Patents by Inventor Kenya TAKIMOTO
Kenya TAKIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240244742Abstract: A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.Type: ApplicationFiled: January 28, 2022Publication date: July 18, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
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Publication number: 20240244756Abstract: An assembly sheet includes a supporting portion, a plurality of wiring circuit boards, and a joint portion. The supporting portion supports the plurality of wiring circuit boards. The supporting portion surrounds the plurality of wiring circuit boards while being separated from the plurality of wiring circuit boards by an interval. The joint portion joins the plurality of wiring circuit boards to the supporting portion. The plurality of wiring circuit boards includes a first wiring circuit board and a second wiring circuit board. The second wiring circuit board is arranged next to the first wiring circuit board while being separated from the first wiring circuit board by an interval. The second wiring circuit board is symmetrical to the first wiring circuit board with respect to a point centered therebetween. The supporting portion includes a first and second mark. The second mark is asymmetrical to the first with respect to the point.Type: ApplicationFiled: January 4, 2024Publication date: July 18, 2024Applicant: NITTO DENKO CORPORATIONInventors: Chihiro WATANABE, Kenya TAKIMOTO
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Patent number: 12035484Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.Type: GrantFiled: March 31, 2020Date of Patent: July 9, 2024Assignee: NITTO DENKO CORPORATIONInventors: Kenya Takimoto, Naoki Shibata, Hayato Takakura
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Publication number: 20240107679Abstract: An assembly sheet includes a plurality of wiring circuit boards, a support portion, a connecting portion, and an opening portion. The wiring circuit board includes a first and a second wiring circuit board. The connecting portion includes a first and a second connecting portion connected to the first and the second wiring circuit board, respectively. The support portion and the connecting portion are not disposed between the first and the second wiring circuit board. The first wiring circuit board includes a first main body portion and a first protrusion portion. The second wiring circuit board includes a second main body portion. A first line passing a center of the first main body portion and a second line passing the center of the second main body portion are deviated so that a protrusion amount of the first protrusion portion with respect to the second main body portion is small.Type: ApplicationFiled: September 13, 2023Publication date: March 28, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kenya TAKIMOTO, Hiroaki MACHITANI
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Publication number: 20230254971Abstract: Provided is a wiring circuit board and a wiring circuit board assembly that allow suppression of the recognition error of the dot pattern. The wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.Type: ApplicationFiled: February 1, 2023Publication date: August 10, 2023Applicant: NITTO DENKO CORPORATIONInventors: Hayato TAKAKURA, Naoki SHIBATA, Kenya TAKIMOTO, Chihiro WATANABE
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Publication number: 20230007783Abstract: A method for producing a wiring circuit board includes first forming a base insulating layer, and second forming a first wiring and a second wiring having different thicknesses from each other in order. The second step includes, in order, forming a seed film, forming a first resist in a reversed pattern of the first wiring on one surface in a thickness direction of the seed film, forming the first wiring on one surface in the thickness direction of the seed film by plating, removing the first resist, of forming a second resist in a reversed pattern of the second wiring on one surface in the thickness direction of the seed film to cover the first wiring, forming the second wiring on one surface in the thickness direction of the seed film by plating, removing the second resist, and removing the seed film.Type: ApplicationFiled: November 27, 2020Publication date: January 5, 2023Applicant: NITTO DENKO CORPORATIONInventors: Masaki ITO, Hayato TAKAKURA, Kenya TAKIMOTO
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Publication number: 20230007785Abstract: A method for producing a wiring circuit board includes a first step, a second step, and a third step. In the first step, while a work film which is a long metal substrate having a first surface and a second surface opposite to the first surface is fed and wound by a roll-to-roll method, a composition containing a photosensitive resin is applied onto the first surface to form an insulating film, and a protective film is interposed between the second surface and the insulating film of the work film in being wound. In the second step, while the work film having undergone the first step is fed and wound by the roll-to-roll method, the protective film is peeled from the insulating film, and the insulating film is subjected to light exposure treatment to be formed with a latent image pattern. In a third step, the insulating film having undergone the second step is subjected to development treatment to be patterned.Type: ApplicationFiled: November 5, 2020Publication date: January 5, 2023Applicant: NITTO DENKO CORPORATIONInventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
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Publication number: 20220256712Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.Type: ApplicationFiled: April 8, 2020Publication date: August 11, 2022Applicant: NITTO DENKO CORPORATIONInventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
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Publication number: 20220201871Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.Type: ApplicationFiled: March 31, 2020Publication date: June 23, 2022Applicant: NITTO DENKO CORPORATIONInventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
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Patent number: 11284503Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.Type: GrantFiled: May 10, 2019Date of Patent: March 22, 2022Assignee: NITTO DENKO CORPORATIONInventors: Masaki Ito, Naoki Shibata, Yasunari Oyabu, Kenya Takimoto
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Patent number: 11272615Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.Type: GrantFiled: May 10, 2019Date of Patent: March 8, 2022Assignee: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Hiroaki Machitani, Yasunari Oyabu, Masaki Ito, Kenya Takimoto
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Publication number: 20210212208Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.Type: ApplicationFiled: May 10, 2019Publication date: July 8, 2021Applicant: NITTO DENKO CORPORATIONInventors: Naoki SHIBATA, Hiroaki MACHITANI, Yasunari OYABU, Masaki ITO, Kenya TAKIMOTO
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Publication number: 20210212196Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.Type: ApplicationFiled: May 10, 2019Publication date: July 8, 2021Applicant: NITTO DENKO CORPORATIONInventors: Masaki ITO, Naoki SHIBATA, Yasunari OYABU, Kenya TAKIMOTO