Patents by Inventor Kento Tsuda

Kento Tsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250196187
    Abstract: A resin composition according to an embodiment is a resin composition being a precursor of an acoustic matching layer for an ultrasound transducer element included in an ultrasound transducer element unit having an array transducer element including a piezoelectric body and an electrode. The resin composition includes resin and inorganic material particles, while satisfying 2.3?Z/???3.4 where Z denotes an acoustic impedance of the acoustic matching layer, whereas ? denotes the density of the inorganic material particles.
    Type: Application
    Filed: December 19, 2024
    Publication date: June 19, 2025
    Applicant: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Masahide IWAKATA, Shuhei IKEDA, Kento TSUDA
  • Publication number: 20240247137
    Abstract: A resin molded article including an ethylene vinyl acetate copolymer resin and carbon black as primary components. After the resin molded article is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 degrees Celsius, the shrinkage factor of the resin molded article at 25 degrees Celsius cooled after heated to 100 degrees Celsius relative to the resin molded article at 25 degrees Celsius before heated is less than or equal to 2.0%.
    Type: Application
    Filed: April 5, 2024
    Publication date: July 25, 2024
    Inventors: Akira Yane, Kento Tsuda, Daisuke Tanaka
  • Patent number: 11987691
    Abstract: A resin molded article including an ethylene vinyl acetate copolymer resin and carbon black as primary components. After the resin molded article is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 degrees Celsius, the shrinkage factor of the resin molded article at 25 degrees Celsius cooled after heated to 100 degrees Celsius relative to the resin molded article at 25 degrees Celsius before heated is less than or equal to 2.0%.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: May 21, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Akira Yane, Kento Tsuda, Daisuke Tanaka
  • Publication number: 20240130008
    Abstract: The planar heat-generating element includes: a base material; a heat-generating layer formed on the base material, the heat-generating layer having conductivity; a pair of electrodes arranged to be brought into contact with the heat-generating layer; and a protective layer, wherein the pair of electrodes are arranged so as to be opposed to each other in a direction parallel to a first direction, wherein the heat-generating layer has a plurality of holes in a region between the pair of electrodes, wherein, when widths of two holes out of the plurality of holes in a second direction orthogonal to the first direction, the two holes being present adjacent to each other on one and the same straight line parallel to the second direction and an interval between the two holes in a direction parallel to the second direction satisfy a specific relationship.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 18, 2024
    Inventors: KEISUKE ABE, KENTO TSUDA, MASATO MAMISHIN
  • Patent number: 11795294
    Abstract: A resin composition containing a resin, a magnetic powder, a first non-magnetic powder with a water-soluble content in the range of 0.1% to 0.5%, and a second non-magnetic powder with a water-soluble content of 0.05% or less.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: October 24, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kento Tsuda, Akira Yane
  • Publication number: 20220315734
    Abstract: A resin composition containing a resin, a magnetic powder, a first non-magnetic powder with a water-soluble content in the range of 0.1% to 0.5%, and a second non-magnetic powder with a water-soluble content of 0.05% or less.
    Type: Application
    Filed: March 24, 2022
    Publication date: October 6, 2022
    Inventors: Kento Tsuda, Akira Yane
  • Publication number: 20220306832
    Abstract: A resin molded body contains a resin, a magnetic powder, and a non-magnetic powder. The non-magnetic powder has an apparent density in the range of 0.70 to 1.0 g/cm3. The non-magnetic powder content is more than 8% by volume and 40% or less by volume.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 29, 2022
    Inventors: Akira Yane, Kento Tsuda
  • Publication number: 20220081543
    Abstract: A resin molded article including an ethylene vinyl acetate copolymer resin and carbon black as primary components. After the resin molded article is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 degrees Celsius, the shrinkage factor of the resin molded article at 25 degrees Celsius cooled after heated to 100 degrees Celsius relative to the resin molded article at 25 degrees Celsius before heated is less than or equal to 2.0%.
    Type: Application
    Filed: November 23, 2021
    Publication date: March 17, 2022
    Inventors: Akira Yane, Kento Tsuda, Daisuke Tanaka
  • Patent number: 11208545
    Abstract: A resin molded article including an ethylene vinyl acetate copolymer resin and carbon black as primary components. After the resin molded article is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 degrees Celsius, the shrinkage factor of the resin molded article at 25 degrees Celsius cooled after heated to 100 degrees Celsius relative to the resin molded article at 25 degrees Celsius before heated is less than or equal to 2.0%.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: December 28, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akira Yane, Kento Tsuda, Daisuke Tanaka
  • Publication number: 20200190300
    Abstract: A resin molded article including an ethylene vinyl acetate copolymer resin and carbon black as primary components. After the resin molded article is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 degrees Celsius, the shrinkage factor of the resin molded article at 25 degrees Celsius cooled after heated to 100 degrees Celsius relative to the resin molded article at 25 degrees Celsius before heated is less than or equal to 2.0%.
    Type: Application
    Filed: December 9, 2019
    Publication date: June 18, 2020
    Inventors: Akira Yane, Kento Tsuda, Daisuke Tanaka