Patents by Inventor Keong Bun Hin

Keong Bun Hin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8058098
    Abstract: A method includes the steps of providing a carrier comprising a plurality of cavities; placing at least one semiconductor element into each of the cavities; filling the plurality of cavities with a packaging material; and removing the carrier.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: November 15, 2011
    Assignee: Infineon Technologies AG
    Inventor: Keong Bun Hin
  • Publication number: 20080224293
    Abstract: A method includes the steps of providing a carrier comprising a plurality of cavities; placing at least one semiconductor element into each of the cavities; filling the plurality of cavities with a packaging material; and removing the carrier.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 18, 2008
    Inventor: Keong Bun Hin