Abstract: A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path.

Abstract: A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path.

Abstract: A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type(or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path.

Abstract: A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.

Abstract: A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.

Abstract: A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.

Abstract: A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects the Earth's magnetic field to obtain positional information is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns such that the upper and lower first driving patterns are electrically connected to each other, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers to be parallel to each other and patterned in a certain shape, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns electrically connected to the first driving patterns of the first base board to surround magnetic layers and formed with pickup patterns to surround the first and second driving patterns.

Abstract: Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.

Abstract: A weak-magnetic field sensor using printed circuit board manufacturing technique which detects the Earth's magnetic field to obtain positional information, and a method of manufacturing the same is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns and first pickup patterns, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers thereon, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns and second pickup patterns electrically connected to the first driving patterns and the first pickup patterns of the first base board to surround magnetic layers. The magnetic layer, the driving patterns and the pickup patterns provided on the first base board are oriented to be perpendicular to those provided under the first base board.

Abstract: A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.

Abstract: A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pickup coil being placed on the same plane as an external contour of the excitation coil.

Abstract: A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type(or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path.

Abstract: A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.

Abstract: A weak-magnetic field sensor using printed circuit board manufacturing technique which detects the Earth's magnetic field to obtain positional information, and a method of manufacturing the same is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns and first pickup patterns, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers thereon, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns and second pickup patterns electrically connected to the first driving patterns and the first pickup patterns of the first base board to surround magnetic layers. The magnetic layer, the driving patterns and the pickup patterns provided on the first base board are oriented to be perpendicular to those provided under the first base board.

Abstract: A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects the Earth's magnetic field to obtain positional information is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns such that the upper and lower first driving patterns are electrically connected to each other, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers to be parallel to each other and patterned in a certain shape, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns electrically connected to the first driving patterns of the first base board to surround magnetic layers and formed with pickup patterns to surround the first and second driving patterns.

Abstract: Disclosed are a PCB with buried or embedded resistors and a method for manufacturing the same. The PCB comprises: a resinous, electrically insulating substrate; a circuit pattern formed on the substrate; at least a pair of spaced resistor terminations, formed in a certain pattern on the substrate, each comprising a metal pad covered with a conductive protective layer; a thin-film resistor formed between the resistor terminations with electrical connection thereto; and an over-coating layer formed of one-part ink, covering the resistor and the resistor terminations. To be provided with a desired resistance, optionally, the resistor may be grooved by laser trimming. The PCB can have a desired resistor resistance which is uniform without being affected by environmental factors.

Abstract: Disclosed are a method for preparing a high performance BGA board containing a plurality of printed circuit boards in which a conductor circuit, a bonding pad electrically connected to a semiconductor chip, and an inner hole for mounting a semiconductor chip are formed, by primary- and secondary-laminating a plurality of boards. The present invention enjoys advantages in that contamination due to an outer layer surface treatment of the board laminate can be prevented, and a process for preventing a contamination of an inner hole can be omitted, and also a defective proportion can be reduced remarkably in comparison with prior arts by applying a pressure uniformly during a secondary lamination. Furthermore, a BGA board according to the invention has an ideal ball pitch and multi-fins, excellent electrical and thermal properties, also can be applied in the case of high current, and can be easily mounted on a chip.

Abstract: Disclosed are a method for preparing a high performance BGA board containing a plurality of printed circuit boards in which a conductor circuit, a bonding pad electrically connected to a semiconductor chip, and an inner hole for mounting a semiconductor chip are formed, by primary- and secondary-laminating a plurality of boards. The present invention enjoys advantages in that contamination due to an outer layer surface treatment of the board laminate can be prevented, and a process for preventing a contamination of an inner hole can be omitted, and also a defective proportion can be reduced remarkably in comparison with prior arts by applying a pressure uniformly during a secondary lamination. Furthermore, a BGA board according to the invention has an ideal ball pitch and multi-fins, excellent electrical and thermal properties, also can be applied in the case of high current, and can be easily mounted on a chip.

Abstract: Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.

Abstract: A printed circuit board for high speed processing devices such as RAMBUS is disclosed. Adhesive means are interposed between a plurality of both-face copper clad laminates, and each of the adhesive means consists of a clad laminate and prepreg layers formed on both faces of the clad laminate. The sum total of the thicknesses of the clad laminates and the prepreg layers is smaller than that of the conventional printed circuit board. Therefore, when carrying out a pressing to attach the copper foils, the thickness deviations are decreased compared with the conventional case, and therefore, the occurrence of impedance defects can be prevented.