Patents by Inventor Kenya TAKIMOTO

Kenya TAKIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107679
    Abstract: An assembly sheet includes a plurality of wiring circuit boards, a support portion, a connecting portion, and an opening portion. The wiring circuit board includes a first and a second wiring circuit board. The connecting portion includes a first and a second connecting portion connected to the first and the second wiring circuit board, respectively. The support portion and the connecting portion are not disposed between the first and the second wiring circuit board. The first wiring circuit board includes a first main body portion and a first protrusion portion. The second wiring circuit board includes a second main body portion. A first line passing a center of the first main body portion and a second line passing the center of the second main body portion are deviated so that a protrusion amount of the first protrusion portion with respect to the second main body portion is small.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Hiroaki MACHITANI
  • Publication number: 20230254971
    Abstract: Provided is a wiring circuit board and a wiring circuit board assembly that allow suppression of the recognition error of the dot pattern. The wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.
    Type: Application
    Filed: February 1, 2023
    Publication date: August 10, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Naoki SHIBATA, Kenya TAKIMOTO, Chihiro WATANABE
  • Publication number: 20230007783
    Abstract: A method for producing a wiring circuit board includes first forming a base insulating layer, and second forming a first wiring and a second wiring having different thicknesses from each other in order. The second step includes, in order, forming a seed film, forming a first resist in a reversed pattern of the first wiring on one surface in a thickness direction of the seed film, forming the first wiring on one surface in the thickness direction of the seed film by plating, removing the first resist, of forming a second resist in a reversed pattern of the second wiring on one surface in the thickness direction of the seed film to cover the first wiring, forming the second wiring on one surface in the thickness direction of the seed film by plating, removing the second resist, and removing the seed film.
    Type: Application
    Filed: November 27, 2020
    Publication date: January 5, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masaki ITO, Hayato TAKAKURA, Kenya TAKIMOTO
  • Publication number: 20230007785
    Abstract: A method for producing a wiring circuit board includes a first step, a second step, and a third step. In the first step, while a work film which is a long metal substrate having a first surface and a second surface opposite to the first surface is fed and wound by a roll-to-roll method, a composition containing a photosensitive resin is applied onto the first surface to form an insulating film, and a protective film is interposed between the second surface and the insulating film of the work film in being wound. In the second step, while the work film having undergone the first step is fed and wound by the roll-to-roll method, the protective film is peeled from the insulating film, and the insulating film is subjected to light exposure treatment to be formed with a latent image pattern. In a third step, the insulating film having undergone the second step is subjected to development treatment to be patterned.
    Type: Application
    Filed: November 5, 2020
    Publication date: January 5, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
  • Publication number: 20220256712
    Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.
    Type: Application
    Filed: April 8, 2020
    Publication date: August 11, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
  • Publication number: 20220201871
    Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.
    Type: Application
    Filed: March 31, 2020
    Publication date: June 23, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
  • Patent number: 11284503
    Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 22, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masaki Ito, Naoki Shibata, Yasunari Oyabu, Kenya Takimoto
  • Patent number: 11272615
    Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 8, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoki Shibata, Hiroaki Machitani, Yasunari Oyabu, Masaki Ito, Kenya Takimoto
  • Publication number: 20210212208
    Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 8, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoki SHIBATA, Hiroaki MACHITANI, Yasunari OYABU, Masaki ITO, Kenya TAKIMOTO
  • Publication number: 20210212196
    Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 8, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masaki ITO, Naoki SHIBATA, Yasunari OYABU, Kenya TAKIMOTO