Patents by Inventor Kenzi Miyazima

Kenzi Miyazima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding apparatus for semiconductor device
    Patent number: 4466565
    Abstract: At least first and second ultrasonic horns are coupled to one capillary in a state wherein a prescribed angle is defined therebetween. In accordance with the angle defined by a straight line connecting a pad on a semiconductor pellet and a corresponding inner lead of a lead frame with respect to a prescribed direction, control is made of the amounts of ultrasonic wave energy to be applied to the first and second ultrasonic horns. The bonding portion is bonded by the capillary in accordance with a composite vector of those vectors corresponding to the energies supplied to the first and second ultrasonic horns.
    Type: Grant
    Filed: September 24, 1982
    Date of Patent: August 21, 1984
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventor: Kenzi Miyazima