Patents by Inventor Kenzaburo Kawai

Kenzaburo Kawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
    Patent number: 9966517
    Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: May 8, 2018
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori Oda, Akira Sakamoto, Yoshinori Murata, Kenzaburo Kawai, Koichi Suzuki, Megumi Oishi
  • LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
    Patent number: 9887331
    Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: February 6, 2018
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori Oda, Akira Sakamoto, Yoshinori Murata, Kenzaburo Kawai, Koichi Suzuki, Megumi Oishi
  • LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LED LEADFRAME OR LED SUBSTRATE
    Publication number: 20160099395
    Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
    Type: Application
    Filed: December 10, 2015
    Publication date: April 7, 2016
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori ODA, Akira SAKAMOTO, Yoshinori MURATA, Kenzaburo KAWAI, Koichi SUZUKI, Megumi OISHI
  • LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
    Patent number: 9263315
    Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: February 16, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori Oda, Akira Sakamoto, Yoshinori Murata, Kenzaburo Kawai, Koichi Suzuki, Megumi Oishi
  • LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LED LEADFRAME OR LED SUBSTRATE
    Publication number: 20150325763
    Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
    Type: Application
    Filed: July 17, 2015
    Publication date: November 12, 2015
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori ODA, Akira SAKAMOTO, Yoshinori MURATA, Kenzaburo KAWAI, Koichi SUZUKI, Megumi OISHI
  • LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LED LEADFRAME OR LED SUBSTRATE
    Publication number: 20120313131
    Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
    Type: Application
    Filed: March 30, 2011
    Publication date: December 13, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori Oda, Akira Sakamoto, Yoshinori Murata, Kenzaburo Kawai, Koichi Suzuki, Megumi Oishi
  • Multi-layer printed-wiring board process for producing
    Patent number: 6378199
    Abstract: A multi-layer printed-wiring board including a substrate having a plurality of wiring pattern layers sequentially transferred thereon, each wiring pattern layer containing an electrically conductive layer and an electrically insulating layer. The wiring pattern layers are attached to the substrate through an electrically insulating layer.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: April 30, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroto Yoshinuma, Kenzaburo Kawai, Shinichi Kobayashi