Patents by Inventor Keon Teak Kang

Keon Teak Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system with delamination prevention structure
    Patent number: 8008787
    Abstract: An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: August 30, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: DongSam Park, A Leam Choi, Keon Teak Kang
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DELAMINATION PREVENTION STRUCTURE
    Publication number: 20090072377
    Abstract: An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.
    Type: Application
    Filed: September 18, 2007
    Publication date: March 19, 2009
    Inventors: DongSam Park, A Leam Choi, Keon Teak Kang
  • Stacked integrated circuits package system with dense routability and high thermal conductivity
    Patent number: 7445962
    Abstract: A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: November 4, 2008
    Assignee: Stats Chippac Ltd.
    Inventors: Bongsuk Choi, Jae Han Chung, Keon Teak Kang
  • BUMP FOR OVERHANG DEVICE
    Publication number: 20070001296
    Abstract: A semiconductor package system is provided including forming a support platform, mounting a first device over the support platform, forming a bump on the support platform, and mounting a second device on the first device and the bump.
    Type: Application
    Filed: August 31, 2006
    Publication date: January 4, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Hun Teak Lee, Jong Kook Kim, ChulSik Kim, Ki Youn Jang, Keon Teak Kang, Hyung Jun Jeon
  • STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH DENSE ROUTABILITY AND HIGH THERMAL CONDUCTIVITY
    Publication number: 20060197209
    Abstract: A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.
    Type: Application
    Filed: December 16, 2005
    Publication date: September 7, 2006
    Applicant: STATS CHIPPAC LTD.
    Inventors: Bongsuk Choi, Jae Han Chung, Keon Teak Kang