Patents by Inventor Kenzo USAMI

Kenzo USAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260280225
    Abstract: A semiconductor element mounting substrate includes a base formed of a metal, an electrode to be connected to a semiconductor element, and a protective layer disposed between the base and the electrode and formed of a material that is more corrosion resistant than the metal forming the base.
    Type: Application
    Filed: March 21, 2024
    Publication date: September 17, 2026
    Inventors: Kenzo USAMI, Yosuke KONDO, Tatsunori MURASE, Mitsuru NISHIMURA, Yukihiro WATANABE, Isuzu SANO
  • Publication number: 20260282944
    Abstract: A semiconductor element mounting substrate includes a base composed of a metal, an electrode to be connected to a semiconductor element, and an insulating layer disposed between the base and the electrode, in which a maximum height Sz (micrometers) of a base-side surface of the insulating layer specified by ISO 25178 is equal to or less than the thickness of the layer itself.
    Type: Application
    Filed: March 21, 2024
    Publication date: September 17, 2026
    Inventors: Yosuke KONDO, Tatsunori MURASE, Kenzo USAMI, Mitsuru NISHIMURA, Yukihiro WATANABE, Isuzu SANO
  • Publication number: 20260282922
    Abstract: A semiconductor element mounting substrate includes a base formed of a metal, an electrode to be connected to a semiconductor element, and a protective layer disposed between the base and the electrode and formed of a material that is harder than the metal forming the base.
    Type: Application
    Filed: March 21, 2024
    Publication date: September 17, 2026
    Inventors: Yukihiro WATANABE, Tatsunori MURASE, Kenzo USAMI, Yosuke KONDO, Mitsuru NISHIMURA, Isuzu SANO