Abstract: According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.

Abstract: According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.

Abstract: According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Abstract: According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Abstract: A self-contained cooling system for a phased array antenna includes a cooling structure, a heat exchanger, and a pump for circulating a fluid coolant around a coolant loop. The cooling system receives power from a remote power source. The cooling structure includes a plurality of coolant inlet pipes, a plurality of coolant outlet pipes, and a plurality of cooling platforms. Each of the cooling platforms has a coolant channel that begins at one of the plurality of coolant inlet pipes, terminates at one of the plurality of coolant outlet pipes, and provides a flow path for a fluid coolant. The cooling structure further includes at least one base plate releasably mounted to at least one of the plurality of cooling platforms. One or more antenna elements associated with the phased array antenna are mounted on the base plate releasably mounted to at least one of the plurality of cooling platforms.

Abstract: According to one embodiment of the disclosure, a cooling system for a heat generating structure comprises a first cooling segment and a second cooling segment. The first cooling segment and the second cooling segment each respectively comprise a cooling segment conduit and at least one cooling segment tube. The cooling segment conduits are operable to receive a fluid coolant and dispense of the fluid coolant after the fluid coolant has received thermal energy. The at least one cooling segment tubes are in thermal communication with both the cooling segment conduits and the heat generating structure. The at least one cooling segment tubes have a cooling fluid operable to transfer thermal energy from the heat generating structure to the cooling segment conduits. The cooling segment conduits transfer thermal energy from the cooling fluid to the fluid coolant. A heat transfer rate associated with the first cooling segment is substantially similar to a heat transfer rate associated with the second cooling segment.

Abstract: According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Abstract: According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.

Abstract: According to one embodiment of the disclosure, a cooling system for a heat generating structure comprises a first cooling segment and a second cooling segment. The first cooling segment and the second cooling segment each respectively comprise a cooling segment conduit and at least one cooling segment tube. The cooling segment conduits are operable to receive a fluid coolant and dispense of the fluid coolant after the fluid coolant has received thermal energy. The at least one cooling segment tubes are in thermal communication with both the cooling segment conduits and the heat generating structure. The at least one cooling segment tubes have a cooling fluid operable to transfer thermal energy from the heat generating structure to the cooling segment conduits. The cooling segment conduits transfer thermal energy from the cooling fluid to the fluid coolant. A heat transfer rate associated with the first cooling segment is substantially similar to a heat transfer rate associated with the second cooling segment.

Abstract: According to one embodiment, a cooling system for a heat-generating structure includes a first cooling loop that directs a flow of a first fluid coolant from a heat-generating structure to a first heat exchanger. The system also includes a second cooling loop that directs a flow of a second fluid coolant from the first heat exchanger to a second heat exchanger. The first heat exchanger receives thermal energy from the first fluid coolant and transfers at least a portion of the thermal energy to the second fluid coolant. The first fluid coolant has a specific heat and a mass flow rate, and the second fluid coolant has a specific heat and a mass flow rate. A product of the specific heat and the mass flow rate of the first fluid coolant is greater than a product of the specific heat and the mass flow rate of the second fluid coolant.

Abstract: A self-contained cooling system for a phased array antenna includes a cooling structure, a heat exchanger, and a pump for circulating a fluid coolant around a coolant loop. The cooling system receives power from a remote power source. The cooling structure includes a plurality of coolant inlet pipes, a plurality of coolant outlet pipes, and a plurality of cooling platforms. Each of the cooling platforms has a coolant channel that begins at one of the plurality of coolant inlet pipes, terminates at one of the plurality of coolant outlet pipes, and provides a flow path for a fluid coolant. The cooling structure further includes at least one base plate releasably mounted to at least one of the plurality of cooling platforms. One or more antenna elements associated with the phased array antenna are mounted on the base plate releasably mounted to at least one of the plurality of cooling platforms.

Abstract: According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.

Abstract: According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Abstract: According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.

Abstract: According to one embodiment of the invention, a cooling system for a heat-generating structure that is disposed in an environment having an ambient pressure comprises a fluid coolant and three structures. The first structure allows the heat generating structure to removably couple to the cooling system. The second structure reduces a pressure of the fluid coolant to a subambient pressure at which the fluid coolant has a boiling temperature less than a temperature of the heat-generating structure. The third structure directs a flow of the fluid coolant in the form of a liquid at the subambient pressure in a manner causing the fluid coolant to be brought into thermal communication with the heat-generating structure where heat from the heat-generating structure causes the fluid coolant in the form of the liquid to boil and vaporize so that the fluid coolant absorbs heat from the heat-generating structure as the fluid coolant changes state.

Abstract: According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a channel having an inlet and an exit and a plurality of pin fins extending at least partially across the channel. The inlet is operable to receive a fluid coolant into the channel substantially in the form of a liquid. The exit is operable to dispense of the fluid coolant out of the channel at least partially in the form of a vapor. The plurality of pin fins are operable to receive thermal energy from the heat generating structure and transfer at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and vaporize in the channel upon contact with the plurality of pin fins.

Abstract: According to one embodiment of the invention a method for controlling cooling of a heat-generating structure disposed in an environment having an ambient pressure includes providing a fluid coolant and reducing the pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure. The method further includes boiling and vaporizing coolant to absorb heat from the heat-generating structure by bringing the coolant into thermal communication with the heat generating structure. The method also includes measuring a parameter indicative of a pressure of the coolant and adjusting the pressure of the coolant in response to control the cooling of the heat-generating structure.

Abstract: A heat sink which comprises an enclosure having a highly thermally conductive surface region and defining an enclosed cavity. A porous, highly thermally conductive material is disposed in the cavity, preferably homogeneously therein, and is thermally coupled to the thermally conductive surface. A phase change material changing from its initial phase, generally solid, to its final phase, generally liquid, responsive to the absorption of heat is disposed in the enclosed cavity and in the porous material. In accordance with a first embodiment, the highly thermally conductive surface region is preferably aluminum and the porous medium is a highly thermally conductive porous medium, preferably aluminum. In accordance with a second embodiment, the thermally conductive surface is composed of highly thermally conductive fibers disposed in a matrix and the porous material is a plurality of the thermally conductive fibers extending from the thermally conductive surface into the cavity.

Abstract: A heat-conducting device for conducting heat between a circuit board and an airframe of a missile includes a thermal plane onto which the circuit board is mounted, and a pair of feet that partially protrude from the slots in the thermal plane. Slot-engaging portions of the feet freely float within the slots, allowing repositioning of the feet in two dimensions relative to the slots. Resilient devices such as springs urge outer portions of the feet into contact with the airframe. Locking mechanisms may prevent extension of the feet until after the heat-conducting device is installed in the missile. The feet self-align into contact with the airframe, automatically adjusting to compensate for misalignment and/or warping.