Abstract: A display panel includes a backlight module including a substrate, a first light source member disposed on a surface of the substrate, a second light source member disposed on the surface of the substrate, and a third light source member disposed on the surface of the substrate, a color converter module disposed on the surface of the substrate and including a color converter layer, the color converter layer including a first pixel area corresponding to the first light source member, a second pixel area corresponding to the second light source member, a third pixel area corresponding to the third light source member, and a quantum dot disposed in at least one of the first pixel area, the second pixel area, and the third pixel area, and a first adhesive layer disposed between the color converter module and the backlight module.

Abstract: A display module includes a thin film transistor (TFT) substrate including a class substrate and a TFT layer provided on a front surface of the glass substrate, the TFT layer including a TFT circuit, a plurality of light emitting diodes provided on the TFT layer, a plurality of first connection pads provided at a distance from each other on the front surface of the glass substrate and connected to the TFT circuit, a plurality of second connection pads provided at a distance from each other on a rear surface of the glass substrate and connected to a second circuit, where the second circuit is configured to supply power and is connected to a control board, and a plurality of side wirings electrically connecting each of the plurality of first connection pads to respective connection pads of the plurality of second connection pads.

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Abstract: A color converter layer is provided. The color converter layer includes a first light blocking member in which a plurality of pixel regions comprising a first pixel region and a second pixel region are disposed to be spaced apart from each other, a first color converter disposed in the first pixel region for converting and emitting incident light into a first color, a second color converter disposed in the second pixel region for converting and emitting the incident light into a second color different from the first color, and a second light blocking member that extends with a preset thickness and is formed on a surface of the first light blocking member, and blocks transmission of the incident light into an adjacent pixel region by partitioning the first pixel region and the second pixel region. The preset thickness may be greater than the thickness of the first light blocking member.

Abstract: Provided is a refrigerator including an inner case, a storage compartment formed inside the inner case, an outer case provided outside the inner case, and a plurality of vacuum insulation modules provided between the inner case and the outer case to insulate the storage compartment, and each of the plurality of vacuum insulation modules includes a vacuum insulator, and a cartridge which accommodates the vacuum insulator and supports the inner case and the outer case. The cartridge has a mutual coupling portion coupled to the cartridge of an adjacent vacuum insulation module. Accordingly, the vacuum insulator can be easily manufactured without an additional support frame or a foaming process, and sufficient strength and coupling force can be secured by using only the vacuum insulator.

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

Abstract: A refrigerator having an improved structure configured to increase the energy efficiency includes a main body provided with an inner case and an outer case, a storage compartment formed inside of the inner case, an insulation material provided between the inner case and the outer case to insulate the storage compartment and a flange having the anisotropy having different heat resistance distribution to insulate the storage compartment, together with the insulation material.

Abstract: A three-dimensional printer and an operating method are provided. The three-dimensional printer includes at least one print head and a stage in which chemical ink injected from the print head may be layered. The three-dimensional printer includes a print head including a head chip injecting the chemical ink, wherein the head chip may include an ink chamber receiving the chemical ink, a heater generating a bubble in the ink chamber by applying heat to the chemical ink of the ink chamber, and a nozzle injecting the chemical ink according to an internal pressure of the ink chamber increased by the generated bubble.

Abstract: An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

Abstract: An electronic device having an antenna element is provided. The electronic device includes a printed circuit board on which a plurality of components are mounted, at least one antenna element mounted on the printed circuit board, an insulating dam formed on the printed circuit board and configured to surround the at least one antenna element, and a dielectric part configured to fill an inside of the insulating dam and to support the at least one antenna element.

Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.