, a first conductive material connecting the first electrode pad with the fourth electrode pad, a second conductive material connecting the second electrode pad with the fifth electrode pad, a third conductive material arranged between the first conductive material and the second conductive material, connecting the third electrode pad with the sixth electrode pad, and a resin provided in an area on the second conductive material side of the third conductive material between the optical semiconductor chip and the wiring substrate.

Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

Abstract: An optical module includes an optical semiconductor chip including a first electrode pad, a second electrode pad, and a third electrode pad arranged between the first electrode pad and the second electrode pad, a wiring substrate on which the optical semiconductor chip is flip-chip mounted, including a fourth electrode pad, a fifth electrode pad, and a sixth electrode pad arranged between the fourth electrode pad and the fifth electrode pad, a first conductive material connecting the first electrode pad with the fourth electrode pad, a second conductive material connecting the second electrode pad with the fifth electrode pad, a third conductive material arranged between the first conductive material and the second conductive material, connecting the third electrode pad with the sixth electrode pad, and a resin provided in an area on the second conductive material side of the third conductive material between the optical semiconductor chip and the wiring substrate.

Abstract: A method of producing a separator (20) of the present invention is a method of producing the separator (20) which includes a resin layer (21), and a ceramic layer (23) provided on one surface of the resin layer (21), the method including a step of cutting the separator into a predetermined size by irradiating the separator with a laser having a wavelength of greater than or equal to 300 nm and less than or equal to 600 nm from a side of the ceramic layer (23). Further, the separator (20) of the present invention includes the resin layer (21), the ceramic layer (23) which is provided on one surface of the resin layer (21), and a curled portion (27) which is formed by curling at least one end portion (25) of the separator (20) toward a surface on a side of the resin layer (21).

Abstract: This battery is provided with: an electrode assembly (20) resulting from stacking a positive electrode, a negative electrode, and a separator arranged between the positive electrode and the negative electrode, and an external sheathing film (12) composed of a pair of resin layers, of which outer peripheries are heat-welded together, and that sandwich the electrode assembly (20). At least one of the electrode assembly has a protruding part (24) that protrudes from the electrodes, and is interposed at a peripheral area by the welded portion of the external sheathing film (12), and that restrains movement of the separators.