Patents by Inventor Kerry L. Davison

Kerry L. Davison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package with improved ESD protection for no-connect pins
    Patent number: 6476472
    Abstract: An integrated circuit (IC) package includes an IC having at least one ESD protection circuit that provides protection against electrostatic discharge. The IC has a plurality of bond pads that are not coupled to the ESD protection circuit. The IC is connected to a substrate. The substrate has a first plurality of conductive traces, which are connected to respective bond pads of the IC, and a second plurality of conductive traces, which are not connected to any of the plurality of bond pads of the IC. Either the substrate or the IC has a common conductive trace that is connected to the ESD protection circuit. Each of the second plurality of conductive traces is connected to the common conductive trace.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: November 5, 2002
    Assignee: Agere Systems Inc.
    Inventors: Kerry L. Davison, Donald E. Hawk, Jr., Yehuda Smooha
  • Method for tape automated bonding
    Patent number: 5080279
    Abstract: Solder tape automated bonding of leads to an integrated circuit chip is performed using a constant temperature, flat faced thermode and a clamping plate to keep the leads in contact with the integrated circuit chip.
    Type: Grant
    Filed: June 27, 1990
    Date of Patent: January 14, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: Kerry L. Davison