Abstract: This invention relates to a surface mountable light emitting device in which the lead frame is exposed over a substantial portion of the underside of the device so as to allow greater thermal conductivity to any device on which it may be mounted. The LED provides the lens and a molded body to encapsulate the lead frame and an electrical contact in a single molding step while the lead frames and further contacts are arranged in a suitable array. The lens couples the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector atop it that receives light from the transfer section and spreads it spherically. Applications may include, but are not limited to, household light bulbs and car headlights.