Patents by Inventor Kenzo Maejima

Kenzo Maejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140205816
    Abstract: According to the present invention, a dicing-tape-integrated adhesive sheet is provided in which connection between terminals of opposing members and encapsulating of voids between the members can be simultaneously performed and thus excellent workability is achieved. The dicing-tape-integrated adhesive sheet of the present invention has a laminated structure including an adhesive film which has a first terminal of a support body and a second terminal of an adherend that are electrically connected using solder and by which the support body and the adherend are adhered to each other and a dicing tape. When it is assumed that an adhesion temperature when the adhesive film is adhered to a surface on which the first terminal of the support body is formed is T[° C.], a pressure applied to the adhesive film is P[MPa], and a melt viscosity of the adhesive film at the adhesion temperature is ?[Pa·s], a relationship of 1.2×103?(T×P)/??1.5×109 is satisfied.
    Type: Application
    Filed: July 6, 2012
    Publication date: July 24, 2014
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Kenzo Maejima
  • Publication number: 20110311790
    Abstract: The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising: a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step/solidifying step in which the resin composition is cured or solidified.
    Type: Application
    Filed: September 3, 2009
    Publication date: December 22, 2011
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Wataru Okada, Michinori Yamamoto, Toshiaki Chuma, Kenzo Maejima, Tomohiro Kagimoto, Satoru Katsurayama, Tomoe Fujii