Patents by Inventor Kenzo Onizuka

Kenzo Onizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11104760
    Abstract: A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130° C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85° C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: August 31, 2021
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Kenzo Onizuka, Yoshinori Ozumi, Takanori Maeda
  • Publication number: 20200087445
    Abstract: A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130° C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85° C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.
    Type: Application
    Filed: March 16, 2018
    Publication date: March 19, 2020
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Kenzo ONIZUKA, Yoshinori OZUMI, Takanori MAEDA
  • Patent number: 9574045
    Abstract: The present invention provides an epoxy resin composition including an epoxy resin represented by the following formula (1) and an epoxy resin represented by the following formula (2):
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: February 21, 2017
    Assignee: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Teruhisa Yamada, Kenzo Onizuka, Kozo Yoshida, Seiji Yamaguchi
  • Publication number: 20150183924
    Abstract: The present invention provides an epoxy resin composition including an epoxy resin represented by the following formula (1) and an epoxy resin represented by the following formula (2):
    Type: Application
    Filed: July 31, 2013
    Publication date: July 2, 2015
    Applicant: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Teruhisa Yamada, Kenzo Onizuka, Kozo Yoshida, Seiji Yamaguchi
  • Patent number: 7858726
    Abstract: A process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass % or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether:solvent) (mass ratio) is provided at 0.4:100 to 40:100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator:solvent) (mass ratio) is provided at 0.5:100 to 5:100 (mass ratio).
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: December 28, 2010
    Assignee: Asahi Kasei Chemichals Corporation
    Inventors: Kenzo Onizuka, Minoru Sakurai
  • Publication number: 20090018303
    Abstract: A process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass % or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether:solvent) (mass ratio) is provided at 0.4:100 to 40:100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator:solvent) (mass ratio) is provided at 0.5:100 to 5:100 (mass ratio).
    Type: Application
    Filed: February 14, 2007
    Publication date: January 15, 2009
    Applicant: Asahi Kasei Chemicals Corporation
    Inventors: Kenzo Onizuka, Minoru Sakurai
  • Publication number: 20070093614
    Abstract: The present invention relates to an epoxy resin composition comprising a polyphenylene ether having a number average molecular weight of 1,000, to 4,000 and containing components having a molecular weight of 20,000 or more in an amount of substantially 20% or less, and an epoxy resin. The present invention further relates to an epoxylated polyphenylene ether resin obtained by reacting a phenolic hydroxyl group of a polyphenylene ether having a number average molecular weight of 1,000 to 4,000 with an epoxy group of an epoxy compound or an epoxy resin.
    Type: Application
    Filed: May 21, 2004
    Publication date: April 26, 2007
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Hiroshi Uchida, Kenzo Onizuka, Yoshihiko Takada, Tetsuji Tokiwa
  • Publication number: 20050031896
    Abstract: The present invention provides an amorphous porous inorganic substance having small particle sizes and uniform pores, a process for synthesizing the same, and use of the same. The invention provides an amorphous porous inorganic substance having pores of a uniform pore diameter, which has an average particle size DL of 10 to 400 nm as measured by a dynamic light scattering method and a specific surface area difference, SB-SL, between a conversion specific surface area SL calculated from DL and a nitrogen adsorption specific surface area SB obtained by the BET method, of 250 m2/g or more. A process for synthesizing the same and use of the same are also disclosed.
    Type: Application
    Filed: September 10, 2004
    Publication date: February 10, 2005
    Inventors: Seiji Satou, Yasuhide Isobe, Kenzo Onizuka
  • Publication number: 20050020699
    Abstract: An object of the present invention is to provide a sol of an inorganic porous substance having a small particle diameter and a uniform pore diameter, and a synthetic method thereof, and uses using the same, in particular, an ink-jet recording medium excellent in ink absorbing property, transparency, water resistance and light resistance, and a coating liquid for an ink-jet recording medium. The invention relates to a sol containing an inorganic porous substance, the inorganic porous substance having an average particle diameter, measured by the dynamic light scattering method, of 10 nm to 400 nm, an average aspect ratio of its primary particles of 2 or more and meso-pores extending in the longitudinal direction, and suffering from substantially no secondary aggregation.
    Type: Application
    Filed: December 24, 2002
    Publication date: January 27, 2005
    Inventors: Yasuhide Isobe, Masakatsu Kuroki, Kenzo Onizuka, Hideaki Niiro