Patents by Inventor Kerrin DOESSEL
Kerrin DOESSEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11940618Abstract: A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.Type: GrantFiled: August 20, 2019Date of Patent: March 26, 2024Assignee: ROBERT BOSCH GMBHInventors: Alexander Eberspaecher, Frank Schatz, Janine Riedrich-Moeller, Joerg Muchow, Josip Mihaljevic, Kerrin Doessel, Ralf Boessendoerfer, Timo Schary
-
Patent number: 11912565Abstract: A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.Type: GrantFiled: December 17, 2019Date of Patent: February 27, 2024Assignee: ROBERT BOSCH GMBHInventors: Christoph Hermes, Kerrin Doessel, Thomas Friedrich
-
Patent number: 11840445Abstract: A MEMS sensor including a diaphragm, a base surface area of the diaphragm being delimited with the aid of a peripheral wall structure, and the base surface area including at least two subareas, of which at least one of the subareas is deflectably situated, and the at least two subareas being separated from one another with the aid of at least one separating structure or being delimited by the latter. The separating structure includes at least one fluid through-opening for the passage of fluid.Type: GrantFiled: December 17, 2019Date of Patent: December 12, 2023Assignee: ROBERT BOSCH GMBHInventors: Christoph Hermes, Kerrin Doessel, Thomas Friedrich
-
Patent number: 11733068Abstract: A method for operating a capacitive device. The method includes providing a pulsed readout signal having a pulse frequency at a readout signal channel, to which at least one capacitor unit of the capacitive device is electrically connected, and reading out the at least one capacitor unit of the capacitive device, which has a natural frequency with a natural frequency period duration tres, using the pulsed readout signal. Each voltage pulse of the pulsed readout signal is applied to the readout signal channel in n temporally offset voltage stages, n being a natural number greater than or equal to 2, and a time offset ?ti is maintained between each two consecutively applied voltage stages in such a way that the following is true for at least one time offset ?ti between the voltage stages: ? ? t i = m * t res + t res n , m being a natural number greater than or equal to zero.Type: GrantFiled: January 20, 2020Date of Patent: August 22, 2023Assignee: ROBERT BOSCH GMBHInventors: Christoph Schelling, Kerrin Doessel
-
Publication number: 20230152572Abstract: A micromechanical device, in particular a micromirror device. The device has at least one first micromechanical component and one second micromechanical component. The first component and the second component are directly or indirectly joined to one another. The first micromechanical component has a first sub-body and at least one second sub-body. The first sub-body extends in a first plane and the second sub-body in a second plane different from the first plane. The first plane and the second plane extend parallel to one another and the first plane extends above the second plane. The second sub-body is arranged in a transitional region to the second micromechanical component. A second extent of the second sub-body in the longitudinal direction is greater than a first extent of the first sub-body in the longitudinal direction.Type: ApplicationFiled: May 28, 2021Publication date: May 18, 2023Inventors: Frank Schatz, Jochen Tomaschko, Kerrin Doessel, Timo Schary
-
Publication number: 20220041428Abstract: A MEMS sensor including a diaphragm, a base surface area of the diaphragm being delimited with the aid of a peripheral wall structure, and the base surface area including at least two subareas, of which at least one of the subareas is deflectably situated, and the at least two subareas being separated from one another with the aid of at least one separating structure or being delimited by the latter. The separating structure includes at least one fluid through-opening for the passage of fluid.Type: ApplicationFiled: December 17, 2019Publication date: February 10, 2022Inventors: Christoph Hermes, Kerrin Doessel, Thomas Friedrich
-
Publication number: 20210381850Abstract: A method for operating a capacitive device. The method includes providing a pulsed readout signal having a pulse frequency at a readout signal channel, to which at least one capacitor unit of the capacitive device is electrically connected, and reading out the at least one capacitor unit of the capacitive device, which has a natural frequency with a natural frequency period duration tres, using the pulsed readout signal. Each voltage pulse of the pulsed readout signal is applied to the readout signal channel in n temporally offset voltage stages, n being a natural number greater than or equal to 2, and a time offset ?ti is maintained between each two consecutively applied voltage stages in such a way that the following is true for at least one time offset ?ti between the voltage stages: ? ? ? t i = m * t res + t res n , m being a natural number greater than or equal to zero.Type: ApplicationFiled: January 20, 2020Publication date: December 9, 2021Inventors: Christoph Schelling, Kerrin Doessel
-
Publication number: 20210354981Abstract: A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.Type: ApplicationFiled: December 17, 2019Publication date: November 18, 2021Inventors: Christoph Hermes, Kerrin Doessel, Thomas Friedrich
-
Publication number: 20210271073Abstract: A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.Type: ApplicationFiled: August 20, 2019Publication date: September 2, 2021Inventors: Alexander Eberspaecher, Frank Schatz, Janine Riedrich-Moeller, Joerg Muchow, Josip Mihaljevic, Kerrin Doessel, Ralf Boessendoerfer, Timo Schary
-
Patent number: 10868231Abstract: A micromechanical component having at least one electromechanical flexible structure, each of which includes a first piezoelectric layer, a first outer electrode situated on a first side of the first piezoelectric layer, a first intermediate electrode situated on a second side, oriented away from the first side, of the first piezoelectric layer, a second piezoelectric layer situated on a side of the first intermediate electrode oriented away from the first piezoelectric layer, and a second outer electrode situated on a side of the second piezoelectric layer oriented away from the first intermediate electrode, the at least one electromechanical flexible structure having in each case a second intermediate electrode that is situated on the side of the first intermediate electrode oriented away from the first piezoelectric layer, between the second piezoelectric layer and the first intermediate electrode.Type: GrantFiled: August 1, 2017Date of Patent: December 15, 2020Assignee: Robert Bosch GmbHInventors: Thomas Buck, Fabian Purki, Kerrin Doessel
-
Patent number: 10547951Abstract: A micromechanical sound transducer system includes a substrate that includes (a) a cavity with a cavity edge area, (b) a front side, and (c) a rear side; a piezoelectric vibrating beam that is elastically suspended on the front side and that extends across the cavity; and, for the piezoelectric vibrating beam, a respective deflection limiting device that is on a front edge area of the respective vibrating beam and that is configured to limit a deflection of the respective vibrating beam to a limiting deflection by causing the respective front edge area of the respective vibrating beam to interact with the cavity edge area or an opposing front edge area of another vibrating beam.Type: GrantFiled: January 4, 2018Date of Patent: January 28, 2020Assignee: Robert Bosch GmbHInventors: Ahmad Mansour, Daniel Pantel, Fabian Purkl, Kerrin Doessel, Thomas Buck, Thomas Northemann
-
Patent number: 10389394Abstract: A method for processing a signal includes reading in a signal and filtering the signal using a first number of band-pass filters in order to obtain one band-pass filtered signal per band-pass filter. The first number of band-pass filters is configured to each allow distinct frequency ranges of the signal to pass. The method further includes calculating at least one signal parameter each from the plurality of band-pass filtered signals. The method further includes performing analog-to-digital conversion of the plurality of band-pass filtered signals or signals derived therefrom using a plurality of signal parameters such that a second number of analog-to-digital converters used to perform the analog-to-digital conversion is less than the first number of band-pass filters used to filter the signal.Type: GrantFiled: July 20, 2018Date of Patent: August 20, 2019Assignee: Robert Bosch GmbHInventors: Ahmad Mansour, Kerrin Doessel, Stefan Leidich
-
Publication number: 20190028130Abstract: A method for processing a signal includes reading in a signal and filtering the signal using a first number of band-pass filters in order to obtain one band-pass filtered signal per band-pass filter. The first number of band-pass filters is configured to each allow distinct frequency ranges of the signal to pass. The method further includes calculating at least one signal parameter each from the plurality of band-pass filtered signals. The method further includes performing analog-to-digital conversion of the plurality of band-pass filtered signals or signals derived therefrom using a plurality of signal parameters such that a second number of analog-to-digital converters used to perform the analog-to-digital conversion is less than the first number of band-pass filters used to filter the signal.Type: ApplicationFiled: July 20, 2018Publication date: January 24, 2019Inventors: Ahmad Mansour, Kerrin Doessel, Stefan Leidich
-
Publication number: 20180192204Abstract: A micromechanical sound transducer system includes a substrate that includes (a) a cavity with a cavity edge area, (b) a front side, and (c) a rear side; a piezoelectric vibrating beam that is elastically suspended on the front side and that extends across the cavity; and, for the piezoelectric vibrating beam, a respective deflection limiting device that is on a front edge area of the respective vibrating beam and that is configured to limit a deflection of the respective vibrating beam to a limiting deflection by causing the respective front edge area of the respective vibrating beam to interact with the cavity edge area or an opposing front edge area of another vibrating beam.Type: ApplicationFiled: January 4, 2018Publication date: July 5, 2018Inventors: Ahmad Mansour, Daniel Pantel, Fabian Purkl, Kerrin Doessel, Thomas Buck, Thomas Northemann
-
Patent number: 10012828Abstract: An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.Type: GrantFiled: April 27, 2015Date of Patent: July 3, 2018Assignee: Robert Bosch GmbHInventors: Frank Schatz, Friedjof Heuck, Kerrin Doessel, Stefan Pinter, Daniel Pantel, Franziska Rohlfing
-
Publication number: 20180062067Abstract: A micromechanical component having at least one electromechanical flexible structure, each of which includes a first piezoelectric layer, a first outer electrode situated on a first side of the first piezoelectric layer, a first intermediate electrode situated on a second side, oriented away from the first side, of the first piezoelectric layer, a second piezoelectric layer situated on a side of the first intermediate electrode oriented away from the first piezoelectric layer, and a second outer electrode situated on a side of the second piezoelectric layer oriented away from the first intermediate electrode, the at least one electromechanical flexible structure having in each case a second intermediate electrode that is situated on the side of the first intermediate electrode oriented away from the first piezoelectric layer, between the second piezoelectric layer and the first intermediate electrode.Type: ApplicationFiled: August 1, 2017Publication date: March 1, 2018Inventors: Thomas Buck, Fabian Purkl, Kerrin Doessel
-
Patent number: 9885866Abstract: A mirror system including a mirror that is mounted in a manner that permits oscillation, having a coil and at least one first spring that intercouples the mirror and the coil in a way that allows the coil to be placed as a counterweight to the oscillating mirror. Also a corresponding projection device.Type: GrantFiled: January 21, 2015Date of Patent: February 6, 2018Assignee: ROBERT BOSCH GMBHInventors: Rainer Straub, Kerrin Doessel, Johannes Baader, Frederic Njikam Njimonzie, Joerg Muchow, Frank Schatz, Helmut Grutzeck, Simon Armbruster, Zoltan Lestyan, Stefan Leidich, Jochen Franz
-
Publication number: 20170352795Abstract: A sensor and/or transducer device having at least one bending structure including at least one piezoelectric layer in each case, using which an intermediate volume between at least two electrodes of the bending structure is at least partially filled in each case, the sensor and/or transducer device including an electronic unit, which is designed to apply at least one predefined or established actuator voltage between two of the electrodes at a time of the bending structure in such a way that a deformation of the bending structure triggered by an intrinsic stress gradient in the bending structure may be at least partially compensated for. A method for operating a sensor and/or transducer device having at least one bending structure, which includes at least one piezoelectric layer, and a method for calibrating a microphone having at least one bending structure, which includes at least one piezoelectric layer, are also described.Type: ApplicationFiled: May 15, 2017Publication date: December 7, 2017Inventors: Fabian Purkl, Kerrin Doessel, Thomas Buck
-
Publication number: 20170332176Abstract: A micromechanical component having a substrate which includes a micro-electromechanical microphone structure, the micro-electromechanical microphone structure encompassing at least one piezoelectric layer and at least one polymer mass as at least part of a packaging of the substrate fitted with the micro-electromechanical microphone structure, which is in contact with at least a partial outer surface of the substrate fitted with the micro-electromechanical microphone structure. A method is also described for packaging a substrate having a micro-electromechanical microphone structure encompassing at least one piezoelectric layer by developing at least a portion of a packaging of the substrate fitted with the micro-electromechanical microphone structure from at least one polymer mass, and the at least one polymer mass being applied directly on at least a partial outer surface of the substrate fitted with the micro-electromechanical microphone structure.Type: ApplicationFiled: May 3, 2017Publication date: November 16, 2017Inventors: Daniel Pantel, Fabian Purkl, Kerrin Doessel
-
Publication number: 20170052364Abstract: An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.Type: ApplicationFiled: April 27, 2015Publication date: February 23, 2017Applicant: Robert Bosch GmbHInventors: Frank Schatz, Friedjof Heuck, Kerrin Doessel, Stefan Pinter, Daniel Pantel, Franziska Rohlfing