Patents by Inventor Kenzo TERAMOTO

Kenzo TERAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9499713
    Abstract: A resin particle aggregate is the resin particle aggregate formed by aggregating a plurality of resin particles including a polymer of a vinyl monomer, includes 100 parts by mass of the resin particles and 1 to 5 parts by mass of a surfactant. The resin particles are cross-linked by a cross-linkable monomer in an amount of 10 to 50% by mass relative to the total mass of the resin particles, the resin particle aggregate contains an inorganic component in an amount of 0.5% by mass or less, the resin particles have a volume average particle diameter D1, particles contained in a dispersion liquid of the resin particle aggregate in water have a volume average particle diameter D2, and the ratio of D2/D1 is 15 or less.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: November 22, 2016
    Assignee: Sekisui Plastics Co., Ltd.
    Inventor: Kenzo Teramoto
  • Patent number: 9200154
    Abstract: The present invention provides porous resin particles made of a polymer of a monomer mixture, wherein the monomer mixture contains, as monomers, at least methyl methacrylate and a (meth)acrylic-based cross-linkable monomer, a content of the methyl methacrylate in the monomer mixture is 1 to 50% by weight, a content of the (meth)acrylic-based cross-linkable monomer in the monomer mixture is 50 to 99% by weight, the porous resin particles have a specific surface area of 130 to 180 m2/g, a pore volume of 0.3 to 0.7 ml/g, and an average pore size of 13 to 16 nm, an amount of unreacted methyl methacrylate remaining in the porous resin particles is 20 ppm or less, and the porous resin particles have a thermal decomposition starting temperature of 260° C. or more.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: December 1, 2015
    Assignee: SEKISUI PLASTICS CO., LTD.
    Inventors: Kenzo Teramoto, Junko Hiroi, Masaaki Nakamura
  • Publication number: 20150005437
    Abstract: A resin particle aggregate is the resin particle aggregate formed by aggregating a plurality of resin particles including a polymer of a vinyl monomer, includes 100 parts by mass of the resin particles and 1 to 5 parts by mass of a surfactant. The resin particles are cross-linked by a cross-linkable monomer in an amount of 10 to 50% by mass relative to the total mass of the resin particles, the resin particle aggregate contains an inorganic component in an amount of 0.5% by mass or less, the resin particles have a volume average particle diameter D1, particles contained in a dispersion liquid of the resin particle aggregate in water have a volume average particle diameter D2, and the ratio of D2/D1 is 15 or less.
    Type: Application
    Filed: August 31, 2011
    Publication date: January 1, 2015
    Applicant: Sekisui Plastics Co., Ltd.
    Inventor: Kenzo Teramoto
  • Publication number: 20130266797
    Abstract: The present invention provides porous resin particles made of a polymer of a monomer mixture, wherein the monomer mixture contains, as monomers, at least methyl methacrylate and a (meth)acrylic-based cross-linkable monomer, a content of the methyl methacrylate in the monomer mixture is 1 to 50% by weight, a content of the (meth)acrylic-based cross-linkable monomer in the monomer mixture is 50 to 99% by weight, the porous resin particles have a specific surface area of 130 to 180 m2/g, a pore volume of 0.3 to 0.7 ml/g, and an average pore size of 13 to 16 nm, an amount of unreacted methyl methacrylate remaining in the porous resin particles is 20 ppm or less, and the porous resin particles have a thermal decomposition starting temperature of 260° C. or more.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 10, 2013
    Inventors: Kenzo TERAMOTO, Junko HIROI, Masaaki NAKAMURA