Abstract: The present invention provides an epoxy resin composition containing: a component (A): epoxy resin; a component (B): microcapsular curing agent; a component (C): reactive diluent; and a component (D): compound represented by formula (1) below: wherein X1 has 2 or more and 5 or less consecutive carbon-carbon bonds, and a substituent of carbon contained in X1 and R1 to R5 are each one selected from the group consisting of hydrogen, an alkyl group, an unsaturated aliphatic group, an aromatic group, a heteroatom-containing substituent, a halogen atom-containing substituent, and a halogen atom; the substituent of carbon contained in X1 and R1 to R5 are the same as or different from each other; and the compound is optionally a fused ring compound in which any of R1 to R5 are present in the same ring.

Abstract: An epoxy resin composition comprising an epoxy resin (A) and a latent curing agent (B), wherein the latent curing agent (B) is solid at 25° C.

Abstract: A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130° C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85° C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.

Abstract: A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130° C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85° C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.

Abstract: The present invention provides an epoxy resin composition including an epoxy resin represented by the following formula (1) and an epoxy resin represented by the following formula (2):

Abstract: The present invention provides an epoxy resin composition including an epoxy resin represented by the following formula (1) and an epoxy resin represented by the following formula (2):

Abstract: A process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass % or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether:solvent) (mass ratio) is provided at 0.4:100 to 40:100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator:solvent) (mass ratio) is provided at 0.5:100 to 5:100 (mass ratio).

Abstract: A process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass % or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether:solvent) (mass ratio) is provided at 0.4:100 to 40:100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator:solvent) (mass ratio) is provided at 0.5:100 to 5:100 (mass ratio).

Abstract: The present invention relates to an epoxy resin composition comprising a polyphenylene ether having a number average molecular weight of 1,000, to 4,000 and containing components having a molecular weight of 20,000 or more in an amount of substantially 20% or less, and an epoxy resin. The present invention further relates to an epoxylated polyphenylene ether resin obtained by reacting a phenolic hydroxyl group of a polyphenylene ether having a number average molecular weight of 1,000 to 4,000 with an epoxy group of an epoxy compound or an epoxy resin.

Abstract: The present invention provides an amorphous porous inorganic substance having small particle sizes and uniform pores, a process for synthesizing the same, and use of the same. The invention provides an amorphous porous inorganic substance having pores of a uniform pore diameter, which has an average particle size DL of 10 to 400 nm as measured by a dynamic light scattering method and a specific surface area difference, SB-SL, between a conversion specific surface area SL calculated from DL and a nitrogen adsorption specific surface area SB obtained by the BET method, of 250 m2/g or more. A process for synthesizing the same and use of the same are also disclosed.

Abstract: An object of the present invention is to provide a sol of an inorganic porous substance having a small particle diameter and a uniform pore diameter, and a synthetic method thereof, and uses using the same, in particular, an ink-jet recording medium excellent in ink absorbing property, transparency, water resistance and light resistance, and a coating liquid for an ink-jet recording medium. The invention relates to a sol containing an inorganic porous substance, the inorganic porous substance having an average particle diameter, measured by the dynamic light scattering method, of 10 nm to 400 nm, an average aspect ratio of its primary particles of 2 or more and meso-pores extending in the longitudinal direction, and suffering from substantially no secondary aggregation.