Abstract: An improved heat sink is disclosed in which a plurality of heat conducting fins extends form a base of heat conductive material. The top surface of the base is peaked to reduce the dead space that would otherwise occur during vertical impingement air flow. In the preferred embodiment, the top surface is pyramidal in shape with the peak at the center. In other embodiments, the top surface can be convex or concave and have the peak located off center. Also, webs of material can be left at the bottom of the cooling fins to provide channels for improved air flow.

Abstract: A heat sink is disclosed for cooling a module having a plurality of chip sites thereon. The heat sink includes a frame member which is made of a material having a coefficient of thermal expansion which is substantially that of the substrate to which it is bonded. The frame has a plurality of fins disposed around the perimeter and a support surface disposed inside the perimeter fins. An insert member made of a high thermal conductivity material rests on the support surface. The insert member has a plurality of fins disposed on one side thereof and a plurality of projections on the other side. Forced air flowing around the fins provides a mechanism for rapidly removing heat therefrom. Each of the projections is disposed above a chip site and extends almost into contact with the upper surface of a chip mounted on the module substrate. A thermal paste is used to transfer heat directly from the chip to the insert member hence a mechanism is provided for rapidly removing heat developed in each chip of the module.