Patents by Inventor Kenya TAKIMOTO

Kenya TAKIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220256712
    Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.
    Type: Application
    Filed: April 8, 2020
    Publication date: August 11, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
  • Publication number: 20220201871
    Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.
    Type: Application
    Filed: March 31, 2020
    Publication date: June 23, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
  • Patent number: 11284503
    Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 22, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masaki Ito, Naoki Shibata, Yasunari Oyabu, Kenya Takimoto
  • Patent number: 11272615
    Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 8, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoki Shibata, Hiroaki Machitani, Yasunari Oyabu, Masaki Ito, Kenya Takimoto
  • Publication number: 20210212208
    Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 8, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoki SHIBATA, Hiroaki MACHITANI, Yasunari OYABU, Masaki ITO, Kenya TAKIMOTO
  • Publication number: 20210212196
    Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 8, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masaki ITO, Naoki SHIBATA, Yasunari OYABU, Kenya TAKIMOTO