Patents by Inventor Keonsoo JANG

Keonsoo JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210358885
    Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
    Type: Application
    Filed: July 28, 2021
    Publication date: November 18, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun-cheol BAE
  • Patent number: 11107790
    Abstract: A laser bonding method includes forming a bonding part including an adhesive layer and a conductive particle disposed within the adhesive layer on a substrate; aligning a bonding target by disposing the bonding target on a surface of the bonding part opposite the substrate; disposing a pressing part on a surface of the bonding target that is opposite to the bonding part and pressing the bonding target onto the bonding part through the pressing part; heating the bonding target by irradiating at least the pressing part with a laser and conducting heat from the pressing part to the bonding target and from the bonding target to the bonding part; and bonding together the bonding part and the bonding target by the heat conducted from the bonding target to the bonding part so that the conductive particle electrically connects the substrate and the bonding target. The pressing part may be removed.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 31, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong Choi, Yong Sung Eom, KeonSoo Jang, Seok-Hwan Moon, Hyun-cheol Bae
  • Publication number: 20200075535
    Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun-cheol BAE
  • Publication number: 20190287870
    Abstract: The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KeonSoo JANG, Yong Sung EOM, KWANG-SEONG CHOI, Seok-Hwan MOON, Hyun-cheol BAE
  • Publication number: 20190211231
    Abstract: Provided are an adhesive film, and a method of fabricating a semiconductor package using the same. The adhesive film includes a thermoplastic resin containing a hydroxyl group, a thermosetting resin, and an anhydride.
    Type: Application
    Filed: December 14, 2018
    Publication date: July 11, 2019
    Inventors: KeonSoo JANG, Yong Sung EOM, Kwang-Seong CHOI, Seok-Hwan MOON, Hyun-cheol BAE
  • Patent number: 9462736
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: October 4, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Sung Eom, Jong Tae Moon, Sangwon Oh, Keonsoo Jang
  • Patent number: 9155236
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: October 6, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Sung Eom, Jong Tae Moon, Sangwon Oh, Keonsoo Jang
  • Publication number: 20140317918
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Application
    Filed: July 8, 2014
    Publication date: October 30, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung EOM, Jong Tae MOON, Sangwon OH, Keonsoo JANG
  • Publication number: 20140317915
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Application
    Filed: July 8, 2014
    Publication date: October 30, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung EOM, Jong Tae MOON, Sangwon OH, Keonsoo JANG
  • Patent number: 8802760
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 12, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung Eom, Jong Tae Moon, Sangwon Oh, Keonsoo Jang
  • Patent number: 8420722
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: April 16, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung Eom, Jong Tae Moon, Sangwon Oh, Keonsoo Jang
  • Publication number: 20100006625
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Application
    Filed: June 2, 2009
    Publication date: January 14, 2010
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Sung EOM, Jong Tae MOON, Sangwon OH, Keonsoo JANG