Abstract: Disclosed is a an economical blood pressure cuff shield that acts as an hygienic barrier between patients and blood pressure cuffs during blood pressure measurement. The shield includes antimicrobial properties, which eradicate microorganisms on contact, protecting the shield from communicated pathogens and preventing the blood pressure cuff from colonization of the common health-care associated microbes. With the antimicrobial properties, the shield can be used for multiple patients over a 24 hour period. After the indicated period of use, the blood pressure cuff shield is removed and discarded. The biodegradable and cost effective construction allows the health care field to stride towards eco-friendly solutions to improve sanitation and sterility of facilities.

Abstract: The Technology described herein applies to medical dressings designed to heal wounds in the area of advanced wound care, inclusive of Negative Pressure Wound Therapy (NPWT), and describes novel wound healing absorbent scaffolds and dressing based on natural and naturally-derived material and fibers, preferentially poly (lactic) acid fibers and alginate materials.

Abstract: Disclosed are boot (and other footwear) dryer insert materials that are to be used to dry out boots without the use of electric or mechanical power. Said boot insert dryer materials utilize a low bioburden, biodegradable and/or compostable moisture absorbing nonwoven structure and one or more antimicrobial and/or antifungal agents that minimize odor by mitigating the spread of odor causing pathogens. The drying process includes the ability of the outer surface of the boot dryer to allow the ingress of moisture absorbed from the boot while at the same time preventing captured moisture to escape back into the boot. Fluid absorbing or superabsorbent, capabilities may be incorporated in the devices of the present invention to control excess fluids. Also disclosed are methods of manufacture of the boot dryer inserts of the present invention.

Abstract: Included are food packaging materials and processes that are useful for commercial products to extend the freshness and preserve the integrity and shelf-life of packaged foods. Said food packaging materials utilize a low bioburden, biodegradable and/or compostable shock absorbing/cushioning nonwoven structure and some form or forms of an antimicrobial and/or antifungal agent consisting of silver or silver-based species that destroy microbes which would otherwise spoil the food. The shelf-life extension process involves silver-based antimicrobial agents that function to mitigate the spread of food spoilage pathogens when they come in contact with the said food packaging materials. Fluid absorbing or superabsorbent, capabilities may be incorporated in the structure to control excess fluids.

Abstract: Disclosed are food packaging materials and processes that are useful for commercial products to extend the freshness and preserve the integrity and shelf-life of packaged foods. Said food packaging materials utilize a low bioburden, biodegradable and/or compostable shock absorbing/cushioning nonwoven structure and some form or forms of an antimicrobial and/or antifungal agent consisting of silver or silver-based species that destroy microbes which would otherwise spoil the food. The shelf-life extension process involves silver-based antimicrobial agents that function to mitigate the spread of food spoilage pathogens when they come in contact with the said food packaging materials. Fluid absorbing or superabsorbent, capabilities may be incorporated in the structure to control excess fluids.

Abstract: A gas injection system for a reflow soldering oven includes a conveyor for moving reflow solder components to the oven from the input to the output through a plurality of heating zones; at least one conduit on one side of the conveyor is adapted for connection to a source of inert gas and a plurality of impingement holes in the conduit proximate at least one of the heating zones blankets the components with inert gas during the solder reflow to reduce the presence of oxygen.

Abstract: A reflow solder convection oven with a passive gas decontamination subsystem. This subsystem includes an intake duct in fluid communication with the gas outtake of a heating zone of the oven, at least one decontamination duct connected on one end to the intake duct, the decontamination duct including a plurality of collision baffles therein for collecting contaminants from the gas in the oven, and an outtake duct connected to the decontamination duct on an end opposite the intake duct and in fluid communication on an opposite end with the gas intake of the heating zone.

Abstract: A reflow solder convection oven with at least one heater element and at least one blower assembly in fluid communication with the heater element. The blower assembly includes a mount structure including at least one intake port and at least two supply ports, a housing connected to the mount structure, a fan wheel, and a motor attached to the fan wheel. The housing has an interior surface defining at least two pressurization zones, and at least two outtake regions, each outtake region proximate a supply port of the mount structure. The periphery of the wheel is positioned in the housing to form dual pressurization zones, the housing defining at least two spline curves along the interior surface thereof, each curve having a starting node proximate a pressurization zone and a terminating node proximate an outtake region.

Abstract: A combination product cooling and flux management apparatus is mounted above a reflow soldering oven. The apparatus has a sealed housing with four openings: an ambient air inlet, an ambient air outlet, a recirculating gas inlet and a recirculating gas outlet. The recirculating gas blower is mounted in a first end of the housing and draws air into the recirculating gas inlet, through a recirculating gas side of a gas-to-gas heat exchanger and out the recirculating gas outlet, where it is recirculated through a product cooling chamber and back into the recirculating gas inlet. The ambient air blower is mounted in a second end of the housing and draws air into the ambient air inlet, through an ambient air side of the gas-to-gas heat exchanger and out the ambient air outlet to the surrounding atmosphere.

Abstract: A combination product cooling and flux management apparatus is mounted above a reflow soldering oven. The apparatus has a sealed housing with four openings: an ambient air inlet, an ambient air outlet, a recirculating gas inlet and a recirculating gas outlet. The recirculating gas blower is mounted in a first end of the housing and draws air into the recirculating gas inlet, through a recirculating gas side of a gas-to-gas heat exchanger and out the recirculating gas outlet, where it is recirculated through a product cooling chamber and back into the recirculating gas inlet. The ambient air blower is mounted in a second end of the housing and draws air into the ambient air inlet, through an ambient air side of the gas-to-gas heat exchanger and out the ambient air outlet to the surrounding atmosphere.